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Introduction to nondestructive testing [[electronic resource] ] : a training guide / / Paul E. Mix
Introduction to nondestructive testing [[electronic resource] ] : a training guide / / Paul E. Mix
Autore Mix Paul E
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, N.J., : Wiley, 2005
Descrizione fisica 1 online resource (709 p.)
Disciplina 620.1/127
620.1127
Soggetto topico Nondestructive testing
ISBN 1-280-27596-0
9786610275960
0-470-35329-5
0-471-71914-5
0-471-71913-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto INTRODUCTION TO NONDESTRUCTIVE TESTING; CONTENTS; Preface; 1 Introduction; 1.1 Digital Technology; 1.2 Smaller Is Better; 1.3 Medical Marvels; 1.4 Improving Shuttle Safety; 1.5 Airport Security; 1.6 Process Control; 1.7 Instrument Synchronization with PXI; 1.8 PCI vs. PXI; 1.9 60,000-Mile-High Elevator; 1.10 Proliferation of Information; 2 Acoustic Emissions; 2.1 Principles and Theory; 2.2 Signal Propagation; 2.3 Physical Considerations; 2.4 The AE Process Chain; 2.5 Time Considerations; 2.6 AE Parameters; 2.7 The AE Measurement Chain; 2.7.1 Coupling Agents; 2.7.2 AE Sensors
2.7.3 Sensor Attachment2.7.4 Sensor to Preamplifier Cable; 2.7.5 AE Preamplifier; 2.7.6 Preamplifier to System Cable; 2.8 Vallen AMSY-5 High-Speed AE System; 2.8.1 Frequency Filter; 2.8.2 The A/D Converter; 2.8.3 Feature Extraction; 2.8.4 Transient Recorder; 2.8.5 Data Buffer; 2.8.6 Personal Computer and Software; 2.8.7 Sensor Coupling Test (Autocalibration); 2.9 Location Calculation and Clustering; 2.9.1 Location Calculation Based on Time Differences; 2.9.2 Clustering; 2.9.3 Sample Analysis Screen; 2.9.4 Visualization of Measurement Results; 2.10 Advantages and Limitations of AE Testing
2.10.1 Advantages2.10.2 Advantages of Using Operating Medium (Gas or Liquid); 2.10.3 Advantages Compared to Other NDT Methods; 2.10.4 Limitations; 2.10.5 Location Errors; 2.11 AMSY-5 Main Features; 2.12 AE Transducers; 2.13 Kistler Piezotron® Acoustic Emission Sensors and Couplers; 2.14 AE Sensor Construction; 2.15 Summary of AE Sensor Features; 2.16 Technical Specifications-8152B2 Sensor; 2.17 AE Coupler Features; 2.18 Technical Specifications-5125B Coupler; 2.18.1 Input; 2.18.2 Output; 2.19 Acoustic Emission Technology; 2.20 AE Applications; 2.21 AE Theory; 2.22 Applications
2.22.1 Behavior of Materials-Metals, Ceramics, Composites, Rocks, Concrete2.22.2 Nondestructive Testing During Manufacturing Processes; 2.22.3 Monitoring Structures; 2.22.4 Special Applications; 2.23 Advanced Equipment; 2.23.1 PCI-2 AE Unit; 2.23.2 Key Features; 2.23.3 PCI-8, 16-Bit, 8-Channel AE Unit; 2.23.4 MicroSAMOSTM, Budget, Compact AE System; 2.23.5 DiSP Systems; 2.23.6 PCI/DSP-4 Card; 2.23.7 Features of PCI/DSP-4 System Board; 2.23.8 PCI/DSP-4 Board Operation and Functions; 2.23.9 DiSP System Block Diagram; 2.23.10 Other Company Products
2.24 Codes, Standards, Practices, Guidelines, and Societies2.24.1 Sheer Numbers; 2.24.2 Terminology; 2.24.3 Common Term Definitions; 2.24.4 General Principles; 2.24.5 Measurement Techniques and Calibration; 2.24.6 Areas of Opportunity; 2.25 Application and Product-Specific Procedures; 2.26 Impact-Echo Method; 2.26.1 Background; 2.26.2 Finite Element Code; 2.26.3 Ball Bearing-Generated Stress; 2.26.4 Impact-Echo Transducer Development; 2.26.5 Frequency Domain Analysis; 2.26.6 Theory of Operations; 2.26.7 Propagation of Waves; 2.26.8 Impact-Echo Instrumentation; 2.26.8.1 System Components
2.26.8.2 Heavy-Duty Carrying Case
Record Nr. UNINA-9910143574103321
Mix Paul E  
Hoboken, N.J., : Wiley, 2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Introduction to nondestructive testing : a training guide / / Paul E. Mix
Introduction to nondestructive testing : a training guide / / Paul E. Mix
Autore Mix Paul E
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, N.J., : Wiley, 2005
Descrizione fisica 1 online resource (709 p.)
Disciplina 620.1/127
Soggetto topico Nondestructive testing
ISBN 9786610275960
9781280275968
1280275960
9780470353295
0470353295
9780471719144
0471719145
9780471719137
0471719137
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto INTRODUCTION TO NONDESTRUCTIVE TESTING; CONTENTS; Preface; 1 Introduction; 1.1 Digital Technology; 1.2 Smaller Is Better; 1.3 Medical Marvels; 1.4 Improving Shuttle Safety; 1.5 Airport Security; 1.6 Process Control; 1.7 Instrument Synchronization with PXI; 1.8 PCI vs. PXI; 1.9 60,000-Mile-High Elevator; 1.10 Proliferation of Information; 2 Acoustic Emissions; 2.1 Principles and Theory; 2.2 Signal Propagation; 2.3 Physical Considerations; 2.4 The AE Process Chain; 2.5 Time Considerations; 2.6 AE Parameters; 2.7 The AE Measurement Chain; 2.7.1 Coupling Agents; 2.7.2 AE Sensors
2.7.3 Sensor Attachment2.7.4 Sensor to Preamplifier Cable; 2.7.5 AE Preamplifier; 2.7.6 Preamplifier to System Cable; 2.8 Vallen AMSY-5 High-Speed AE System; 2.8.1 Frequency Filter; 2.8.2 The A/D Converter; 2.8.3 Feature Extraction; 2.8.4 Transient Recorder; 2.8.5 Data Buffer; 2.8.6 Personal Computer and Software; 2.8.7 Sensor Coupling Test (Autocalibration); 2.9 Location Calculation and Clustering; 2.9.1 Location Calculation Based on Time Differences; 2.9.2 Clustering; 2.9.3 Sample Analysis Screen; 2.9.4 Visualization of Measurement Results; 2.10 Advantages and Limitations of AE Testing
2.10.1 Advantages2.10.2 Advantages of Using Operating Medium (Gas or Liquid); 2.10.3 Advantages Compared to Other NDT Methods; 2.10.4 Limitations; 2.10.5 Location Errors; 2.11 AMSY-5 Main Features; 2.12 AE Transducers; 2.13 Kistler Piezotron® Acoustic Emission Sensors and Couplers; 2.14 AE Sensor Construction; 2.15 Summary of AE Sensor Features; 2.16 Technical Specifications-8152B2 Sensor; 2.17 AE Coupler Features; 2.18 Technical Specifications-5125B Coupler; 2.18.1 Input; 2.18.2 Output; 2.19 Acoustic Emission Technology; 2.20 AE Applications; 2.21 AE Theory; 2.22 Applications
2.22.1 Behavior of Materials-Metals, Ceramics, Composites, Rocks, Concrete2.22.2 Nondestructive Testing During Manufacturing Processes; 2.22.3 Monitoring Structures; 2.22.4 Special Applications; 2.23 Advanced Equipment; 2.23.1 PCI-2 AE Unit; 2.23.2 Key Features; 2.23.3 PCI-8, 16-Bit, 8-Channel AE Unit; 2.23.4 MicroSAMOSTM, Budget, Compact AE System; 2.23.5 DiSP Systems; 2.23.6 PCI/DSP-4 Card; 2.23.7 Features of PCI/DSP-4 System Board; 2.23.8 PCI/DSP-4 Board Operation and Functions; 2.23.9 DiSP System Block Diagram; 2.23.10 Other Company Products
2.24 Codes, Standards, Practices, Guidelines, and Societies2.24.1 Sheer Numbers; 2.24.2 Terminology; 2.24.3 Common Term Definitions; 2.24.4 General Principles; 2.24.5 Measurement Techniques and Calibration; 2.24.6 Areas of Opportunity; 2.25 Application and Product-Specific Procedures; 2.26 Impact-Echo Method; 2.26.1 Background; 2.26.2 Finite Element Code; 2.26.3 Ball Bearing-Generated Stress; 2.26.4 Impact-Echo Transducer Development; 2.26.5 Frequency Domain Analysis; 2.26.6 Theory of Operations; 2.26.7 Propagation of Waves; 2.26.8 Impact-Echo Instrumentation; 2.26.8.1 System Components
2.26.8.2 Heavy-Duty Carrying Case
Record Nr. UNINA-9911019712303321
Mix Paul E  
Hoboken, N.J., : Wiley, 2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui