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Organic thin film transistor integration [[electronic resource] ] : a hybrid approach / / Flora M. Li ... [et al.]
| Organic thin film transistor integration [[electronic resource] ] : a hybrid approach / / Flora M. Li ... [et al.] |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2011 |
| Descrizione fisica | 1 online resource (272 p.) |
| Disciplina | 621.381528 |
| Altri autori (Persone) | LiF. M (Flora M.) |
| Soggetto topico |
Organic thin films
Organic semiconductors |
| ISBN |
3-527-63446-0
3-527-63445-2 3-527-63444-4 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; About the Authors; Title Page; Copyright; Dedication; Preface; Glossary; Abbreviations; Mathematic Symbols; Definitions; Chapter 1: Introduction; 1.1 Organic Electronics: History and Market Opportunities; References; Chapter 2: Organic Thin Film Transistor (OTFT) Overview; 2.1 Organic Semiconductor Overview; 2.2 OTFT Operation and Characteristics; 2.3 OTFT Device Architecture; 2.4 OTFT Device Material Selection; 2.5 Summary; References; Chapter 3: OTFT Integration Strategies; 3.1 Technological Challenge in OTFT Integration; 3.2 Overview of Processing and Fabrication Techniques
3.3 OTFT Fabrication Schemes3.4 Summary and Contributions; References; Chapter 4: Gate Dielectrics by Plasma Enhanced Chemical Vapor Deposition (PECVD); 4.1 Overview of Gate Dielectrics; 4.2 Experimental Details and Characterization Methods; 4.3 Material Characterization of PECVD SiNx Films; 4.4 Electrical Characterization of OTFTs with PECVD Gate Dielectric; 4.5 Summary and Contributions; References; Chapter 5: Dielectric Interface Engineering; 5.1 Background; 5.2 Experimental Details; 5.3 Impact of Dielectric Surface Treatments; 5.4 Impact of Oxygen Plasma Exposure Conditions 5.5 Summary and ContributionsReferences; Chapter 6: Contact Interface Engineering; 6.1 Background; 6.2 Experimental Details; 6.3 Impact of Contact Surface Treatment by Thiol SAM; 6.4 Impact of Execution Sequence of Surface Treatment; 6.5 Summary and Contributions; References; Chapter 7: OTFT Circuits and Systems; 7.1 OTFT Requirements for Circuit Applications; 7.2 Applications; 7.3 Circuit Demonstration; 7.4 Summary, Contributions, and Outlook; References; Chapter 8: Outlook and Future Challenges; 8.1 Device Performance; 8.2 Device Manufacture; 8.3 Device Integration; References; Index |
| Record Nr. | UNINA-9910131028103321 |
| Weinheim, : Wiley-VCH, c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Organic thin film transistor integration : a hybrid approach / / Flora M. Li ... [et al.]
| Organic thin film transistor integration : a hybrid approach / / Flora M. Li ... [et al.] |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2011 |
| Descrizione fisica | 1 online resource (272 p.) |
| Disciplina | 621.381528 |
| Altri autori (Persone) | LiF. M (Flora M.) |
| Soggetto topico |
Organic thin films
Organic semiconductors |
| ISBN |
3-527-63446-0
3-527-63445-2 3-527-63444-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; About the Authors; Title Page; Copyright; Dedication; Preface; Glossary; Abbreviations; Mathematic Symbols; Definitions; Chapter 1: Introduction; 1.1 Organic Electronics: History and Market Opportunities; References; Chapter 2: Organic Thin Film Transistor (OTFT) Overview; 2.1 Organic Semiconductor Overview; 2.2 OTFT Operation and Characteristics; 2.3 OTFT Device Architecture; 2.4 OTFT Device Material Selection; 2.5 Summary; References; Chapter 3: OTFT Integration Strategies; 3.1 Technological Challenge in OTFT Integration; 3.2 Overview of Processing and Fabrication Techniques
3.3 OTFT Fabrication Schemes3.4 Summary and Contributions; References; Chapter 4: Gate Dielectrics by Plasma Enhanced Chemical Vapor Deposition (PECVD); 4.1 Overview of Gate Dielectrics; 4.2 Experimental Details and Characterization Methods; 4.3 Material Characterization of PECVD SiNx Films; 4.4 Electrical Characterization of OTFTs with PECVD Gate Dielectric; 4.5 Summary and Contributions; References; Chapter 5: Dielectric Interface Engineering; 5.1 Background; 5.2 Experimental Details; 5.3 Impact of Dielectric Surface Treatments; 5.4 Impact of Oxygen Plasma Exposure Conditions 5.5 Summary and ContributionsReferences; Chapter 6: Contact Interface Engineering; 6.1 Background; 6.2 Experimental Details; 6.3 Impact of Contact Surface Treatment by Thiol SAM; 6.4 Impact of Execution Sequence of Surface Treatment; 6.5 Summary and Contributions; References; Chapter 7: OTFT Circuits and Systems; 7.1 OTFT Requirements for Circuit Applications; 7.2 Applications; 7.3 Circuit Demonstration; 7.4 Summary, Contributions, and Outlook; References; Chapter 8: Outlook and Future Challenges; 8.1 Device Performance; 8.2 Device Manufacture; 8.3 Device Integration; References; Index |
| Record Nr. | UNINA-9910821062103321 |
| Weinheim, : Wiley-VCH, c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||