Adhesion aspects in dentistry / / edited by Jukka P. Matinlinna and K.L. Mittal |
Pubbl/distr/stampa | Leiden ; ; Boston : , : VSP, , 2009 |
Descrizione fisica | 1 online resource (296 p.) |
Disciplina |
617
617.6 |
Altri autori (Persone) |
MatinlinnaJukka P
MittalK. L. <1945-> |
Soggetto topico |
Dentistry
Dentistry - Testing |
Soggetto genere / forma | Electronic books. |
ISBN |
0-429-08775-6
1-282-94946-2 9786612949463 90-474-2618-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | pt. 1. Adhesion and bonding aspects -- pt. 2. Mechanics and durability aspects -- pt. 3. Adhesion testing. |
Record Nr. | UNINA-9910458893403321 |
Leiden ; ; Boston : , : VSP, , 2009 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion aspects in dentistry / / edited by Jukka P. Matinlinna and K.L. Mittal |
Pubbl/distr/stampa | Leiden ; ; Boston : , : VSP, , 2009 |
Descrizione fisica | 1 online resource (296 p.) |
Disciplina |
617
617.6 |
Altri autori (Persone) |
MatinlinnaJukka P
MittalK. L. <1945-> |
Soggetto topico |
Dentistry
Dentistry - Testing |
ISBN |
0-429-08775-6
1-282-94946-2 9786612949463 90-474-2618-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | pt. 1. Adhesion and bonding aspects -- pt. 2. Mechanics and durability aspects -- pt. 3. Adhesion testing. |
Record Nr. | UNINA-9910785598203321 |
Leiden ; ; Boston : , : VSP, , 2009 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion aspects in dentistry / / edited by Jukka P. Matinlinna and K.L. Mittal |
Edizione | [1st ed.] |
Pubbl/distr/stampa | Leiden ; ; Boston, : Brill Academic Pub, 2009 |
Descrizione fisica | 1 online resource (296 p.) |
Disciplina |
617
617.6 |
Altri autori (Persone) |
MatinlinnaJukka P
MittalK. L. <1945-> |
Soggetto topico |
Dentistry
Dentistry - Testing |
ISBN |
0-429-08775-6
1-282-94946-2 9786612949463 90-474-2618-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | pt. 1. Adhesion and bonding aspects -- pt. 2. Mechanics and durability aspects -- pt. 3. Adhesion testing. |
Record Nr. | UNINA-9910824255503321 |
Leiden ; ; Boston, : Brill Academic Pub, 2009 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion aspects in MEMS-NEMS / / edited by S. H. Kim, M. T. Dugger and K. L. Mittal |
Pubbl/distr/stampa | Leiden ; ; Boston : , : Brill |
Descrizione fisica | 1 online resource (424 p.) |
Disciplina | 621.381 |
Altri autori (Persone) |
KimSeong H
DuggerMichael T MittalK. L. <1945-> |
Soggetto topico |
Microelectromechanical systems
Nanoelectromechanical systems Adhesion Surfaces (Technology) |
Soggetto genere / forma | Electronic books. |
ISBN |
0-429-08792-6
1-61583-947-X 90-04-19095-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | pt. 1. Understanding through continuum theory -- pt. 2. Computer simulation of interfaces -- pt. 3. Adhesion and friction measurements -- pt. 4. Adhesion in practical applications -- pt. 5. Adhesion mitigation strategies. |
Record Nr. | UNINA-9910463021903321 |
Leiden ; ; Boston : , : Brill | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion aspects in MEMS-NEMS / / edited by S. H. Kim, M. T. Dugger and K. L. Mittal |
Pubbl/distr/stampa | Leiden ; ; Boston : , : Brill |
Descrizione fisica | 1 online resource (424 p.) |
Disciplina | 621.381 |
Altri autori (Persone) |
KimSeong H
DuggerMichael T MittalK. L. <1945-> |
Soggetto topico |
Microelectromechanical systems
Nanoelectromechanical systems Adhesion Surfaces (Technology) |
ISBN |
0-429-08792-6
1-61583-947-X 90-04-19095-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | pt. 1. Understanding through continuum theory -- pt. 2. Computer simulation of interfaces -- pt. 3. Adhesion and friction measurements -- pt. 4. Adhesion in practical applications -- pt. 5. Adhesion mitigation strategies. |
Record Nr. | UNINA-9910785903303321 |
Leiden ; ; Boston : , : Brill | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion aspects in MEMS-NEMS / / edited by S. H. Kim, M. T. Dugger and K. L. Mittal |
Edizione | [1st ed.] |
Pubbl/distr/stampa | Leiden [Netherlands] ; ; Boston, : VSP, 2010 |
Descrizione fisica | 1 online resource (424 p.) |
Disciplina | 621.381 |
Altri autori (Persone) |
KimSeong H
DuggerMichael T MittalK. L. <1945-> |
Soggetto topico |
Microelectromechanical systems
Nanoelectromechanical systems Adhesion Surfaces (Technology) |
ISBN |
0-429-08792-6
1-61583-947-X 90-04-19095-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | pt. 1. Understanding through continuum theory -- pt. 2. Computer simulation of interfaces -- pt. 3. Adhesion and friction measurements -- pt. 4. Adhesion in practical applications -- pt. 5. Adhesion mitigation strategies. |
Record Nr. | UNINA-9910807383103321 |
Leiden [Netherlands] ; ; Boston, : VSP, 2010 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion in microelectronics / / edited by K. L. Mittal and Tanweer Ahsan |
Pubbl/distr/stampa | Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 |
Descrizione fisica | 1 online resource (367 p.) |
Disciplina | 621.381/046 |
Collana | Adhesion and Adhesives: Fundamental and Applied Aspects |
Soggetto topico |
Microelectronic packaging - Materials
Adhesives Adhesive joints |
ISBN |
1-118-83134-9
1-118-83137-3 1-118-83135-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Cover; Title Page; Copyright Page; Contents; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.2.1 General Overview; 1.2.2 Key Principles of Operation; 1.2.3 IET Spectrometer Design and Implementation; 1.2.4 IET Sample Preparation; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics
2.1. Introduction2.2 Mechanical Methods; 2.2.1 Commonly Used Qualitative or Semi-quantitative Methods; 2.2.2 Quantitative Methods; 2.3 Laser Based Techniques; 2.3.1 Laser Induced Delamination (LID); 2.3.2 Laser Direct Ablation Induced De-adhesion; 2.3.3 Laser Spallation Technique; 2.4 Summary and Remarks; References; Part 2: Ways to Promote/Enhance Adhesion; 3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.1.1 Role of Surface Energy for Metal-Polymer Adhesion; 3.1.2 Physical Effects Produced by Covalent Bonding of Metal to Polymer 3.1.3 Thermal Expansion Coefficients of Metals and Polymers3.1.4 Differences Between Al-Polyolefin and Polyolefin-Al Laminates; 3.1.5 Types of Covalent Metal-Polymer Bonds; 3.1.6 Redox Reactions across the Metal-Polymer Interface; 3.1.7 Reactions of Transition Metals with Aromatic Polymers; 3.1.8 Loss in Anisotropic Orientation of Polymers Caused by Pretreatment or by Contact with Metals; 3.1.9 Combination of Plasma Pretreatment and Metal Deposition; 3.1.10 Thermodynamics; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules 3.2.1 Principal Functions of Spacers3.2.2 Ways to Graft Spacer Molecules onto Polyolefin Surfaces; 3.2.3 Grafting of Spacer Molecules onto Monotype Functional Groups at the Polyolefin Surface for Realizing New Interface Design in Metal-Polymer Systems; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.4.1 General; 3.4.2 Introduction of Functional Groups onto Polyolefin Surfaces; 3.4.3 Usual Pretreatment Processes and Their Advantages and Disadvantages 3.4.4 Use of Adhesion Promoting Layers Deposited by Plasma Polymerization3.4.5 Use of Silanes and Siloxanes; 3.4.6 Other Methods; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.5.1 Oxygen Plasma and Wet-chemical Reduction of O-functional Groups to OH Groups; 3.5.2 Underwater Capillary Discharge Plasma or Glow Discharge Electrolysis (GDE); 3.5.3 Electrospray-Ionization Deposition of Ultra-thin Polymer Layers; 3.5.4 Allylamine Plasma Polymerization for Producing NH2 Groups; 3.5.5 Allyl Alcohol Plasma Polymerization for Producing OH Groups 3.5.6 Acrylic Acid Plasma Polymerization for Producing COOH Groups |
Record Nr. | UNINA-9910132344303321 |
Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion in microelectronics / / edited by K. L. Mittal and Tanweer Ahsan |
Pubbl/distr/stampa | Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 |
Descrizione fisica | 1 online resource (367 p.) |
Disciplina | 621.381/046 |
Collana | Adhesion and Adhesives: Fundamental and Applied Aspects |
Soggetto topico |
Microelectronic packaging - Materials
Adhesives Adhesive joints |
ISBN |
1-118-83134-9
1-118-83137-3 1-118-83135-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Cover; Title Page; Copyright Page; Contents; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.2.1 General Overview; 1.2.2 Key Principles of Operation; 1.2.3 IET Spectrometer Design and Implementation; 1.2.4 IET Sample Preparation; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics
2.1. Introduction2.2 Mechanical Methods; 2.2.1 Commonly Used Qualitative or Semi-quantitative Methods; 2.2.2 Quantitative Methods; 2.3 Laser Based Techniques; 2.3.1 Laser Induced Delamination (LID); 2.3.2 Laser Direct Ablation Induced De-adhesion; 2.3.3 Laser Spallation Technique; 2.4 Summary and Remarks; References; Part 2: Ways to Promote/Enhance Adhesion; 3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.1.1 Role of Surface Energy for Metal-Polymer Adhesion; 3.1.2 Physical Effects Produced by Covalent Bonding of Metal to Polymer 3.1.3 Thermal Expansion Coefficients of Metals and Polymers3.1.4 Differences Between Al-Polyolefin and Polyolefin-Al Laminates; 3.1.5 Types of Covalent Metal-Polymer Bonds; 3.1.6 Redox Reactions across the Metal-Polymer Interface; 3.1.7 Reactions of Transition Metals with Aromatic Polymers; 3.1.8 Loss in Anisotropic Orientation of Polymers Caused by Pretreatment or by Contact with Metals; 3.1.9 Combination of Plasma Pretreatment and Metal Deposition; 3.1.10 Thermodynamics; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules 3.2.1 Principal Functions of Spacers3.2.2 Ways to Graft Spacer Molecules onto Polyolefin Surfaces; 3.2.3 Grafting of Spacer Molecules onto Monotype Functional Groups at the Polyolefin Surface for Realizing New Interface Design in Metal-Polymer Systems; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.4.1 General; 3.4.2 Introduction of Functional Groups onto Polyolefin Surfaces; 3.4.3 Usual Pretreatment Processes and Their Advantages and Disadvantages 3.4.4 Use of Adhesion Promoting Layers Deposited by Plasma Polymerization3.4.5 Use of Silanes and Siloxanes; 3.4.6 Other Methods; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.5.1 Oxygen Plasma and Wet-chemical Reduction of O-functional Groups to OH Groups; 3.5.2 Underwater Capillary Discharge Plasma or Glow Discharge Electrolysis (GDE); 3.5.3 Electrospray-Ionization Deposition of Ultra-thin Polymer Layers; 3.5.4 Allylamine Plasma Polymerization for Producing NH2 Groups; 3.5.5 Allyl Alcohol Plasma Polymerization for Producing OH Groups 3.5.6 Acrylic Acid Plasma Polymerization for Producing COOH Groups |
Record Nr. | UNINA-9910819143603321 |
Hoboken, New Jersey ; ; Salem, Massachusetts : , : Scrivener Publishing : , : Wiley, , 2014 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion in pharmaceutical, biomedical and dental fields / / edited by K.L. Mittal and F.M. Etzler |
Pubbl/distr/stampa | Beverly, Mass. : , : Scrivener, , 2017 |
Descrizione fisica | 1 online resource (409 pages) : illustrations, tables |
Disciplina | 610.284 |
Collana | Adhesion and adhesives : fundamental and applied aspects |
Soggetto topico |
Adhesives
Biomedical materials Pharmaceutical industry - Technological innovations Dental bonding |
ISBN |
1-5231-1506-8
1-119-32378-9 1-119-32371-1 1-119-32379-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910271032403321 |
Beverly, Mass. : , : Scrivener, , 2017 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesion in pharmaceutical, biomedical and dental fields / / edited by K.L. Mittal and F.M. Etzler |
Pubbl/distr/stampa | Beverly, Mass. : , : Scrivener, , 2017 |
Descrizione fisica | 1 online resource (409 pages) : illustrations, tables |
Disciplina | 610.284 |
Collana |
Adhesion and adhesives : fundamental and applied aspects
THEi Wiley ebooks |
Soggetto topico |
Adhesives
Biomedical materials Pharmaceutical industry - Technological innovations Dental bonding |
ISBN |
1-5231-1506-8
1-119-32378-9 1-119-32371-1 1-119-32379-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910810015003321 |
Beverly, Mass. : , : Scrivener, , 2017 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|