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Adhesives technology for electronic applications : materials, processes, reliability / / by James J. Licari and Dale W. Swanson
| Adhesives technology for electronic applications : materials, processes, reliability / / by James J. Licari and Dale W. Swanson |
| Autore | Licari James J. <1930-> |
| Pubbl/distr/stampa | Norwich, NY, : William Andrew Pub., c2005 |
| Descrizione fisica | 1 online resource (477 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | SwansonDale W |
| Collana | Materials and processes for electronic applications series |
| Soggetto topico |
Electronics - Materials
Adhesives Electronic packaging |
| ISBN |
1-282-01328-9
9786612013287 0-8155-1600-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Adhesives Technology for Electronic Applications: Materials, Processes, Reliability; Copyright Page; Table of Contents; Chapter 1. Introduction; 1.1 ADHESIVE TYPES AND DEFINITIONS; 1.2 SUMMARY OF PACKAGING TECHNOLOGIES; 1.3 HISTORY OF ADHESIVES IN ELECTRONIC APPLICATIONS; 1.4 COMPARISON OF POLYMER ADHESIVES WITH METALLURGICAL AND VITREOUS ATTACHMENT MATERIALS; 1.5 SPECIFICATIONS; 1.6 THE MARKET; REFERENCES; Chapter 2. Functions and Theory of Adhesives; 2.1 MECHANICAL ATTACHMENT; 2.2 ELECTRICAL CONNECTIONS; 2.3 THERMAL DISSIPATION; 2.4 STRESS DISSIPATION; REFERENCES
Chapter 3. Chemistry, Formulation, and Properties of Adhesives3.1 CHEMISTRY; 3.2 FORMULATION; 3.3 PROPERTIES; REFERENCES; Chapter 4. Adhesive Bonding Processes; 4.1 CLEANING; 4.2 SURFACE TREATMENTS; 4.3 ADHESIVE DISPENSING; 4.4 PLACEMENT OF DEVICES AND COMPONENTS; 4.5 CURING; 4.6 REWORK; REFERENCES; Chapter 5. Applications; 5.1 GENERAL APPLICATIONS; 5.2 SPECIFIC APPLICATIONS; REFERENCES; Chapter 6. Reliability; 6.1 FAILURE MODES AND MECHANISMS; 6.2 SPECIFICATIONS; REFERENCES; Chapter 7. Test and Inspection Methods; 7.1 PHYSICAL TESTS; 7.2 ELECTRICAL TESTS; 7.3 ENVIRONMENTAL TESTS 7.4 THERMAL TESTS7.5 MECHANICAL AND THERMOMECHANICAL TESTS; 7.6 CHEMICAL ANALYSIS; REFERENCES; Appendix; CONVERSION FACTORS; ABBREVIATIONS, ACRONYMS, AND SYMBOLS; Index |
| Record Nr. | UNINA-9911004800603321 |
Licari James J. <1930->
|
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| Norwich, NY, : William Andrew Pub., c2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Coating materials for electronic applications : polymers, processes, reliability, testing / / James J. Licari
| Coating materials for electronic applications : polymers, processes, reliability, testing / / James J. Licari |
| Autore | Licari James J. <1930-> |
| Pubbl/distr/stampa | Norwich, NY, : Noyes Publications/William Andrew Publ., 2003 |
| Descrizione fisica | 1 online resource (553 p.) |
| Disciplina | 621.381 |
| Collana | Materials and Processes for Electronic Applications |
| Soggetto topico |
Protective coatings
Electronics - Materials |
| ISBN |
1-282-01355-6
9786612013553 0-08-094704-2 0-8155-1647-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Coating Materials for Electronic Applications: Polymers, Processes, Reliability, Testing; Copyright Page; Table of Contents; Chapter 1. Functions and Requirements of Coatings for Electronic Applications; 1.1 FUNCTIONS AND REQUIREMENTS; 1.2 ENVIRONMENTAL PROTECTION FUNCTIONS; 1.3 SPECIAL METAL PROTECTION; 1.4 ELECTRICAL FUNCTIONS; 1.5 THERMAL FUNCTIONS; REFERENCES; Chapter 2. Chemistry and Properties of Polymer Coatings; 2.1 ACRYLICS; 2.2 POLYESTERS; 2.3 POLYVINYLS; 2.4 POLYSTYRENES; 2.5 DIALLYLPHTHALATE AND OTHER ALLYLIC POLYMERS; 2.6 EPOXIES; 2.7 POLYURETHANES; 2.8 SILICONES
2.9 POLYIMIDES2.10 P-POLYXYLYLENES (PARYLENES); 2.11 BENZOCYCLOBUTENE, CYCLOTENE®; 2.12 FLUOROCARBONS AND FLUORINATED POLYMERS; 2.13 POLYSULFONES; 2.14 POLYARYLETHERETHERKETONE, PEEK; 2.15 POLYAMIDES; 2.16 PHENOLICS; 2.17 POLYSULFIDES; REFERENCES; Chapter 3. Manufacturing Technology; 3.1 MASKING; 3.2 CLEANING; 3.3 SURFACE PREPARATION; 3.4 COATING PREPARATION; 3.5 APPLICATION METHODS; 3.6 CURING AND POLYMERIZATION PROCESSES; 3.7 MANUFACTURING ISSUES; REFERENCES; Chapter 4. Applications; 4.1 CONFORMAL COATINGS FOR PRINTED WIRING ASSEMBLIES (PWA) 4.2 COATINGS FOR SEMICONDUCTOR SINGLE CHIP AND MULTICHIP MODULES4.3 COATINGS FOR DISCRETE PASSIVE DEVICES; 4.4 MULTILAYER CIRCUIT BOARD FABRICATION; 4.5 INTERLAYER DIELECTRIC COATINGS FOR MULTICHIP MODULE SUBSTRATES; 4.6 POLYMER WAVEGUIDES; 4.7 SOLDER MASKANTS; 4.8 CHIP-SCALE AND BALL GRID ARRAY PACKAGES; 4.9 CHIP-ON-BOARD (COB) AND GLOB-TOP COATINGS; 4.10 PARTICLE IMMOBILIZING COATINGS AND PARTICLE GETTERS; 4.11 REINFORCEMENT OF INTERCONNECTIONS; 4.12 WIRE AND COIL COATINGS; 4.13 COATINGS FOR SPACE APPLICATIONS; 4.14 COATINGS FOR AUTOMOTIVE APPLICATIONS 4.15 COATINGS FOR ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING AND ELECTROSTATIC DISCHARGE (ESD)4.16 COATINGS FOR MEDICAL APPLICATIONS; 4.17 TAMPER-PROOF COATINGS; 4.18 TEMPORARY COATINGS; 4.19 POLYMER THICK FILMS; REFERENCES; Chapter 5. Reliability Assurance and Testing; 5.1 INITIAL QUALIFICATION; 5.2 RECEIVING INSPECTION; 5.3 IN-PROCESS INSPECTION AND TESTING; 5.4 FINAL INSPECTION AND TEST; 5.5 RELIABILITY PREDICTION; 5.6 FAILURE MODES AND MECHANISMS; 5.7 TEST PROCEDURES FOR CONTAMINANTS AND CLEANLINESS ASSURANCE; 5.8 ACCELERATED STRESS AND ENVIRONMENTAL TESTS 5.9 TESTS FOR COATING INTEGRITY5.10 ADHESION; REFERENCES; Chapter 6. Test Methods; 6.1 PHYSICAL/MECHANICAL TEST METHODS; 6.2 ELECTRICAL TESTS; 6.3 ENVIRONMENTAL EXPOSURE TESTS; 6.4 THERMAL TESTS; 6.5 CHEMICAL/ANALYTICAL TESTS; REFERENCES; Chapter 7. Specifications and Documents; 7.1 TOP-LEVEL PERFORMANCE OR REQUIREMENTS SPECIFICATION; 7.2 MATERIAL SPECIFICATIONS; 7.3 PROCESS SPECIFICATIONS; 7.4 WORK INSTRUCTIONS; 7.5 FAILURE ANALYSIS DOCUMENTATION; 7.6 MILITARY, SPACE, GOVERNMENT. AND INDUSTRY SPECIFICATIONS; 7.7 SPECIFICATIONS RELATING TO ORGANIC COATINGS; Appendix; Index |
| Record Nr. | UNINA-9911004783803321 |
|
Licari James J. <1930->
|
||
| Norwich, NY, : Noyes Publications/William Andrew Publ., 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Development of a qualification standard for adhesives used in hybrid microcircuits [[electronic resource] /] / J.J. Licari, B.L. Weigand, and C.A. Soykin
| Development of a qualification standard for adhesives used in hybrid microcircuits [[electronic resource] /] / J.J. Licari, B.L. Weigand, and C.A. Soykin |
| Autore | Licari James J. <1930-> |
| Pubbl/distr/stampa | [Huntsville], Ala. : , : National Aeronautics and Space Administration, George C. Marshall Space Flight Center, , [1981] |
| Descrizione fisica | 1 online resource (viii, pages 109) : illustrations |
| Altri autori (Persone) |
WeigandB. L
SoykinC. A |
| Collana | NASA contractor report |
| Soggetto topico |
Hybrid integrated circuits
Adhesion tests Adhesives Microelectronics Procedures Specifications Standards |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910701479703321 |
|
Licari James J. <1930->
|
||
| [Huntsville], Ala. : , : National Aeronautics and Space Administration, George C. Marshall Space Flight Center, , [1981] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Hybrid microcircuit technology handbook : materials, processes, design, testing, and production / / by James J. Licari and Leonard R. Enlow
| Hybrid microcircuit technology handbook : materials, processes, design, testing, and production / / by James J. Licari and Leonard R. Enlow |
| Autore | Licari James J. <1930-> |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Westwood, N.J., : Noyes Publications, c1998 |
| Descrizione fisica | 1 online resource (603 p.) |
| Disciplina |
621.3815
621.3815 21 |
| Altri autori (Persone) | EnlowLeonard R |
| Collana | Materials science and process technology series |
| Soggetto topico |
Hybrid integrated circuits - Design and construction
Integrated circuits - Design and construction |
| ISBN |
1-282-71173-3
9786612711732 9786612011047 0-08-094659-3 1-59124-255-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Hybrid Microcircuit Technology Handbook: Materials, Processes, Design, Testing and Production; Copyright Page; Contents; Chapter 1. Introduction; 1.0 CLASSIFICATION OF MATERIALS FOR MICROELECTRONICS; 2.0 CLASSIFICATION OF PROCESSES; 3.0 DEFINITION AND CHARACTERISTICS OF HYBRID CIRCUITS; 4.0 APPLICATIONS; REFERENCES; Chapter 2. Substrates; 1.0 FUNCTIONS; 2.0 SURFACE CHARACTERISTICS; 3.0 ALUMINA SUBSTRATES; 4.0 BERYLLIA SUBSTRATES; 5.0 ALUMINUM NITRIDE; 6.0 METAL MATRIX COMPOSITES; 7.0 CERAMIC SUBSTRATE MANUFACTURE; 8.0 ENAMELED METAL SUBSTRATES
9.0 QUALITY ASSURANCE AND TEST METHODSREFERENCES; Chapter 3. Thin Film Processes; 1.0 DEPOSITION PROCESSES; 2.0 THIN FILM RESISTOR PROCESSES; 3.0 PHOTORESIST MATERIALS AND PROCESSES; 4.0 ETCHING MATERIALS AND PROCESSES; 5.0 THIN-FILM MICROBRIDGE CROSSOVER CIRCUITS; REFERENCES; Chapter 4. Thick Film Processes; 1.0 FABRICATION PROCESSES; 2.0 DIRECT WRITING; 3.0 PASTE MATERIALS; 4.0 NON-NOBLE-METAL THICK FILMS; 5.0 POLYMER THICK FILMS; REFERENCES; Chapter 5. Resistor Trimming; 1.0 LASER TRIMMING; 2.0 ABRASIVE TRIMMING; 3.0 RESISTOR PROBING/MEASUREMENT TECHNIQUES; 4.0 TYPES OF RESISTOR TRIMS 5.0 SPECIAL REQUIREMENTSREFERENCES; Chapter 6. Parts Selection; 1.0 GENERAL CONSIDERATIONS; 2.0 PACKAGES; 3.0 ACTIVE DEVICES; 4.0 PASSIVE DEVICES; REFERENCES; Chapter 7. Assembly Processes; 1.0 INTRODUCTION; 2.0 DIE AND SUBSTRATE ATTACHMENT; 3.0 INTERCONNECTIONS; 4.0 CLEANING; 5.0 PARTICLE IMMOBILIZING COATINGS; 6.0 VACUUM-BARING AND SEALING; REFERENCES; Chapter 8. Testing; 1.0 ELECTRICAL TESTING; 2.0 VISUAL INSPECTION; 3.0 NONDESTRUCTIVE SCREEN TESTS; 4.0 DESTRUCTIVE SCREEN TESTS; REFERENCES; Chapter 9. Handling and Clean Rooms; 1.0 HANDLING OF HYBRID CIRCUITS AND COMPONENTS 2.0 ELECTROSTATIC DISCHARGEREFERENCES; Chapter 10. Design Guidelines; 1.0 HYBRID MICROCIRCUIT DESIGN TRANSMITTAL; 2.0 SYSTEM REQUIREMENTS AFFECTING HYBRID CIRCUIT DESIGN; 3.0 MATERIAL AND PROCESS SELECTION; 4.0 QUALITY ASSURANCE PROVISIONS; 5.0 HYBRID DESIGN PROCESS; 6.0 SUBSTRATE PARASITICS; 7.0 THERMAL CONSIDERATIONS; 8.0 LAYOUT GUIDELINES COMMON TO BOTH THICK - AND THIN-FILM HYBRIDS; 9.0 GUIDE TO HIGH-PERFORMANCE HYBRID/MCM/PACKAGE DESIGN; 10.0 EQUATIONS; 11.0 CROSS-TALK; 12.0 SIGNAL LINE CAPACITANCE; 13.0 SIGNAL-LINE INDUCTANCE; 14.0 MICROSTRIP PROPAGATION DELAY 15.0 TYPICAL MATERIAL THICKNESSES16.0 THICK-FILM MATERIALS AND PROCESSES DESCRIPTION; 17.0 THICK-FILM DESIGN GUIDELINES; 18.0 THIN-FILM GUIDELINES; REFERENCES; Chapter 11. Documentation and Specifications; 1.0 DOCUMENTATION; 2.0 MILITARY AND GOVERNMENT SPECIFICATIONS; REFERENCES; Chapter 12. Failure Analysis; 1.0 TYPES AND CAUSES OF HYBRID FAILURES; 2.0 FAILURE ANALYSIS TECHNIQUES; 3.0 ANALYTICAL TECHNIQUES; 4.0 CAUSES OF HYBRID CIRCUIT FAILURES; 5.0 CASE HISTORIES OF HYBRID CIRCUIT FAILURES; REFERENCES; Chapter 13. Multichip Modules: A New Breed of Hybrid Microcircuits; 1.0 APPLICATIONS 2.0 INTERCONNECT SUBSTRATE DESIGNS AND FABRICATION METHODS |
| Record Nr. | UNINA-9911006866303321 |
|
Licari James J. <1930->
|
||
| Westwood, N.J., : Noyes Publications, c1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||