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Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
| Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail |
| Pubbl/distr/stampa | Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 |
| Descrizione fisica | 1 online resource (434 p.) |
| Disciplina | 620.199 |
| Soggetto topico |
Adhesives
Adhesion |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-282-02142-7
9786612021428 3-527-62392-2 3-527-62393-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Adhesive Bonding Materials, Applications and Technology; Contents; Preface; List of Contributors; 1 Adhesive Bonding as a Joining Technique; 2 The Historical Development of Adhesive Bonding; 3 Adhesion; 3.1 Introduction; 3.2 Classical Adhesion Theories; 3.2.1 Polarization Theory; 3.2.2 Diffusion Theory; 3.2.3 Chemical Reactions; 3.3 Adhesion in Real Systems; 3.3.1 Gold; 3.3.2 Polyethylene and Polypropylene; 3.3.3 Glass; 3.4 New Concepts in the Field of Adhesion; 3.5 Conclusions; 4 Survey and Classification of Adhesives and Primers; 4.1 Noncuring (Pressure-Sensitive) Adhesives
4.2 Physically Setting Adhesives4.2.1 Contact Adhesives; 4.2.2 Plastisol Adhesives; 4.2.3 Hot-Melt Adhesives; 4.3 Chemically Setting Adhesives; 4.3.1 Two-Part Adhesives; 4.3.2 Hot-Setting, One-Part Adhesives; 4.3.3 Cold-Setting, One-Part Adhesives; 4.3.4 Microencapsulated Adhesives; 4.4 Primers; 4.5 General Handling Instructions; 5 Chemistry and Properties of Adhesives and Primers; 5.1 Pressure-Sensitive Adhesives (PSAs); 5.1.1 Introduction; 5.1.2 Chemistry of Pressure-Sensitive Adhesives; 5.1.3 Physical Properties of Pressure-Sensitive Adhesives 5.1.4 Properties of Pressure-Sensitive Adhesives as a Function of Temperature5.1.5 Tack; 5.1.6 Peel Resistance; 5.1.7 Creep; 5.1.8 Formulations of PSAs; 5.1.8.1 Typical Formulation of Natural Rubber-Based PSAs; 5.1.8.2 Typical Formulation of Block Copolymer PSAs; 5.1.8.3 Typical Formulation of Acrylate-Based PSAs; 5.2 Contact Adhesives; 5.2.1 Composition of Contact Adhesives; 5.2.2 Properties and Fields of Application of Contact Adhesives; 5.3 Hot Melts; 5.3.1 Thermoplastic Hot Melts; 5.3.2 Hot-Seal Adhesives; 5.3.3 Plastisols; 5.3.4 Self-Bonding Varnishes 5.3.5 Polyurethane-Based Reactive Hot Melts5.3.6 Epoxy Resin-Based Reactive Hot Melts; 5.3.7 Trends in Hot-Melt Technology; 5.4 Phenolic Resin Adhesives; 5.4.1 Chemistry of Phenolic Resins; 5.4.2 Formulation of Phenolic Resin Adhesives; 5.4.3 Behavior and Applications of Phenolic Resin Adhesives; 5.5 Epoxy Resin Adhesives; 5.5.1 Chemistry of Epoxy Resin Adhesives; 5.5.2 Reactions of Epoxy Resins; 5.5.3 Properties of Epoxy Resin Adhesives; 5.5.4 Formulations of Epoxy Resin Adhesives; 5.5.4.1 Epoxy Resins; 5.5.4.2 Crosslinking Agents; 5.5.4.3 Hardeners 5.5.4.4 Flexibilizers and Additives That Improve Impact Toughness5.5.4.5 Fillers and Thixotroping Agents; 5.5.4.6 Further Additives; 5.5.4.7 Typical Epoxy-Resin Adhesive Formulations; 5.6 Polyurethane Adhesives; 5.6.1 Chemistry of Polyurethanes; 5.6.2 Raw Materials; 5.6.2.1 Isocyanates; 5.6.2.2 Polyols; 5.6.2.3 Catalysts; 5.6.3 Structure and Properties of Polyurethane Adhesives; 5.6.3.1 One-Part Polyurethane Adhesives; 5.6.3.2 Two-Part Polyurethane Adhesives; 5.6.4 Formulations of Polyurethane Adhesives; 5.7 Acrylate Adhesives; 5.7.1 Physically Setting Acrylates 5.7.1.1 Solvent-Containing Acrylates |
| Record Nr. | UNINA-9910144395003321 |
| Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
| Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail |
| Pubbl/distr/stampa | Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 |
| Descrizione fisica | 1 online resource (434 p.) |
| Disciplina | 620.199 |
| Soggetto topico |
Adhesives
Adhesion |
| ISBN |
1-282-02142-7
9786612021428 3-527-62392-2 3-527-62393-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Adhesive Bonding Materials, Applications and Technology; Contents; Preface; List of Contributors; 1 Adhesive Bonding as a Joining Technique; 2 The Historical Development of Adhesive Bonding; 3 Adhesion; 3.1 Introduction; 3.2 Classical Adhesion Theories; 3.2.1 Polarization Theory; 3.2.2 Diffusion Theory; 3.2.3 Chemical Reactions; 3.3 Adhesion in Real Systems; 3.3.1 Gold; 3.3.2 Polyethylene and Polypropylene; 3.3.3 Glass; 3.4 New Concepts in the Field of Adhesion; 3.5 Conclusions; 4 Survey and Classification of Adhesives and Primers; 4.1 Noncuring (Pressure-Sensitive) Adhesives
4.2 Physically Setting Adhesives4.2.1 Contact Adhesives; 4.2.2 Plastisol Adhesives; 4.2.3 Hot-Melt Adhesives; 4.3 Chemically Setting Adhesives; 4.3.1 Two-Part Adhesives; 4.3.2 Hot-Setting, One-Part Adhesives; 4.3.3 Cold-Setting, One-Part Adhesives; 4.3.4 Microencapsulated Adhesives; 4.4 Primers; 4.5 General Handling Instructions; 5 Chemistry and Properties of Adhesives and Primers; 5.1 Pressure-Sensitive Adhesives (PSAs); 5.1.1 Introduction; 5.1.2 Chemistry of Pressure-Sensitive Adhesives; 5.1.3 Physical Properties of Pressure-Sensitive Adhesives 5.1.4 Properties of Pressure-Sensitive Adhesives as a Function of Temperature5.1.5 Tack; 5.1.6 Peel Resistance; 5.1.7 Creep; 5.1.8 Formulations of PSAs; 5.1.8.1 Typical Formulation of Natural Rubber-Based PSAs; 5.1.8.2 Typical Formulation of Block Copolymer PSAs; 5.1.8.3 Typical Formulation of Acrylate-Based PSAs; 5.2 Contact Adhesives; 5.2.1 Composition of Contact Adhesives; 5.2.2 Properties and Fields of Application of Contact Adhesives; 5.3 Hot Melts; 5.3.1 Thermoplastic Hot Melts; 5.3.2 Hot-Seal Adhesives; 5.3.3 Plastisols; 5.3.4 Self-Bonding Varnishes 5.3.5 Polyurethane-Based Reactive Hot Melts5.3.6 Epoxy Resin-Based Reactive Hot Melts; 5.3.7 Trends in Hot-Melt Technology; 5.4 Phenolic Resin Adhesives; 5.4.1 Chemistry of Phenolic Resins; 5.4.2 Formulation of Phenolic Resin Adhesives; 5.4.3 Behavior and Applications of Phenolic Resin Adhesives; 5.5 Epoxy Resin Adhesives; 5.5.1 Chemistry of Epoxy Resin Adhesives; 5.5.2 Reactions of Epoxy Resins; 5.5.3 Properties of Epoxy Resin Adhesives; 5.5.4 Formulations of Epoxy Resin Adhesives; 5.5.4.1 Epoxy Resins; 5.5.4.2 Crosslinking Agents; 5.5.4.3 Hardeners 5.5.4.4 Flexibilizers and Additives That Improve Impact Toughness5.5.4.5 Fillers and Thixotroping Agents; 5.5.4.6 Further Additives; 5.5.4.7 Typical Epoxy-Resin Adhesive Formulations; 5.6 Polyurethane Adhesives; 5.6.1 Chemistry of Polyurethanes; 5.6.2 Raw Materials; 5.6.2.1 Isocyanates; 5.6.2.2 Polyols; 5.6.2.3 Catalysts; 5.6.3 Structure and Properties of Polyurethane Adhesives; 5.6.3.1 One-Part Polyurethane Adhesives; 5.6.3.2 Two-Part Polyurethane Adhesives; 5.6.4 Formulations of Polyurethane Adhesives; 5.7 Acrylate Adhesives; 5.7.1 Physically Setting Acrylates 5.7.1.1 Solvent-Containing Acrylates |
| Record Nr. | UNINA-9910830654203321 |
| Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||