Reliability Technology [[electronic resource] ] : Principles and Practice of Failure Prevention in Electronic Systems |
Autore | Pascoe Norman |
Pubbl/distr/stampa | Chicester, : Wiley, 2011 |
Descrizione fisica | 1 online resource (414 p.) |
Disciplina | 621.381 |
Collana | Quality and Reliability Engineering Series |
Soggetto topico |
Electronic apparatus and appliances - Reliability
Electronic apparatus and appliances --Reliability System failures (Engineering) - Prevention System failures (Engineering) --Prevention Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
ISBN |
1-283-37410-2
9786613374103 0-470-98011-7 0-470-98010-9 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
RELIABILITY TECHNOLOGY: PRINCIPLES AND PRACTICE OF FAILURE PREVENTION IN ELECTRONIC SYSTEMS; Contents; Foreword by Michael Pecht; Series Editor's Preface; Preface; About the Author; Acknowledgements; 1 The Origins and Evolution of Quality and Reliability; 1.1 Sixty Years of Evolving Electronic Equipment Technology; 1.2 Manufacturing Processes - From Manual Skills to Automation; 1.3 Soldering Systems; 1.4 Component Placement Machines; 1.5 Automatic Test Equipment; 1.6 Lean Manufacturing; 1.7 Outsourcing; 1.8 Electronic System Reliability - Folklore versus Reality; 1.9 The 'Bathtub' Curve
1.10 The Truth about Arrhenius1.11 The Demise of MIL-HDBK-217; 1.12 The Benefits of Commercial Off-The-Shelf (COTS) Products; 1.13 The MoD SMART Procurement Initiative; 1.14 Why do Items Fail?; 1.15 The Importance of Understanding Physics of Failure (PoF); Summary and Questions; References; 2 Product Lifecycle Management; 2.1 Overview; 2.2 Project Management; 2.3 Project Initiation; 2.4 Project Planning; 2.5 Project Execution; 2.6 Project Closure; 2.7 A Process Capability Maturity Model; 2.8 When and How to Define The Distribution Strategy 2.9 Transfer of Design to Manufacturing - The High-Risk Phase2.10 Outsourcing - Understanding and Minimising the Risks; 2.11 How Product Reliability is Increasingly Threatened in the Twenty-First Century; Summary and Questions; References; 3 The Physics of Failure; 3.1 Overview; 3.2 Background; 3.3 Potential Failure Mechanisms in Materials and Components; 3.4 Techniques for Failure Analysis of Components and Assemblies; 3.5 Transition from Tin-Lead to Lead-Free Soldering; 3.6 High-Temperature Electronics and Extreme-Temperature Electronics; 3.7 Some Illustrations of Failure Mechanisms Summary and QuestionsReferences; 4 Heat Transfer - Theory and Practice; 4.1 Overview; 4.2 Conduction; 4.3 Convection; 4.4 Radiation; 4.5 Thermal Management; 4.6 Principles of Temperature Measurement; 4.7 Temperature Cycling and Thermal Shock; Summary and Questions; References; 5 Shock and Vibration - Theory and Practice; 5.1 Overview; 5.2 Sources of Shock Pulses in the Real Environment; 5.3 Response of Electronic Equipment to Shock Pulses; 5.4 Shock Testing; 5.5 Product Shock Fragility; 5.6 Shock and Vibration Isolation Techniques; 5.7 Sources of Vibration in the Real Environment 5.8 Response of Electronic Equipment to Vibration5.9 Vibration Testing; 5.10 Vibration-Test Fixtures; Summary and Questions; References; 6 Achieving Environmental-Test Realism; 6.1 Overview; 6.2 Environmental-Testing Objectives; 6.3 Environmental-Test Specifications and Standards; 6.4 Quality Standards; 6.5 The Role of the Test Technician; 6.6 Mechanical Testing; 6.7 Climatic Testing; 6.8 Chemical and Biological Testing; 6.9 Combined Environment Testing; 6.10 Electromagnetic Compatibility; 6.11 Avoiding Misinterpretation of Test Standards and Specifications; Summary and Questions; References 7 Essential Reliability Technology Disciplines in Design |
Record Nr. | UNINA-9910130866103321 |
Pascoe Norman | ||
Chicester, : Wiley, 2011 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Reliability technology : principles and practice of failure prevention in electronic systems / / Norman Pascoe |
Autore | Pascoe Norman |
Edizione | [1st ed.] |
Pubbl/distr/stampa | Chichester, West Sussex, U.K., : Wiley, 2011 |
Descrizione fisica | 1 online resource (414 p.) |
Disciplina | 621.381 |
Collana | Wiley series in quality & reliability engineering |
Soggetto topico |
Electronic apparatus and appliances - Reliability
System failures (Engineering) - Prevention |
ISBN |
1-283-37410-2
9786613374103 0-470-98011-7 0-470-98010-9 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
RELIABILITY TECHNOLOGY: PRINCIPLES AND PRACTICE OF FAILURE PREVENTION IN ELECTRONIC SYSTEMS; Contents; Foreword by Michael Pecht; Series Editor's Preface; Preface; About the Author; Acknowledgements; 1 The Origins and Evolution of Quality and Reliability; 1.1 Sixty Years of Evolving Electronic Equipment Technology; 1.2 Manufacturing Processes - From Manual Skills to Automation; 1.3 Soldering Systems; 1.4 Component Placement Machines; 1.5 Automatic Test Equipment; 1.6 Lean Manufacturing; 1.7 Outsourcing; 1.8 Electronic System Reliability - Folklore versus Reality; 1.9 The 'Bathtub' Curve
1.10 The Truth about Arrhenius1.11 The Demise of MIL-HDBK-217; 1.12 The Benefits of Commercial Off-The-Shelf (COTS) Products; 1.13 The MoD SMART Procurement Initiative; 1.14 Why do Items Fail?; 1.15 The Importance of Understanding Physics of Failure (PoF); Summary and Questions; References; 2 Product Lifecycle Management; 2.1 Overview; 2.2 Project Management; 2.3 Project Initiation; 2.4 Project Planning; 2.5 Project Execution; 2.6 Project Closure; 2.7 A Process Capability Maturity Model; 2.8 When and How to Define The Distribution Strategy 2.9 Transfer of Design to Manufacturing - The High-Risk Phase2.10 Outsourcing - Understanding and Minimising the Risks; 2.11 How Product Reliability is Increasingly Threatened in the Twenty-First Century; Summary and Questions; References; 3 The Physics of Failure; 3.1 Overview; 3.2 Background; 3.3 Potential Failure Mechanisms in Materials and Components; 3.4 Techniques for Failure Analysis of Components and Assemblies; 3.5 Transition from Tin-Lead to Lead-Free Soldering; 3.6 High-Temperature Electronics and Extreme-Temperature Electronics; 3.7 Some Illustrations of Failure Mechanisms Summary and QuestionsReferences; 4 Heat Transfer - Theory and Practice; 4.1 Overview; 4.2 Conduction; 4.3 Convection; 4.4 Radiation; 4.5 Thermal Management; 4.6 Principles of Temperature Measurement; 4.7 Temperature Cycling and Thermal Shock; Summary and Questions; References; 5 Shock and Vibration - Theory and Practice; 5.1 Overview; 5.2 Sources of Shock Pulses in the Real Environment; 5.3 Response of Electronic Equipment to Shock Pulses; 5.4 Shock Testing; 5.5 Product Shock Fragility; 5.6 Shock and Vibration Isolation Techniques; 5.7 Sources of Vibration in the Real Environment 5.8 Response of Electronic Equipment to Vibration5.9 Vibration Testing; 5.10 Vibration-Test Fixtures; Summary and Questions; References; 6 Achieving Environmental-Test Realism; 6.1 Overview; 6.2 Environmental-Testing Objectives; 6.3 Environmental-Test Specifications and Standards; 6.4 Quality Standards; 6.5 The Role of the Test Technician; 6.6 Mechanical Testing; 6.7 Climatic Testing; 6.8 Chemical and Biological Testing; 6.9 Combined Environment Testing; 6.10 Electromagnetic Compatibility; 6.11 Avoiding Misinterpretation of Test Standards and Specifications; Summary and Questions; References 7 Essential Reliability Technology Disciplines in Design |
Record Nr. | UNINA-9910814320203321 |
Pascoe Norman | ||
Chichester, West Sussex, U.K., : Wiley, 2011 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|