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Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.]
| Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.] |
| Pubbl/distr/stampa | Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 |
| Descrizione fisica | 1 online resource (851 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | LiuDuixian |
| Soggetto topico |
Millimeter wave devices
Millimeter waves |
| Soggetto genere / forma | Electronic books. |
| ISBN |
0-470-74296-8
9781282031388 1-282-03138-4 9786612031380 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
1 Introduction ; 1.1 Challenges ; 1.2 Discussion Framework ; 1.3 Circuits ; 1.4 Antenna ; 1.5 RF Electronics ; .5.1 Receiver ; 1.5.2 Transmitter ; 1.6 Packaging ; 1.7 Organization and Flow of this Book ; References ; 2 Millimeter-wave Packaging ; 2.1 Introduction ; 2.1.1 Definition of Packaging ; 2.1.2 Packaging Challenges and Future Directions ; 2.2 Review of Microwave Packaging Technologies ; 2.2.1 MMICs ; .4.7 Wafer-level Packaging and Assembly of mmWave Devices ; 2.5 Package Codesign at mmWaves ; 2.5.1 Electromagnetic Modeling of mmWave Packages and Interconnects ; 2.5.2 Integrated Antennas ; References ; 3 Dielectric Properties at Millimeter-wave and THz Bands ; 3.1 Introduction ; 3.2 Dielectric Characterization""; 3.3 Outside the THz Gap �Material Characterization Techniques ; 3.3.1 Parallel Plate (~DC�30 MHz) ; 3.3.2 Resonant Cavity (~0.5�50 GHz) ; 3.3.3 Transmission Line Methods (~0.01�300 GHz) ; 3.3.4 THz TDS (~0.1�10 THz) ;
3.4 THz TDS (~0.1�10 THz) ; 3.4.1 Transmission ; 3.4.2 Error Analysis ; 3.5 Dielectric Properties ; 3.5.1 Semiconductors ; 3.5.2 Ceramic Materials ; 3.5.3 Thin Films ; 3.5.4 Metamaterials ; 3.5.5 Biomaterials ; 3.5.6 Material Needs ; References ; 4 Millimeter-wave Interconnects ; 4.1 Introduction ; 4.2 Interconnects at Millimeter-wave Frequencies 4.2.1 Printed Planar Transmission Lines ; 4.2.2 Metal Rectangular Waveguides ; 4.3 Interconnect Technology Options for Millimeter-wave Applications ; 4.3.1 Basic Technological Requirements ; 4.3.2 MCM-L ; 4.3.3 LTCC ; 4.3.4 MCM-D ; 4.3.5 Flexible Substrates ; 4.3.6 Silicon Micromachining ; 4.3.7 Plastic Injection Molding ; 4.4 Performance-oriented Interconnect Technology Optimization ; 4.4.1 Performance-oriented BCB Dielectric Thickness Optimization ; 4.4.2 Transmission Line Discontinuities and Distributed Passives ; 4.4.3 Bends ; 4.5 Chip-to-package Interconnects at Millimeter-wave Frequencies ; 4.5.1 Wirebonding ; 4.5.2 Flip-chip Bonding ; 4.5.3 Alternative Chip Interconnection Methods ; References ; 5 Printed Millimeter Antennas � Multilayer Technologies |
| Record Nr. | UNINA-9910146114003321 |
| Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.]
| Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.] |
| Pubbl/distr/stampa | Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 |
| Descrizione fisica | 1 online resource (851 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | LiuDuixian |
| Soggetto topico |
Millimeter wave devices
Millimeter waves |
| ISBN |
0-470-74296-8
1-282-03138-4 9786612031380 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
1 Introduction ; 1.1 Challenges ; 1.2 Discussion Framework ; 1.3 Circuits ; 1.4 Antenna ; 1.5 RF Electronics ; .5.1 Receiver ; 1.5.2 Transmitter ; 1.6 Packaging ; 1.7 Organization and Flow of this Book ; References ; 2 Millimeter-wave Packaging ; 2.1 Introduction ; 2.1.1 Definition of Packaging ; 2.1.2 Packaging Challenges and Future Directions ; 2.2 Review of Microwave Packaging Technologies ; 2.2.1 MMICs ; .4.7 Wafer-level Packaging and Assembly of mmWave Devices ; 2.5 Package Codesign at mmWaves ; 2.5.1 Electromagnetic Modeling of mmWave Packages and Interconnects ; 2.5.2 Integrated Antennas ; References ; 3 Dielectric Properties at Millimeter-wave and THz Bands ; 3.1 Introduction ; 3.2 Dielectric Characterization""; 3.3 Outside the THz Gap �Material Characterization Techniques ; 3.3.1 Parallel Plate (~DC�30 MHz) ; 3.3.2 Resonant Cavity (~0.5�50 GHz) ; 3.3.3 Transmission Line Methods (~0.01�300 GHz) ; 3.3.4 THz TDS (~0.1�10 THz) ;
3.4 THz TDS (~0.1�10 THz) ; 3.4.1 Transmission ; 3.4.2 Error Analysis ; 3.5 Dielectric Properties ; 3.5.1 Semiconductors ; 3.5.2 Ceramic Materials ; 3.5.3 Thin Films ; 3.5.4 Metamaterials ; 3.5.5 Biomaterials ; 3.5.6 Material Needs ; References ; 4 Millimeter-wave Interconnects ; 4.1 Introduction ; 4.2 Interconnects at Millimeter-wave Frequencies 4.2.1 Printed Planar Transmission Lines ; 4.2.2 Metal Rectangular Waveguides ; 4.3 Interconnect Technology Options for Millimeter-wave Applications ; 4.3.1 Basic Technological Requirements ; 4.3.2 MCM-L ; 4.3.3 LTCC ; 4.3.4 MCM-D ; 4.3.5 Flexible Substrates ; 4.3.6 Silicon Micromachining ; 4.3.7 Plastic Injection Molding ; 4.4 Performance-oriented Interconnect Technology Optimization ; 4.4.1 Performance-oriented BCB Dielectric Thickness Optimization ; 4.4.2 Transmission Line Discontinuities and Distributed Passives ; 4.4.3 Bends ; 4.5 Chip-to-package Interconnects at Millimeter-wave Frequencies ; 4.5.1 Wirebonding ; 4.5.2 Flip-chip Bonding ; 4.5.3 Alternative Chip Interconnection Methods ; References ; 5 Printed Millimeter Antennas � Multilayer Technologies |
| Record Nr. | UNINA-9910831030403321 |
| Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced millimeter-wave technologies : antennas, packaging and circuits / / Duixian Liu ... [et al.]
| Advanced millimeter-wave technologies : antennas, packaging and circuits / / Duixian Liu ... [et al.] |
| Pubbl/distr/stampa | Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 |
| Descrizione fisica | 1 online resource (851 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | LiuDuixian |
| Soggetto topico |
Millimeter wave devices
Millimeter waves |
| ISBN |
0-470-74296-8
1-282-03138-4 9786612031380 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
1 Introduction ; 1.1 Challenges ; 1.2 Discussion Framework ; 1.3 Circuits ; 1.4 Antenna ; 1.5 RF Electronics ; .5.1 Receiver ; 1.5.2 Transmitter ; 1.6 Packaging ; 1.7 Organization and Flow of this Book ; References ; 2 Millimeter-wave Packaging ; 2.1 Introduction ; 2.1.1 Definition of Packaging ; 2.1.2 Packaging Challenges and Future Directions ; 2.2 Review of Microwave Packaging Technologies ; 2.2.1 MMICs ; .4.7 Wafer-level Packaging and Assembly of mmWave Devices ; 2.5 Package Codesign at mmWaves ; 2.5.1 Electromagnetic Modeling of mmWave Packages and Interconnects ; 2.5.2 Integrated Antennas ; References ; 3 Dielectric Properties at Millimeter-wave and THz Bands ; 3.1 Introduction ; 3.2 Dielectric Characterization""; 3.3 Outside the THz Gap �Material Characterization Techniques ; 3.3.1 Parallel Plate (~DC�30 MHz) ; 3.3.2 Resonant Cavity (~0.5�50 GHz) ; 3.3.3 Transmission Line Methods (~0.01�300 GHz) ; 3.3.4 THz TDS (~0.1�10 THz) ;
3.4 THz TDS (~0.1�10 THz) ; 3.4.1 Transmission ; 3.4.2 Error Analysis ; 3.5 Dielectric Properties ; 3.5.1 Semiconductors ; 3.5.2 Ceramic Materials ; 3.5.3 Thin Films ; 3.5.4 Metamaterials ; 3.5.5 Biomaterials ; 3.5.6 Material Needs ; References ; 4 Millimeter-wave Interconnects ; 4.1 Introduction ; 4.2 Interconnects at Millimeter-wave Frequencies 4.2.1 Printed Planar Transmission Lines ; 4.2.2 Metal Rectangular Waveguides ; 4.3 Interconnect Technology Options for Millimeter-wave Applications ; 4.3.1 Basic Technological Requirements ; 4.3.2 MCM-L ; 4.3.3 LTCC ; 4.3.4 MCM-D ; 4.3.5 Flexible Substrates ; 4.3.6 Silicon Micromachining ; 4.3.7 Plastic Injection Molding ; 4.4 Performance-oriented Interconnect Technology Optimization ; 4.4.1 Performance-oriented BCB Dielectric Thickness Optimization ; 4.4.2 Transmission Line Discontinuities and Distributed Passives ; 4.4.3 Bends ; 4.5 Chip-to-package Interconnects at Millimeter-wave Frequencies ; 4.5.1 Wirebonding ; 4.5.2 Flip-chip Bonding ; 4.5.3 Alternative Chip Interconnection Methods ; References ; 5 Printed Millimeter Antennas � Multilayer Technologies |
| Record Nr. | UNINA-9910877996703321 |
| Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Antenna-in-package technology and applications / / edited by Duixian Liu, Yueping Zhang
| Antenna-in-package technology and applications / / edited by Duixian Liu, Yueping Zhang |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley-IEEE Press, , [2020] |
| Descrizione fisica | 1 online resource (518 pages) |
| Disciplina | 621.3824 |
| Soggetto topico | Microstrip antennas |
| ISBN |
1-119-55664-3
1-119-55667-8 1-119-55665-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. |
| Record Nr. | UNINA-9910555157103321 |
| Hoboken, New Jersey : , : Wiley-IEEE Press, , [2020] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Antenna-in-package technology and applications / / edited by Duixian Liu, Yueping Zhang
| Antenna-in-package technology and applications / / edited by Duixian Liu, Yueping Zhang |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley-IEEE Press, , [2020] |
| Descrizione fisica | 1 online resource (518 pages) |
| Disciplina | 621.3824 |
| Soggetto topico | Microstrip antennas |
| ISBN |
1-119-55664-3
1-119-55667-8 1-119-55665-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. |
| Record Nr. | UNINA-9910830709603321 |
| Hoboken, New Jersey : , : Wiley-IEEE Press, , [2020] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Handbook of Antenna Technologies / / edited by Zhi Ning Chen, Duixian Liu, Hisamatsu Nakano, Xianming Qing, Thomas Zwick
| Handbook of Antenna Technologies / / edited by Zhi Ning Chen, Duixian Liu, Hisamatsu Nakano, Xianming Qing, Thomas Zwick |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (2473 illus., 1425 illus. in color. eReference.) |
| Disciplina | 621.3824 |
| Soggetto topico |
Electrical engineering
Signal processing Image processing Speech processing systems Microwaves Optical engineering Communications Engineering, Networks Signal, Image and Speech Processing Microwaves, RF and Optical Engineering |
| ISBN | 981-4560-44-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Theory -- Design -- Applications. . |
| Record Nr. | UNINA-9910254234203321 |
| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||