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Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
| Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
| Descrizione fisica | 1 online resource (72 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) |
BaileyChristopher
LiuJohan |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Manufacturing processes
Electronic packaging |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
| Record Nr. | UNINA-9910450385003321 |
| Bradford, England, : Emerald Group Publishing, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
| Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
| Descrizione fisica | 1 online resource (72 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) |
BaileyChristopher
LiuJohan |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Manufacturing processes
Electronic packaging |
| ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
| Record Nr. | UNINA-9910783539503321 |
| Bradford, England, : Emerald Group Publishing, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
| Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
| Descrizione fisica | 1 online resource (72 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) |
BaileyChristopher
LiuJohan |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Manufacturing processes
Electronic packaging |
| ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
| Record Nr. | UNINA-9910825844003321 |
| Bradford, England, : Emerald Group Publishing, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||