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The foundations of vacuum coating technology / / Donald M. Mattox
| The foundations of vacuum coating technology / / Donald M. Mattox |
| Autore | Mattox D. M |
| Pubbl/distr/stampa | Norwich, N.Y., : Noyes Publications/William Andrew Pub., c2003 |
| Descrizione fisica | 1 online resource (161 p.) |
| Disciplina | 669/.028/4 |
| Soggetto topico | Vapor-plating |
| ISBN |
1-282-71175-X
1-282-02762-X 9786612711756 0-08-094705-0 0-8155-1927-3 0-8155-1993-1 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; The Foundations of Vacuum Coating Technology; Copyright Page; Preface; Table of Contents; Chapter 1. Introduction; Chapter 2. Early Vacuum Science and Technology; Chapter 3. Early Electricity and Magnetism; Chapter 4. Early Plasma Physics and Chemistry; Chapter 5. Some Scientific and Engineering Societies and Publications; Chapter 6. Patents and the U.S. Patent Office; Deposition Processes; Sputter Deposition; Thermal Evaporation; Arc Vapor Deposition; Chemical Vapor Deposition; Ion Plating; Chapter 7. Surface Preparation; Summary; Endnotes; References
Acronyms Used in Vacuum CoatingGlossary of Terms for Vacuum Coating |
| Record Nr. | UNINA-9911004783703321 |
Mattox D. M
|
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| Norwich, N.Y., : Noyes Publications/William Andrew Pub., c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Handbook of physical vapor deposition (PVD) processing [[electronic resource] /] / Donald M. Mattox
| Handbook of physical vapor deposition (PVD) processing [[electronic resource] /] / Donald M. Mattox |
| Autore | Mattox D. M |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Amsterdam, : Elsevier, 2010 |
| Descrizione fisica | 1 online resource (793 p.) |
| Disciplina | 671.735 |
| Soggetto topico | Physical vapor deposition |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-282-73769-4
9786612737695 0-8155-2038-7 0-08-094658-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Handbook of Physical Vapor Deposition (PVD) Processing; Copyright Page; Contents; Preface to First Edition; Preface to Second Edition; Acknowledgements; Acronyms; Biography; Chapter 1: Introduction; 1.1 Surface Engineering; 1.1.1 Physical Vapor Deposition (PVD) Processes; 1.1.2 Non-PVD Thin Film Atomistic Deposition Processes; 1.1.3 Applications of Vacuum-deposited Materials; 1.2 Thin Film Processing; 1.2.1 Stages of Fabrication; 1.2.2 Factors that Affect Film Properties; 1.2.3 Scale-Up and Manufacturability; 1.3 Process Documentation; 1.3.1 Process Specifications
1.3.2 Manufacturing Process Instructions (MPIs)1.3.3 Travelers; 1.3.4 Equipment and Calibration Logs; 1.3.5 Commercial/Military Standards and Specifications (Mil Specs); 1.4 Safety and Environmental Concerns; 1.5 Units; 1.5.1 Temperature Scales; 1.5.2 Energy Units; 1.5.3 Prefixes; 1.5.4 The Greek Alphabet; 1.6 Summary; Chapter 2: Substrate (""Real"") Surfaces and Surface Modification; 2.1 Introduction; 2.2 Materials and Fabrication; 2.2.1 Metals; 2.2.2 Ceramics and Glasses; 2.2.3 Polymers; 2.3 Atomic Structure and Atom-particle Interactions; 2.3.1 Atomic Structure and Nomenclature 2.3.2 Excitation and Atomic Transitions2.3.3 Chemical Bonding; 2.3.4 Probing and Detected Species; 2.4 Characterization of Surfaces and Near-surface Regions; 2.4.1 Elemental (Chemical) Compositional Analysis; 2.4.2 Phase Composition and Microstructure; 2.4.3 Molecular Composition and Chemical Bonding; 2.4.4 Surface Morphology; 2.4.5 Adsorption - Gases and Liquids; 2.4.6 Mechanical and Thermal Properties of Surfaces; 2.4.7 Surface Energy and Surface Tension; 2.4.8 Acidic and Basic Properties of Surfaces; 2.5 Bulk Properties; 2.5.1 Outgassing; 2.5.2 Outdiffusion 2.6 Modification of Substrate Surfaces2.6.1 Surface Morphology; 2.6.2 Surface Hardness; 2.6.3 Strengthening of Surfaces; 2.6.4 Surface Composition; 2.6.5 Surface ""Activation"" (""Functionalization""); 2.6.6 Surface ""Sensitization""; 2.7 Summary; Chapter 3: The ""Good"" Vacuum (Low Pressure) Processing Environment; 3.1 Introduction; 3.2 Gases and Vapors; 3.2.1 Gas Pressure and Partial Pressure; 3.2.2 Molecular Motion; 3.2.3 Gas Flow; 3.2.4 Ideal Gas Law; 3.2.5 Vapor Pressure and Condensation; 3.3 Gas-surface Interactions; 3.3.1 Residence Time; 3.3.2 Chemical Interactions 3.4 Vacuum Environment3.4.1 Origin of Gases and Vapors; 3.5 Vacuum Processing Systems; 3.5.1 System Design Considerations and ""Trade-Offs""; 3.5.2 Processing Chamber Configurations; 3.5.3 Equilibrium Conductance; 3.5.4 Pumping Speed and Mass Throughput; 3.5.5 Fixturing and Tooling; 3.5.6 Feedthroughs and Accessories; 3.5.7 Liners and Shields; 3.5.8 Fail-Safe Designs; 3.6 Vacuum pumping; 3.6.1 Mechanical Pumps; 3.6.2 Momentum Transfer Pumps; 3.6.3 Capture Pumps; 3.6.4 Hybrid Pumps; 3.7 Vacuum- and Plasma-Compatible Materials; 3.7.1 Metals; 3.7.2 Ceramic and Glass Materials; 3.7.3 Polymers 3.8 Assembly |
| Record Nr. | UNINA-9910456393403321 |
|
Mattox D. M
|
||
| Amsterdam, : Elsevier, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Handbook of physical vapor deposition (PVD) processing [[electronic resource] /] / Donald M. Mattox
| Handbook of physical vapor deposition (PVD) processing [[electronic resource] /] / Donald M. Mattox |
| Autore | Mattox D. M |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Amsterdam, : Elsevier, 2010 |
| Descrizione fisica | 1 online resource (793 p.) |
| Disciplina | 671.735 |
| Soggetto topico | Physical vapor deposition |
| ISBN |
1-282-73769-4
9786612737695 0-8155-2038-7 0-08-094658-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Handbook of Physical Vapor Deposition (PVD) Processing; Copyright Page; Contents; Preface to First Edition; Preface to Second Edition; Acknowledgements; Acronyms; Biography; Chapter 1: Introduction; 1.1 Surface Engineering; 1.1.1 Physical Vapor Deposition (PVD) Processes; 1.1.2 Non-PVD Thin Film Atomistic Deposition Processes; 1.1.3 Applications of Vacuum-deposited Materials; 1.2 Thin Film Processing; 1.2.1 Stages of Fabrication; 1.2.2 Factors that Affect Film Properties; 1.2.3 Scale-Up and Manufacturability; 1.3 Process Documentation; 1.3.1 Process Specifications
1.3.2 Manufacturing Process Instructions (MPIs)1.3.3 Travelers; 1.3.4 Equipment and Calibration Logs; 1.3.5 Commercial/Military Standards and Specifications (Mil Specs); 1.4 Safety and Environmental Concerns; 1.5 Units; 1.5.1 Temperature Scales; 1.5.2 Energy Units; 1.5.3 Prefixes; 1.5.4 The Greek Alphabet; 1.6 Summary; Chapter 2: Substrate (""Real"") Surfaces and Surface Modification; 2.1 Introduction; 2.2 Materials and Fabrication; 2.2.1 Metals; 2.2.2 Ceramics and Glasses; 2.2.3 Polymers; 2.3 Atomic Structure and Atom-particle Interactions; 2.3.1 Atomic Structure and Nomenclature 2.3.2 Excitation and Atomic Transitions2.3.3 Chemical Bonding; 2.3.4 Probing and Detected Species; 2.4 Characterization of Surfaces and Near-surface Regions; 2.4.1 Elemental (Chemical) Compositional Analysis; 2.4.2 Phase Composition and Microstructure; 2.4.3 Molecular Composition and Chemical Bonding; 2.4.4 Surface Morphology; 2.4.5 Adsorption - Gases and Liquids; 2.4.6 Mechanical and Thermal Properties of Surfaces; 2.4.7 Surface Energy and Surface Tension; 2.4.8 Acidic and Basic Properties of Surfaces; 2.5 Bulk Properties; 2.5.1 Outgassing; 2.5.2 Outdiffusion 2.6 Modification of Substrate Surfaces2.6.1 Surface Morphology; 2.6.2 Surface Hardness; 2.6.3 Strengthening of Surfaces; 2.6.4 Surface Composition; 2.6.5 Surface ""Activation"" (""Functionalization""); 2.6.6 Surface ""Sensitization""; 2.7 Summary; Chapter 3: The ""Good"" Vacuum (Low Pressure) Processing Environment; 3.1 Introduction; 3.2 Gases and Vapors; 3.2.1 Gas Pressure and Partial Pressure; 3.2.2 Molecular Motion; 3.2.3 Gas Flow; 3.2.4 Ideal Gas Law; 3.2.5 Vapor Pressure and Condensation; 3.3 Gas-surface Interactions; 3.3.1 Residence Time; 3.3.2 Chemical Interactions 3.4 Vacuum Environment3.4.1 Origin of Gases and Vapors; 3.5 Vacuum Processing Systems; 3.5.1 System Design Considerations and ""Trade-Offs""; 3.5.2 Processing Chamber Configurations; 3.5.3 Equilibrium Conductance; 3.5.4 Pumping Speed and Mass Throughput; 3.5.5 Fixturing and Tooling; 3.5.6 Feedthroughs and Accessories; 3.5.7 Liners and Shields; 3.5.8 Fail-Safe Designs; 3.6 Vacuum pumping; 3.6.1 Mechanical Pumps; 3.6.2 Momentum Transfer Pumps; 3.6.3 Capture Pumps; 3.6.4 Hybrid Pumps; 3.7 Vacuum- and Plasma-Compatible Materials; 3.7.1 Metals; 3.7.2 Ceramic and Glass Materials; 3.7.3 Polymers 3.8 Assembly |
| Record Nr. | UNINA-9910781160803321 |
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Mattox D. M
|
||
| Amsterdam, : Elsevier, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Handbook of physical vapor deposition (PVD) processing : film formation, adhesion, surface preparation and contamination control / / by Donald M. Mattox
| Handbook of physical vapor deposition (PVD) processing : film formation, adhesion, surface preparation and contamination control / / by Donald M. Mattox |
| Autore | Mattox D. M |
| Pubbl/distr/stampa | Westwood, NJ, : Noyes Publications, c1998 |
| Descrizione fisica | 1 online resource (947 p.) |
| Disciplina | 671.735 |
| Soggetto topico |
Vapor-plating
Metals - Finishing |
| ISBN |
9786612002755
1-282-00275-9 1-282-00276-7 0-8155-1763-7 1-59124-079-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Handbook of Physical Vapor Depositon (PVD) Processing: Film Formation, Adhesion, Surface Preparation and Contamination Control; Copyright Page; Dedication; Table of Contents; Chapter 1. Introduction; 1.1 SURFACE ENGINEERING; 1.2 THIN FILM PROCESSING; 1.3 PROCESS DOCUMENTATION; 1.4 SAFETY AND ENVIRONMENTAL CONCERNS; 1.5 UNITS; 1.6 SUMMARY; FURTHER READING; REFERENCES; Chapter 2. Substrate ("Real") Surfaces and Surface Modification; 2.1 INTRODUCTION; 2.2 MATERIALS AND FABRICATION; 2.3 ATOMIC STRUCTURE AND ATOM-PARTICLE INTERACTIONS
2.4 CHARACTERIZATION OF SURFACES AND NEAR-SURFACE REGIONS2.5 BULK PROPERTIES; 2.6 MODIFICATION OF SUBSTRATE SURFACES; 2.7 SUMMARY; FURTHER READING; REFERENCES; Chapter 3. The Low-Pressure Gas and Vacuum Processing Environment; 3.1 INTRODUCTION; 3.2 GASES AND VAPORS; 3.3 GAS-SURFACE INTERACTIONS; 3.4 VACUUM ENVIRONMENT; 3.5 VACUUM PROCESSING SYSTEMS; 3.6 VACUUM PUMPING; 3.7 VACUUM AND PLASMA COMPATIBLE MATERIALS; 3.8 ASSEMBLY; 3.9 EVALUATING VACUUM SYSTEM PERFORMANCE; 3.10 PURCHASING A VACUUM SYSTEM FOR PVD PROCESSING; 3.11 CLEANING OF VACUUM SURFACES; 3.12 SYSTEM-RELATED CONTAMINATION 3.13 PROCESS-RELATED CONTAMINATION3.14 TREATMENT OF SPECIFIC MATERIALS; 3.15 SAFETY ASPECTS OF VACUUM TECHNOLOGY; 3.16 SUMMARY; FURTHER READING; REFERENCES; Chapter 4. The Low-Pressure Plasma Processing Environment; 4.1 INTRODUCTION; 4.2 THE PLASMA; 4.3 PLASMA-SURFACE INTERACTIONS; 4.4 CONFIGURATIONS FOR GENERATING PLASMAS; 4.5 ION AND PLASMA SOURCES; 4.6 PLASMA PROCESSING SYSTEMS; 4.7 PLASMA-RELATED CONTAMINATION; 4.8 SOME SAFETY ASPECTS OF PLASMA PROCESSING; 4.9 SUMMARY; FURTHER READING; REFERENCES; Chapter 5. Vacuum Evaporation and Vacuum Deposition; 5.1 INTRODUCTION 5.2 THERMAL VAPORIZATION5.3 THERMAL VAPORIZATION SOURCES; 5.4 TRANSPORT OF VAPORIZED MATERIAL; 5.5 CONDENSATION OF VAPORIZED MATERIAL; 5.6 MATERIALS FOR EVAPORATION; 5.7 VACUUM DEPOSITION CONFIGURATIONS; 5.8 PROCESS MONITORING AND CONTROL; 5.9 CONTAMINATION FROM THE VAPORIZATION SOURCE; 5.10 ADVANTAGES AND DISADVANTAGES OF VACUUM DEPOSITION; 5.11 SOME APPLICATIONS OF VACUUM DEPOSITION; 5.12 GAS EVAPORATION AND ULTRAFINE PARTICLES; 5.13 OTHER PROCESSES; 5.14 SUMMARY; FURTHER READING; REFERENCES; Chapter 6. Physical Sputtering and Sputter Deposition (Sputtering; 6.1 INTRODUCTION 6.2 PHYSICAL SPUTTERING6.3 SPUTTERING CONFIGURATIONS; 6.4 TRANSPORT OF THE SPUTTER-VAPORIZED SPECIES; 6.5 CONDENSATION OF SPUTTERED SPECIES; 6.6 SPUTTER DEPOSITION GEOMETRIES; 6.7 TARGETS AND TARGET MATERIALS; 6.8 PROCESS MONITORING AND CONTROL; 6.9 CONTAMINATION DUE TO SPUTTERING; 6.10 ADVANTAGES AND DISADVANTAGES OF SPUTTER DEPOSITION; 6.11 SOME APPLICATIONS OF SPUTTER DEPOSITION; 6.12 SUMMARY; FURTHER READING; REFERENCES; Chapter 7. Arc Vapor Deposition; 7.1 INTRODUCTION; 7.2 ARCS; 7.3 ARC SOURCE CONFIGURATIONS; 7.4 REACTIVE ARC DEPOSITION; 7.5 ARC MATERIALS 7.6 ARC VAPOR DEPOSITION SYSTEM |
| Record Nr. | UNINA-9911006867503321 |
|
Mattox D. M
|
||
| Westwood, NJ, : Noyes Publications, c1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||