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IC Component Sockets
| IC Component Sockets |
| Autore | Liu Weifeng |
| Pubbl/distr/stampa | [Place of publication not identified], : John Wiley & Sons Incorporated, 2004 |
| Descrizione fisica | 1 online resource (230 pages) |
| Disciplina | 621.381531 |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-55666-8
9786610556663 0-471-64826-4 0-471-64827-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910146057603321 |
Liu Weifeng
|
||
| [Place of publication not identified], : John Wiley & Sons Incorporated, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
IC Component Sockets
| IC Component Sockets |
| Autore | Liu Weifeng |
| Pubbl/distr/stampa | [Place of publication not identified], : John Wiley & Sons Incorporated, 2004 |
| Descrizione fisica | 1 online resource (230 pages) |
| Disciplina | 621.381531 |
| Soggetto topico |
Printed circuits - Equipment and supplies
Electric connectors Microelectronic packaging |
| ISBN |
1-280-55666-8
9786610556663 0-471-64826-4 0-471-64827-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. IC Component Socket Overview -- 2. Component Socket Properties -- 3. IC Component Socket Materials -- 4. Component Sockets for PTH Packages -- 5. Component Sockets for J-Leaded Packages -- 6. Component Sockets for Gull-wing Packages -- 7. Component Sockets for BGA Packages -- 8. Component Sockets for LGA Packages -- 9. Failure Modes and Mechanisms -- 10. Socket Testing and Qualification -- 11. Reliability Assessment -- 12. Standards and Specifications -- App. B. Socket Manufacturers. |
| Record Nr. | UNINA-9910830106603321 |
|
Liu Weifeng
|
||
| [Place of publication not identified], : John Wiley & Sons Incorporated, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
IC Component Sockets
| IC Component Sockets |
| Autore | Liu Weifeng |
| Pubbl/distr/stampa | [Place of publication not identified], : John Wiley & Sons Incorporated, 2004 |
| Descrizione fisica | 1 online resource (230 pages) |
| Disciplina | 621.381531 |
| Soggetto topico |
Printed circuits - Equipment and supplies
Electric connectors Microelectronic packaging |
| ISBN |
1-280-55666-8
9786610556663 0-471-64826-4 0-471-64827-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. IC Component Socket Overview -- 2. Component Socket Properties -- 3. IC Component Socket Materials -- 4. Component Sockets for PTH Packages -- 5. Component Sockets for J-Leaded Packages -- 6. Component Sockets for Gull-wing Packages -- 7. Component Sockets for BGA Packages -- 8. Component Sockets for LGA Packages -- 9. Failure Modes and Mechanisms -- 10. Socket Testing and Qualification -- 11. Reliability Assessment -- 12. Standards and Specifications -- App. B. Socket Manufacturers. |
| Record Nr. | UNINA-9911019322703321 |
|
Liu Weifeng
|
||
| [Place of publication not identified], : John Wiley & Sons Incorporated, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||