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MEMS : a practical guide to design, analysis, and applications / / edited by Jan G. Korvink and Oliver Paul
| MEMS : a practical guide to design, analysis, and applications / / edited by Jan G. Korvink and Oliver Paul |
| Pubbl/distr/stampa | Norwich, NY, : W. Andrew Pub. |
| Descrizione fisica | 1 online resource (993 p.) |
| Disciplina | 621 |
| Altri autori (Persone) |
KorvinkJ. G (Jan G.)
PaulOliver |
| Soggetto topico | Microelectromechanical systems |
| ISBN |
9786612253058
1-59124-988-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; MEMS: A Practical Guide to Design, Analysis, and Applications; Copyright Page; Contents; Foreword; Preface; Chapter 1. Microtransducer Operation; 1.1 Introduction; 1.2 Transduction; 1.3 Microsystem Performance; 1.4 Transducer Operation Techniques; 1.5 Powering Microsystems; References; Chapter 2. Material Properties: Measurement and Data; 2.1 Introduction; 2.2 Measurement Methods; 2.3 Data; References; Chapter 3. MEMS and NEMS Simulation; 3.1 Introduction; 3.2 Simulation Scenario; 3.3 Generic Organization of a Computational Tool; 3.4 Methods for Materials Simulation
3.5 Computational Methods that Solve PDEs3.6 Design Automation Methods; 3.7 A Simulation Strategy; 3.8 Case Studies; 3.9 Summary; 3.10 Acknowledgments; References; Chapter 4. System-Level Simulation of Microsystems; 4.1 Introduction; 4.2 Behavioral Modeling of MEMS Components; 4.3 Formulation of Equations of Motion; 4.4 Structured Design Tools; 4.5 Conclusions; References; Chapter 5. Thermal-Based Microsensors; 5.1 Introduction; 5.2 Thermoresistors; 5.3 Silicon Diodes and Transistors as Thermal Microsensors; 5.4 Thermoelectric Microsensors 5.5 CMOS-Compatible Thermal-Based Microsensors and Microactuators5.6 Diagnostic Thermal-Based Microstructures; 5.7 Conclusion; References; Chapter 6. Photon Detectors; 6.1 Introduction; 6.2 Detectors; 6.3 Thin-Film Transistors; 6.4 Pixel Integration; 6.5 Imaging Arrays; 6.6 New Challenges in Large-Area Digital Imaging; References; Chapter 7. Free-Space Optical MEMS; 7.1 Introduction; 7.2 General Discussion of Micromirror Scanners; 7.3 Electrostatic Scanners; 7.4 Scanning Mirrors with Magnetic and Electromagnetic Actuators; 7.5 Micromirror Arrays with Mirror Size =100 Micrometers 9.5 Magnetoresistors9.6 Magnetodiodes; 9.7 Magnetotransistors and Related Microsensors; 9.8 Magnetic Field-based Functional Multisensors; 9.9 Interfaces and Improvement of Characteristics of Magnetic Microsensors; 9.10 Conclusions and Outlook; References; Chapter 10. Mechanical Microsensors; 10.1 Introduction; 10.2 Inertial Sensors; 10.3 Pressure Sensors; 10.4 Force and Torque Sensors; References; Chapter 11. Semiconductor-Based Chemical Microsensors; 11.1 Introduction; 11.2 Thermodynamics of Chemical Sensing; 11.3 Chemomechanical Sensors; 11.4 Thermal Sensors; 11.5 Optical Sensors 11.6 Electrochemical Sensors |
| Record Nr. | UNINA-9911006981703321 |
| Norwich, NY, : W. Andrew Pub. | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Microsystem technology / / W. Menz, J. Mohr, and O. Paul
| Microsystem technology / / W. Menz, J. Mohr, and O. Paul |
| Autore | Menz W (Wolfgang) |
| Pubbl/distr/stampa | Weinheim, Germany ; ; New York, New York : , : Wiley-VCH, , [2001] |
| Descrizione fisica | 1 online resource (515 p.) |
| Disciplina | 621.381 |
| Soggetto topico | Microelectronics |
| ISBN |
1-281-76403-5
9786611764036 3-527-61300-5 3-527-61301-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Microsystern Technology; Content; 1 General Introduction to Microstructure Technology; 1.1 What is Microstructure Technology?; 1.2 From Microstructure Technology to Microsystems Technology; 2 The Parallels to Microelectronics; 2.1 The Production of Single Crystal Wafers; 2.1.1 Production of Silicon-Single Crystals; 2.1.2 Production of GaAs Single Crystals; 2.2 Basic Technical Processes; 2.2.1 Film Deposition; 2.2.2 Lithography (Film Patterning); 2.2.3 Surface Modification; 2.2.4 Etching (Film Removal); 2.3 Packaging Technology; 2.3.1 Requirements for Packaging Technology
2.3.2 Hybrid Technology2.4 Clean Room Techniques; 3 The Physical and Chemical Basics in Microtechnology; 3.1 Crystals and Crystallography; 3.1.1 Lattice and Types of Lattices; 3.1.2 Stereographic Projection; 3.1.3 The Silicon Single Crystal; 3.1.4 Reciprocal Lattice and the Analysis of the Crystal Structure; 3.2 Methods to Determine the Crystalline Structure; 3.2.1 X-ray Diffraction; 3.2.2 Electron Beam Diffraction; 3.3 Basic Concepts of Electroplating; 3.3.1 The Electrode-Electrolyte Interface; 3.3.2 Polarization and Overpotential; 3.3.3 Mechanisms of Cathodic Metal Deposition 3.4 Materials of Microsystems Technology4 Basic Technologies in MEMS; 4.1 Basic Principles of Vacuum Technology; 4.1.1 The Mean Free Path; 4.1.2 The Monolayer Time; 4.1.3 Velocity of Atoms and Molecules; 4.1.4 Gas Dynamics; 4.1.5 The Classification of Technical Vacuums; 4.2 Vacuum Production; 4.2.1 Pumps for Rough- and Fine Vacuums; 4.2.2 High Vacuum- and Ultrahigh Vacuum Pumps; 4.3 Vacuum Measurement; 4.3.1 Pressure Transducer; 4.3.2 Thermal Conductivity Vacuum Gauge; 4.3.3 Friction Type Vacuum Gauge; 4.3.4 Thermionic Ionization Vacuum Gauge 4.3.5 Cold Cathode Ionization Gauge (Penning Principle)4.3.6 Leakage and Leak Detection; 4.4 Properties of Thin Films; 4.4.1 Structure Zone Model; 4.4.2 Adhesive Strength of the Layer; 4.5 Physical and Chemical Coating Techniques; 4.5.1 Evaporation; 4.5.2 Sputtering; 4.5.3 Ion Plating or Plasma Assisted Deposition; 4.5.4 Ion Cluster Beam Technology; 4.5.5 CVD Processes; 4.5.6 Epitaxy; 4.5.7 Plasma Polymerization; 4.5.8 Oxidation; 4.6 Structuring of Thin Films with Dry Etch Processes; 4.6.1 Physical Etch Technologies; 4.6.2 Combined Physical and Chemical Etch Technologies 4.6.3 Chemical Etching Technologies4.7 Analysis of Thin Films and Surfaces; 4.7.1 Electron Probe Microanalysis (EPM); 4.7.2 Auger Electron Spectroscopy (AES); 4.7.3 X-Ray Photoelectron Spectroscopy (XPS); 4.7.4 Secondary Ion Mass Spectroscopy (SIMS); 4.7.5 Secondary Neutral Particle Mass Spectroscopy (SNMS); 4.7.6 Ion Scattering Spectroscopy (ISS); 4.7.7 Rutherford Back Scattering Spectroscopy (RBS); 4.7.8 Scanning Tunneling Microscope; 5 Lithography; 5.1 Overview and History; 5.2 Resists; 5.3 Process of Lithography; 5.4 Computer Aided Design (CAD); 5.4.1 CAD-Layout 5.4.2 Alignment Patterns and Test Structures |
| Record Nr. | UNINA-9910829927203321 |
Menz W (Wolfgang)
|
||
| Weinheim, Germany ; ; New York, New York : , : Wiley-VCH, , [2001] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Microsystem Technology [[electronic resource]]
| Microsystem Technology [[electronic resource]] |
| Autore | Mohr Jorgen |
| Pubbl/distr/stampa | Hoboken, : Wiley, 2008 |
| Descrizione fisica | 1 online resource (515 p.) |
| Disciplina | 621 |
| Altri autori (Persone) |
MenzWolfgang
PaulOliver |
| Soggetto topico |
Microelectromechanical systems
Microelectronics Micromechanics Miniature electronic equipment System design Systems engineering Materials Science Chemical & Materials Engineering Engineering & Applied Sciences |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-281-76403-5
9786611764036 3-527-61300-5 3-527-61301-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Microsystern Technology; Content; 1 General Introduction to Microstructure Technology; 1.1 What is Microstructure Technology?; 1.2 From Microstructure Technology to Microsystems Technology; 2 The Parallels to Microelectronics; 2.1 The Production of Single Crystal Wafers; 2.1.1 Production of Silicon-Single Crystals; 2.1.2 Production of GaAs Single Crystals; 2.2 Basic Technical Processes; 2.2.1 Film Deposition; 2.2.2 Lithography (Film Patterning); 2.2.3 Surface Modification; 2.2.4 Etching (Film Removal); 2.3 Packaging Technology; 2.3.1 Requirements for Packaging Technology
2.3.2 Hybrid Technology2.4 Clean Room Techniques; 3 The Physical and Chemical Basics in Microtechnology; 3.1 Crystals and Crystallography; 3.1.1 Lattice and Types of Lattices; 3.1.2 Stereographic Projection; 3.1.3 The Silicon Single Crystal; 3.1.4 Reciprocal Lattice and the Analysis of the Crystal Structure; 3.2 Methods to Determine the Crystalline Structure; 3.2.1 X-ray Diffraction; 3.2.2 Electron Beam Diffraction; 3.3 Basic Concepts of Electroplating; 3.3.1 The Electrode-Electrolyte Interface; 3.3.2 Polarization and Overpotential; 3.3.3 Mechanisms of Cathodic Metal Deposition 3.4 Materials of Microsystems Technology4 Basic Technologies in MEMS; 4.1 Basic Principles of Vacuum Technology; 4.1.1 The Mean Free Path; 4.1.2 The Monolayer Time; 4.1.3 Velocity of Atoms and Molecules; 4.1.4 Gas Dynamics; 4.1.5 The Classification of Technical Vacuums; 4.2 Vacuum Production; 4.2.1 Pumps for Rough- and Fine Vacuums; 4.2.2 High Vacuum- and Ultrahigh Vacuum Pumps; 4.3 Vacuum Measurement; 4.3.1 Pressure Transducer; 4.3.2 Thermal Conductivity Vacuum Gauge; 4.3.3 Friction Type Vacuum Gauge; 4.3.4 Thermionic Ionization Vacuum Gauge 4.3.5 Cold Cathode Ionization Gauge (Penning Principle)4.3.6 Leakage and Leak Detection; 4.4 Properties of Thin Films; 4.4.1 Structure Zone Model; 4.4.2 Adhesive Strength of the Layer; 4.5 Physical and Chemical Coating Techniques; 4.5.1 Evaporation; 4.5.2 Sputtering; 4.5.3 Ion Plating or Plasma Assisted Deposition; 4.5.4 Ion Cluster Beam Technology; 4.5.5 CVD Processes; 4.5.6 Epitaxy; 4.5.7 Plasma Polymerization; 4.5.8 Oxidation; 4.6 Structuring of Thin Films with Dry Etch Processes; 4.6.1 Physical Etch Technologies; 4.6.2 Combined Physical and Chemical Etch Technologies 4.6.3 Chemical Etching Technologies4.7 Analysis of Thin Films and Surfaces; 4.7.1 Electron Probe Microanalysis (EPM); 4.7.2 Auger Electron Spectroscopy (AES); 4.7.3 X-Ray Photoelectron Spectroscopy (XPS); 4.7.4 Secondary Ion Mass Spectroscopy (SIMS); 4.7.5 Secondary Neutral Particle Mass Spectroscopy (SNMS); 4.7.6 Ion Scattering Spectroscopy (ISS); 4.7.7 Rutherford Back Scattering Spectroscopy (RBS); 4.7.8 Scanning Tunneling Microscope; 5 Lithography; 5.1 Overview and History; 5.2 Resists; 5.3 Process of Lithography; 5.4 Computer Aided Design (CAD); 5.4.1 CAD-Layout 5.4.2 Alignment Patterns and Test Structures |
| Record Nr. | UNINA-9910144716203321 |
|
Mohr Jorgen
|
||
| Hoboken, : Wiley, 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Möglichkeiten und Herausforderungen der phasen- und disziplinübergreifenden Zusammenarbeit in der Lehrkräftebildung / / Bianka Kaufmann, Anika Denninger, Martin Reinert, Lea Steinfeld, Claudia von Aufschnaiter, Ilka Benner, Steffen Brand, Edith Braun, Stephanie Brombach, Anika Denninger, Angelina Feustel, Sophie Galeski, Tahnee Herzig, Jan-Hendrik Hinzke, Gabriele Hüllstrunk, Anna Kalkofen, Samuel Karbe, Bianka Kaufmann, Annette Kerkemeyer, Tabea Knobbe, Katharina Nesseler, Oliver Paul, Stephanie Reeg, Martin Reinert, Patrick Röder, Martina Sander, Christof Schreiber, Nadine Schönwolf, Ludwig Stecher, Lea Steinfeld, Steffi Thomas, Michaela Timberlake, Salomé Vogel, Leonie Weber, Malte Werner, Jochen Wissinger
| Möglichkeiten und Herausforderungen der phasen- und disziplinübergreifenden Zusammenarbeit in der Lehrkräftebildung / / Bianka Kaufmann, Anika Denninger, Martin Reinert, Lea Steinfeld, Claudia von Aufschnaiter, Ilka Benner, Steffen Brand, Edith Braun, Stephanie Brombach, Anika Denninger, Angelina Feustel, Sophie Galeski, Tahnee Herzig, Jan-Hendrik Hinzke, Gabriele Hüllstrunk, Anna Kalkofen, Samuel Karbe, Bianka Kaufmann, Annette Kerkemeyer, Tabea Knobbe, Katharina Nesseler, Oliver Paul, Stephanie Reeg, Martin Reinert, Patrick Röder, Martina Sander, Christof Schreiber, Nadine Schönwolf, Ludwig Stecher, Lea Steinfeld, Steffi Thomas, Michaela Timberlake, Salomé Vogel, Leonie Weber, Malte Werner, Jochen Wissinger |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Münster, : Waxmann, 2024 |
| Descrizione fisica | 1 online resource (240 p.) |
| Soggetto topico |
Lehrkräftebildung
Strukturentwicklung Transfer Vernetzung Lehrkräftefortbildung Kooperation Hochschule Schule Praxis Qualitätsoffensive Lehrerbildung Phasenübergreifende Kooperation Disziplinübergreifende Zusammenarbeit Evaluation Schulpädagogik |
| ISBN | 3-8309-9850-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | ger |
| Record Nr. | UNINA-9910875598803321 |
| Münster, : Waxmann, 2024 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||