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Advances in CMP/polishing technologies for the manufacture of electronic devices / / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa
| Advances in CMP/polishing technologies for the manufacture of electronic devices / / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Oxford, : Elsevier, 2012 |
| Descrizione fisica | 1 online resource (330 p.) |
| Disciplina | 671.35 |
| Altri autori (Persone) |
DoiToshiro K. <1947->
MarinescuIoan D KurokawaSyuhei |
| Soggetto topico | Grinding and polishing |
| ISBN |
1-283-35498-5
9786613354983 1-4377-7860-7 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; CMP/Polishing Technologies for the Manufacture of Electronic Devices; Copyright Page; Contents; Contributors; Preface; About the Authors; 1. Introduction; References; 2. Details of the Fabrication Process for Devices with a Silicon Crystal Substrate; 2.1 History of Semiconductor Devices and their Types; 2.2 Semiconductor Device Process Technology and current Situation; 2.2.1 Element Isolation Structure; 2.2.2 Multilayer Interconnections; References; 3. The Current Situation in Ultra-Precision Technology - Silicon Single Crystals as an Example
3.1 Production of Single Crystal Silicon3.2 Slicing: Pre- and Post-Process; 3.2.1 Slicing; 3.2.1.1 Introduction; 3.2.1.2 Abrasive Wire; Loose-Abrasive Wire; Comparison Between Wire Saw and ID Saw; Fundamentals of Free Abrasive Machining; Fixed-Abrasive Wire; Saw Damage on the Surface of Silicon Wafer; 3.2.1.3 Electrical Discharge Machining (EDM); 3.2.1.4 Wire Electrolytic-Spark Hybrid Machining; 3.2.2 Beveling; 3.3 Lapping of Silicon; 3.3.1 Introduction; 3.3.1.1 Brief History; 3.3.2 Lapping Mechanism; 3.3.3 Mathematical Model; 3.3.3.1 Ductile and Brittle Regime 3.3.3.2 Calculation of Material Removal Rate3.3.4 Kinematics; 3.3.4.1 Sliding Velocity; 3.3.4.2 Equation for Streaks on a Work Piece; 3.3.4.3 Equations for Streaks on a Lap; 3.3.4.4 Effects of Different Parameters on Material Removal Rate; Effect of Lapping Pressure on the MRR; Effect of Abrasive Size on the MRR; 3.3.5 Types of Lapping (Focus: Double-Sided Lapping); 3.3.5.1 Double-Sided Lapping; 3.3.5.2 Mechanism; 3.3.5.3 Machine Set-up; 3.3.5.4 Process Cycle; 3.3.5.5 Advantages of Double-Sided Lapping; 3.3.5.6 Parameters of Double-Sided Lapping; 3.3.5.7 Lapping with Bonded Abrasives 3.3.5.8 Process Capabilities for Lapping3.3.6 Abrasives and Lubricants; 3.3.6.1 Types of Abrasives; (1) Diamond; (2) Cubic Boron Nitride (CBN); (3) Norbide Abrasive; (4) Silicon Carbide; (5) Aluminum Oxide; (6) Fused Aluminas; (7) Corundum; (8) Garnet; (9) Unfused Alumina (hydrated-calcined); (10) Micro-Graded Flours; (11) Linde Powders; (12) Other Abrasive Materials; 3.3.7 Equipment; 3.3.7.1 Lapping Plate; 3.3.7.2 Charging of the Lapping Plate; 3.3.7.3 Different Types of Lapping Plate; 3.3.7.4 Carriers Used in Double-Sided Lapping; 3.3.7.5 Ultrasonic Cleaner; 3.3.8 Abrasive Slurry 3.3.8.1 Abrasives3.3.9 Introduction to Silicon; 3.3.10 Lapping of Silicon Wafers - Experiments; 3.3.10.1 Mounting the Wafer; 3.3.10.2 Double-Sided Lapping Kinematics; 3.3.10.3 Lapping Process; 3.3.10.4 Effects of Lapping Wheels; 3.3.10.5 Slurry and Its Effects; 3.3.10.6 Silicon Machining; 3.3.10.7 Common Lapping Wheel Problems and Solutions; 3.3.11 Lapping Machine; 3.3.12 Experimental Set-up; 3.3.13 Experimental Results; Plots; Equations Used to Calculate the Material Removal Rate; Observations; 3.3.14 Conclusions; 3.4 Etching; 3.4.1 Acid Etching of Silicon; 3.4.2 Alkaline Etching of Silicon 3.5 Ultra-Precision Polishing/CMP of Silicon Wafers |
| Record Nr. | UNINA-9911004748103321 |
| Oxford, : Elsevier, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Handbook of ceramics grinding and polishing : properties, processes, technology, tools and typology / / edited by Ioan D. Marinescu, Hans Kurt Tonshoff, and Ichiro Inasaki
| Handbook of ceramics grinding and polishing : properties, processes, technology, tools and typology / / edited by Ioan D. Marinescu, Hans Kurt Tonshoff, and Ichiro Inasaki |
| Pubbl/distr/stampa | Park Ridge, N.J., : Noyes Publications |
| Descrizione fisica | 1 online resource (501 p.) |
| Disciplina | 666 |
| Altri autori (Persone) |
MarinescuIoan D
TonshoffH. K (Hans Kurt) InasakiIchiro |
| Collana | Materials science and process technology series |
| Soggetto topico |
Grinding and polishing
Ceramic materials |
| ISBN |
1-282-00258-9
9786612002588 0-8155-1741-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Handbook of Ceramic Grinding and Polishing; Copyright Page; Contents; Chapter 1. Properties of Ceramics; 1.0 INTRODUCTION; 2.0 WEAR MECHANISMS OF CERAMICS MATERIALS; 3.0 FUNDAMENTAL PROPERTIES AND SELECTION CRITERIA; 4.0 MICROSTRUCTURAL REINFORCEMENT OF CERAMICS; 5.0 CONCLUSION AND OUTLOOK; REFERENCES; Chapter 2. Deformation and Fracture of Ceramics Materials; 1.0 DEFORMATION; 2.0 DISLOCATION; 3.0 SLIP MECHANISM; 4.0 TWINNING MECHANISM; 5.0 FRACTURE OF CERAMIC MATERIALS; 6.0 INDENTATION IN CERAMIC MATERIALS; REFERENCES; Chapter 3. Abrasive Processes
1.0 TYPOLOGY OF ABRASIVE PROCESSES2.0 TRIBOLOGY OF ABRASIVE PROCESSES; 3.0 SINGLE POINT SCRATCH TESTS; 4.0 MULTI POINT SCRATCH TESTS; 5.0 GENERAL MODEL OF ABRASIVE PROCESSES; 6.0 SURFACE TOPOGRAPHY AND SURFACE INTEGRITY; REFERENCES; Chapter 4. Grinding; 1.0 FUNDAMENTALS OF GRINDING; 2.0 GRINDING TOOLS; 3.0 THE CONDITIONING OF GRINDING WHEEL-DRESSING AND TRUEING; 4.0 WEAR MECHANISM; 5.0 COOL LUBRICATION; 6.0 ENVIRONMENTAL ASPECTS; 7.0 PROPERTIES OF GROUND SURFACES; 8.0 GRINDING MACHINES; REFERENCES; Chapter 5. Honing and Superfinishing; 1.0 TYPOLOGY OF THE HONING PROCESS 2.0 HONING AND SUPERFINISHING TOOLS3.0 HONING AND SUPERFINISHING MACHINE; 4.0 HONING TECHNOLOGY; 5.0 SUMMARY; REFERENCES; Chapter 6. Lapping and Polishing; 1.0 INTRODUCTION; 2.0 TYPOLOGY OF PROCESSES WITH LOOSE ABRASIVES; 3.0 LAPPING; 4.0 POLISHING; 5.0 CHEMICAL COMPOUND POLISHING; 6.0 ULTRASONIC LAPPING; REFERENCES; Appendix: Manufacturing of Ceramic Components: Case Studies; Index |
| Record Nr. | UNINA-9911004783403321 |
| Park Ridge, N.J., : Noyes Publications | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Tribology of abrasive machining processes / / Ioan D. Marinescu ... [et al.]
| Tribology of abrasive machining processes / / Ioan D. Marinescu ... [et al.] |
| Pubbl/distr/stampa | Norwich, NY, : William Andrew Pub., c2004 |
| Descrizione fisica | 1 online resource (753 p.) |
| Disciplina | 621.8/9 |
| Altri autori (Persone) | MarinescuIoan D |
| Soggetto topico |
Grinding and polishing
Tribology |
| ISBN |
9786612769580
1-282-76958-8 0-08-094702-6 1-282-02769-7 9786612027697 0-8155-1938-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Tribology of Abrasive Machining Processes; Copyright Page; Table of Contents; Chapter 1. Introduction; 1.1 ABRASIVE PROCESSES; 1.2 ABRASIVES; 1.3 TRIBOLOGICAL PRINCIPLES; 1.4 A TYPICAL GRINDING PROCESS; 1.5 A TRIBOLOGICAL SYSTEM; REFERENCES; Chapter 2. Tribosystems of Abrasive Machining Processes; 2.1 INTRODUCTION; 2.2 STRUCTURE OF TRIBOMECHANICAL PROCESSING; 2.3 THE THREE TRIBOSYSTEMS IN ABRASIVE MACHINING; 2.4 MODELING TRIBOSYSTEMS OF ABRASIVE PROCESSES; 2.5 CONCLUSIONS; REFERENCES; Chapter 3. Kinematic Models of Abrasive Contacts; 3.1 INTRODUCTION
3.2 BASIC ANALYSIS OF SURFACE GRINDING3.3 CYLINDRICAL GRINDING CONTACTS; 3.4 IMPLICATIONS OF THE STOCHASTIC NATURE OF GRINDING; 3.5 EFFECT OF DRESSING; 3.6 SUMMARY OF PRINCIPAL KINEMATIC PARAMETERS; REFERENCES; Chapter 4. Contact Mechanics; 4.1 CONTACT AREA; 4.2 CONTACT LENGTH; 4.3 SMOOTH BODY ANALYSIS; 4.4 ROUGH SURFACE ANALYSIS; 4.5 EXPERIMENTAL MEASUREMENTS OF ROUGHNESS FACTOR (Rr); 4.6 ELASTIC STRESSES DUE TO ABRASION; 4.7 SUMMARY OF CONTACT STRESS IMPLICATIONS; REFERENCES; Chapter 5. Forces, Friction, and Energy; 5.1 INTRODUCTION; 5.2 FORCES AND POWER 5.3 FORCES: SPECIFIC ENERGY AND EFFICIENCY5.4 EXAMPLES OF MATERIALS AND THEIR GRINDING CONDITIONS; 5.5 THE SIZE EFFECT; 5.6 EFFECT OF WEAR FLAT AREA ON SPECIFIC ENERGY; 5.7 WEAR AND DRESSING CONDITIONS; 5.8 EFFECT OF DRESSING TOOL WEAR; 5.9 THE NATURE OF THE GRINDING FORCES; 5.10 FORCE RATIO AND FRICTION COEFFICIENT; 5.11 ADHESIVE AND ABRASIVE WHEEL WEAR; 5.12 SLIP-LINE FIELD SOLUTIONS; 5.13 THREE-DIMENSIONAL PYRAMID MODEL OF GRINDING; 5.14 LIMIT CHARTS; 5.15 PROCESS OPTIMIZATION AND WHEELSPEED; REFERENCES; Chapter 6. Thermal Design of Processes; 6.1 INTRODUCTION 6.2 EXAMPLES OF SURFACE DAMAGE6.3 THERMAL MODELING-KEY DEVELOPMENTS; 6.4 RATE OF HEAT GENERATION; 6.5 TEMPERATURES IN GRINDING; 6.6 HEAT CONDUCTION IN THE WORKPIECE; 6.7 FLUX DISTRIBUTION; 6.8 PECLET NUMBER; 6.9 TEMPERATURES IN THE CONTACT AREA; 6.10 HEAT FLOWS IN THE CONTACT AREA AND PARTITIONING; 6.11 CASE STUDIES ON PROCESS VARIATIONS AND PROCESS DESIGN; 6.12 SUBSURFACE TEMPERATURES; 6.13 WORK-ABRASIVE PARTITION RATIO - Rws; APPENDIX; REFERENCES; Chapter 7. Molecular Dynamics for Abrasive Process Simulation; 7.1 INTRODUCTION; 7.2 CONCEPT AND BASIC ELEMENTS OF MOLECULAR DYNAMICS 7.3 REQUIREMENTS FOR MOLECULAR DYNAMICS SIMULATIONS OF ABRASIVE PROCESSES7.4 APPLICATION EXAMPLES FOR MOLECULAR DYNAMICS SIMULATION OF ABRASIVE PROCESSES; 7.5 SUMMARY AND OUTLOOK; REFERENCES; Chapter 8. Fluid Delivery; 8.1 THE ROLE OF PROCESS FLUIDS; 8.2 OVERCOMING THE AIR BARRIER IN HIGH SPEED GRINDING; 8.3 NOZZLES FOR HIGH SPEED GRINDING; 8.4 ENERGY AND MOMENTUM REQUIREMENTS OF THE PROCESS FLUID; 8.5 USEFUL FLOWRATE THROUGH THE GRINDING CONTACT; 8.6 MECHANICS OF COOLING IN CREEP GRINDING; 8.7 SUMMARY OF CONCLUSIONS; REFERENCES Chapter 9. Electrolytic In-process Dressing (ELID) Grinding and Polishing |
| Record Nr. | UNINA-9911006982403321 |
| Norwich, NY, : William Andrew Pub., c2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||