Handbook of physical vapor deposition (PVD) processing [[electronic resource] /] / Donald M. Mattox |
Autore | Mattox D. M |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Amsterdam, : Elsevier, 2010 |
Descrizione fisica | 1 online resource (793 p.) |
Disciplina | 671.735 |
Soggetto topico | Physical vapor deposition |
Soggetto genere / forma | Electronic books. |
ISBN |
1-282-73769-4
9786612737695 0-8155-2038-7 0-08-094658-5 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Front Cover; Handbook of Physical Vapor Deposition (PVD) Processing; Copyright Page; Contents; Preface to First Edition; Preface to Second Edition; Acknowledgements; Acronyms; Biography; Chapter 1: Introduction; 1.1 Surface Engineering; 1.1.1 Physical Vapor Deposition (PVD) Processes; 1.1.2 Non-PVD Thin Film Atomistic Deposition Processes; 1.1.3 Applications of Vacuum-deposited Materials; 1.2 Thin Film Processing; 1.2.1 Stages of Fabrication; 1.2.2 Factors that Affect Film Properties; 1.2.3 Scale-Up and Manufacturability; 1.3 Process Documentation; 1.3.1 Process Specifications
1.3.2 Manufacturing Process Instructions (MPIs)1.3.3 Travelers; 1.3.4 Equipment and Calibration Logs; 1.3.5 Commercial/Military Standards and Specifications (Mil Specs); 1.4 Safety and Environmental Concerns; 1.5 Units; 1.5.1 Temperature Scales; 1.5.2 Energy Units; 1.5.3 Prefixes; 1.5.4 The Greek Alphabet; 1.6 Summary; Chapter 2: Substrate (""Real"") Surfaces and Surface Modification; 2.1 Introduction; 2.2 Materials and Fabrication; 2.2.1 Metals; 2.2.2 Ceramics and Glasses; 2.2.3 Polymers; 2.3 Atomic Structure and Atom-particle Interactions; 2.3.1 Atomic Structure and Nomenclature 2.3.2 Excitation and Atomic Transitions2.3.3 Chemical Bonding; 2.3.4 Probing and Detected Species; 2.4 Characterization of Surfaces and Near-surface Regions; 2.4.1 Elemental (Chemical) Compositional Analysis; 2.4.2 Phase Composition and Microstructure; 2.4.3 Molecular Composition and Chemical Bonding; 2.4.4 Surface Morphology; 2.4.5 Adsorption - Gases and Liquids; 2.4.6 Mechanical and Thermal Properties of Surfaces; 2.4.7 Surface Energy and Surface Tension; 2.4.8 Acidic and Basic Properties of Surfaces; 2.5 Bulk Properties; 2.5.1 Outgassing; 2.5.2 Outdiffusion 2.6 Modification of Substrate Surfaces2.6.1 Surface Morphology; 2.6.2 Surface Hardness; 2.6.3 Strengthening of Surfaces; 2.6.4 Surface Composition; 2.6.5 Surface ""Activation"" (""Functionalization""); 2.6.6 Surface ""Sensitization""; 2.7 Summary; Chapter 3: The ""Good"" Vacuum (Low Pressure) Processing Environment; 3.1 Introduction; 3.2 Gases and Vapors; 3.2.1 Gas Pressure and Partial Pressure; 3.2.2 Molecular Motion; 3.2.3 Gas Flow; 3.2.4 Ideal Gas Law; 3.2.5 Vapor Pressure and Condensation; 3.3 Gas-surface Interactions; 3.3.1 Residence Time; 3.3.2 Chemical Interactions 3.4 Vacuum Environment3.4.1 Origin of Gases and Vapors; 3.5 Vacuum Processing Systems; 3.5.1 System Design Considerations and ""Trade-Offs""; 3.5.2 Processing Chamber Configurations; 3.5.3 Equilibrium Conductance; 3.5.4 Pumping Speed and Mass Throughput; 3.5.5 Fixturing and Tooling; 3.5.6 Feedthroughs and Accessories; 3.5.7 Liners and Shields; 3.5.8 Fail-Safe Designs; 3.6 Vacuum pumping; 3.6.1 Mechanical Pumps; 3.6.2 Momentum Transfer Pumps; 3.6.3 Capture Pumps; 3.6.4 Hybrid Pumps; 3.7 Vacuum- and Plasma-Compatible Materials; 3.7.1 Metals; 3.7.2 Ceramic and Glass Materials; 3.7.3 Polymers 3.8 Assembly |
Record Nr. | UNINA-9910456393403321 |
Mattox D. M
![]() |
||
Amsterdam, : Elsevier, 2010 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Handbook of physical vapor deposition (PVD) processing [[electronic resource] /] / Donald M. Mattox |
Autore | Mattox D. M |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Amsterdam, : Elsevier, 2010 |
Descrizione fisica | 1 online resource (793 p.) |
Disciplina | 671.735 |
Soggetto topico | Physical vapor deposition |
ISBN |
1-282-73769-4
9786612737695 0-8155-2038-7 0-08-094658-5 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Front Cover; Handbook of Physical Vapor Deposition (PVD) Processing; Copyright Page; Contents; Preface to First Edition; Preface to Second Edition; Acknowledgements; Acronyms; Biography; Chapter 1: Introduction; 1.1 Surface Engineering; 1.1.1 Physical Vapor Deposition (PVD) Processes; 1.1.2 Non-PVD Thin Film Atomistic Deposition Processes; 1.1.3 Applications of Vacuum-deposited Materials; 1.2 Thin Film Processing; 1.2.1 Stages of Fabrication; 1.2.2 Factors that Affect Film Properties; 1.2.3 Scale-Up and Manufacturability; 1.3 Process Documentation; 1.3.1 Process Specifications
1.3.2 Manufacturing Process Instructions (MPIs)1.3.3 Travelers; 1.3.4 Equipment and Calibration Logs; 1.3.5 Commercial/Military Standards and Specifications (Mil Specs); 1.4 Safety and Environmental Concerns; 1.5 Units; 1.5.1 Temperature Scales; 1.5.2 Energy Units; 1.5.3 Prefixes; 1.5.4 The Greek Alphabet; 1.6 Summary; Chapter 2: Substrate (""Real"") Surfaces and Surface Modification; 2.1 Introduction; 2.2 Materials and Fabrication; 2.2.1 Metals; 2.2.2 Ceramics and Glasses; 2.2.3 Polymers; 2.3 Atomic Structure and Atom-particle Interactions; 2.3.1 Atomic Structure and Nomenclature 2.3.2 Excitation and Atomic Transitions2.3.3 Chemical Bonding; 2.3.4 Probing and Detected Species; 2.4 Characterization of Surfaces and Near-surface Regions; 2.4.1 Elemental (Chemical) Compositional Analysis; 2.4.2 Phase Composition and Microstructure; 2.4.3 Molecular Composition and Chemical Bonding; 2.4.4 Surface Morphology; 2.4.5 Adsorption - Gases and Liquids; 2.4.6 Mechanical and Thermal Properties of Surfaces; 2.4.7 Surface Energy and Surface Tension; 2.4.8 Acidic and Basic Properties of Surfaces; 2.5 Bulk Properties; 2.5.1 Outgassing; 2.5.2 Outdiffusion 2.6 Modification of Substrate Surfaces2.6.1 Surface Morphology; 2.6.2 Surface Hardness; 2.6.3 Strengthening of Surfaces; 2.6.4 Surface Composition; 2.6.5 Surface ""Activation"" (""Functionalization""); 2.6.6 Surface ""Sensitization""; 2.7 Summary; Chapter 3: The ""Good"" Vacuum (Low Pressure) Processing Environment; 3.1 Introduction; 3.2 Gases and Vapors; 3.2.1 Gas Pressure and Partial Pressure; 3.2.2 Molecular Motion; 3.2.3 Gas Flow; 3.2.4 Ideal Gas Law; 3.2.5 Vapor Pressure and Condensation; 3.3 Gas-surface Interactions; 3.3.1 Residence Time; 3.3.2 Chemical Interactions 3.4 Vacuum Environment3.4.1 Origin of Gases and Vapors; 3.5 Vacuum Processing Systems; 3.5.1 System Design Considerations and ""Trade-Offs""; 3.5.2 Processing Chamber Configurations; 3.5.3 Equilibrium Conductance; 3.5.4 Pumping Speed and Mass Throughput; 3.5.5 Fixturing and Tooling; 3.5.6 Feedthroughs and Accessories; 3.5.7 Liners and Shields; 3.5.8 Fail-Safe Designs; 3.6 Vacuum pumping; 3.6.1 Mechanical Pumps; 3.6.2 Momentum Transfer Pumps; 3.6.3 Capture Pumps; 3.6.4 Hybrid Pumps; 3.7 Vacuum- and Plasma-Compatible Materials; 3.7.1 Metals; 3.7.2 Ceramic and Glass Materials; 3.7.3 Polymers 3.8 Assembly |
Record Nr. | UNINA-9910781160803321 |
Mattox D. M
![]() |
||
Amsterdam, : Elsevier, 2010 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Handbook of physical vapor deposition (PVD) processing [[electronic resource] /] / Donald M. Mattox |
Autore | Mattox D. M |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Amsterdam, : Elsevier, 2010 |
Descrizione fisica | 1 online resource (793 p.) |
Disciplina | 671.735 |
Soggetto topico | Physical vapor deposition |
ISBN |
1-282-73769-4
9786612737695 0-8155-2038-7 0-08-094658-5 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Front Cover; Handbook of Physical Vapor Deposition (PVD) Processing; Copyright Page; Contents; Preface to First Edition; Preface to Second Edition; Acknowledgements; Acronyms; Biography; Chapter 1: Introduction; 1.1 Surface Engineering; 1.1.1 Physical Vapor Deposition (PVD) Processes; 1.1.2 Non-PVD Thin Film Atomistic Deposition Processes; 1.1.3 Applications of Vacuum-deposited Materials; 1.2 Thin Film Processing; 1.2.1 Stages of Fabrication; 1.2.2 Factors that Affect Film Properties; 1.2.3 Scale-Up and Manufacturability; 1.3 Process Documentation; 1.3.1 Process Specifications
1.3.2 Manufacturing Process Instructions (MPIs)1.3.3 Travelers; 1.3.4 Equipment and Calibration Logs; 1.3.5 Commercial/Military Standards and Specifications (Mil Specs); 1.4 Safety and Environmental Concerns; 1.5 Units; 1.5.1 Temperature Scales; 1.5.2 Energy Units; 1.5.3 Prefixes; 1.5.4 The Greek Alphabet; 1.6 Summary; Chapter 2: Substrate (""Real"") Surfaces and Surface Modification; 2.1 Introduction; 2.2 Materials and Fabrication; 2.2.1 Metals; 2.2.2 Ceramics and Glasses; 2.2.3 Polymers; 2.3 Atomic Structure and Atom-particle Interactions; 2.3.1 Atomic Structure and Nomenclature 2.3.2 Excitation and Atomic Transitions2.3.3 Chemical Bonding; 2.3.4 Probing and Detected Species; 2.4 Characterization of Surfaces and Near-surface Regions; 2.4.1 Elemental (Chemical) Compositional Analysis; 2.4.2 Phase Composition and Microstructure; 2.4.3 Molecular Composition and Chemical Bonding; 2.4.4 Surface Morphology; 2.4.5 Adsorption - Gases and Liquids; 2.4.6 Mechanical and Thermal Properties of Surfaces; 2.4.7 Surface Energy and Surface Tension; 2.4.8 Acidic and Basic Properties of Surfaces; 2.5 Bulk Properties; 2.5.1 Outgassing; 2.5.2 Outdiffusion 2.6 Modification of Substrate Surfaces2.6.1 Surface Morphology; 2.6.2 Surface Hardness; 2.6.3 Strengthening of Surfaces; 2.6.4 Surface Composition; 2.6.5 Surface ""Activation"" (""Functionalization""); 2.6.6 Surface ""Sensitization""; 2.7 Summary; Chapter 3: The ""Good"" Vacuum (Low Pressure) Processing Environment; 3.1 Introduction; 3.2 Gases and Vapors; 3.2.1 Gas Pressure and Partial Pressure; 3.2.2 Molecular Motion; 3.2.3 Gas Flow; 3.2.4 Ideal Gas Law; 3.2.5 Vapor Pressure and Condensation; 3.3 Gas-surface Interactions; 3.3.1 Residence Time; 3.3.2 Chemical Interactions 3.4 Vacuum Environment3.4.1 Origin of Gases and Vapors; 3.5 Vacuum Processing Systems; 3.5.1 System Design Considerations and ""Trade-Offs""; 3.5.2 Processing Chamber Configurations; 3.5.3 Equilibrium Conductance; 3.5.4 Pumping Speed and Mass Throughput; 3.5.5 Fixturing and Tooling; 3.5.6 Feedthroughs and Accessories; 3.5.7 Liners and Shields; 3.5.8 Fail-Safe Designs; 3.6 Vacuum pumping; 3.6.1 Mechanical Pumps; 3.6.2 Momentum Transfer Pumps; 3.6.3 Capture Pumps; 3.6.4 Hybrid Pumps; 3.7 Vacuum- and Plasma-Compatible Materials; 3.7.1 Metals; 3.7.2 Ceramic and Glass Materials; 3.7.3 Polymers 3.8 Assembly |
Record Nr. | UNINA-9910820543403321 |
Mattox D. M
![]() |
||
Amsterdam, : Elsevier, 2010 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|