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RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
Autore Li Richard Chi-Hsi <1938->
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012
Descrizione fisica 1 online resource (862 p.)
Disciplina 621.384/12
Collana Wiley series on information and communication technology series
Soggetto topico Electronic circuit design
Radio circuits - Design and construction
Radio frequency
ISBN 1-283-59887-6
9786613911322
1-118-30990-1
1-118-30991-X
1-118-30994-4
Classificazione TEC007000
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto RF CIRCUIT DESIGN; CONTENTS; PREFACE TO THE SECOND EDITION; PART 1 DESIGN TECHNOLOGIES AND SKILLS; 1 DIFFERENCE BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 1.1 Controversy; 1.1.1 Impedance Matching; 1.1.2 Key Parameter; 1.1.3 Circuit Testing and Main Test Equipment; 1.2 Difference of RF and Digital Block in a Communication System; 1.2.1 Impedance; 1.2.2 Current Drain; 1.2.3 Location; 1.3 Conclusions; 1.4 Notes for High-Speed Digital Circuit Design; Further Reading; Exercises; Answers; 2 REFLECTION AND SELF-INTERFERENCE; 2.1 Introduction; 2.2 Voltage Delivered from a Source to a Load
2.2.1 General Expression of Voltage Delivered from a Source to a Load when << y/4 so that Td 02.2.2 Additional Jitter or Distortion in a Digital Circuit Block; 2.3 Power Delivered from a Source to a Load; 2.3.1 General Expression of Power Delivered from a Source to a Load when << y/4 so that Td 0; 2.3.2 Power Instability; 2.3.3 Additional Power Loss; 2.3.4 Additional Distortion; 2.3.5 Additional Interference; 2.4 Impedance Conjugate Matching; 2.4.1 Maximizing Power Transport; 2.4.2 Power Transport without Phase Shift; 2.4.3 Impedance Matching Network; 2.4.4 Necessity of Impedance Matching
2.5 Additional Effect of Impedance Matching2.5.1 Voltage Pumped up by Means of Impedance Matching; 2.5.2 Power Measurement; Appendices; 2.A.1 VSWR and Other Reflection and Transmission Coefficients; 2.A.2 Relationships between Power (dBm), Voltage (V), and Power (W); Reference; Further Reading; Exercises; Answers; 3 IMPEDANCE MATCHING IN THE NARROW-BAND CASE; 3.1 Introduction; 3.2 Impedance Matching by Means of Return Loss Adjustment; 3.2.1 Return Loss Circles on the Smith Chart; 3.2.2 Relationship between Return Loss and Impedance Matching
3.2.3 Implementation of an Impedance Matching Network3.3 Impedance Matching Network Built by One Part; 3.3.1 One Part Inserted into Impedance Matching Network in Series; 3.3.2 One Part Inserted into the Impedance Matching Network in Parallel; 3.4 Impedance Matching Network Built by Two Parts; 3.4.1 Regions in a Smith Chart; 3.4.2 Values of Parts; 3.4.3 Selection of Topology; 3.5 Impedance Matching Network Built By Three Parts; 3.5.1 """" Type and ""T"" Type Topologies; 3.5.2 Recommended Topology; 3.6 Impedance Matching When ZS Or ZL Is Not 50 _; 3.7 Parts In An Impedance Matching Network
Appendices3.A.1 Fundamentals of the Smith Chart; 3.A.2 Formula for Two-Part Impedance Matching Network; 3.A.3 Topology Limitations of the Two-Part Impedance Matching Network; 3.A.4 Topology Limitation of Three Parts Impedance Matching Network; 3.A.5 Conversion between _ and T Type Matching Network; 3.A.6 Possible _ and T Impedance Matching Networks; Reference; Further Reading; Exercises; Answers; 4 IMPEDANCE MATCHING IN THE WIDEBAND CASE; 4.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart; 4.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch
4.2.1 An Inductor Inserted into Impedance Matching Network in Series
Record Nr. UNINA-9910137610603321
Li Richard Chi-Hsi <1938->  
Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
Autore Li Richard Chi-Hsi <1938->
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012
Descrizione fisica 1 online resource (862 p.)
Disciplina 621.384/12
Collana Wiley series on information and communication technology series
Soggetto topico Electronic circuit design
Radio circuits - Design and construction
Radio frequency
ISBN 1-283-59887-6
9786613911322
1-118-30990-1
1-118-30991-X
1-118-30994-4
Classificazione TEC007000
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto RF CIRCUIT DESIGN; CONTENTS; PREFACE TO THE SECOND EDITION; PART 1 DESIGN TECHNOLOGIES AND SKILLS; 1 DIFFERENCE BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 1.1 Controversy; 1.1.1 Impedance Matching; 1.1.2 Key Parameter; 1.1.3 Circuit Testing and Main Test Equipment; 1.2 Difference of RF and Digital Block in a Communication System; 1.2.1 Impedance; 1.2.2 Current Drain; 1.2.3 Location; 1.3 Conclusions; 1.4 Notes for High-Speed Digital Circuit Design; Further Reading; Exercises; Answers; 2 REFLECTION AND SELF-INTERFERENCE; 2.1 Introduction; 2.2 Voltage Delivered from a Source to a Load
2.2.1 General Expression of Voltage Delivered from a Source to a Load when << y/4 so that Td 02.2.2 Additional Jitter or Distortion in a Digital Circuit Block; 2.3 Power Delivered from a Source to a Load; 2.3.1 General Expression of Power Delivered from a Source to a Load when << y/4 so that Td 0; 2.3.2 Power Instability; 2.3.3 Additional Power Loss; 2.3.4 Additional Distortion; 2.3.5 Additional Interference; 2.4 Impedance Conjugate Matching; 2.4.1 Maximizing Power Transport; 2.4.2 Power Transport without Phase Shift; 2.4.3 Impedance Matching Network; 2.4.4 Necessity of Impedance Matching
2.5 Additional Effect of Impedance Matching2.5.1 Voltage Pumped up by Means of Impedance Matching; 2.5.2 Power Measurement; Appendices; 2.A.1 VSWR and Other Reflection and Transmission Coefficients; 2.A.2 Relationships between Power (dBm), Voltage (V), and Power (W); Reference; Further Reading; Exercises; Answers; 3 IMPEDANCE MATCHING IN THE NARROW-BAND CASE; 3.1 Introduction; 3.2 Impedance Matching by Means of Return Loss Adjustment; 3.2.1 Return Loss Circles on the Smith Chart; 3.2.2 Relationship between Return Loss and Impedance Matching
3.2.3 Implementation of an Impedance Matching Network3.3 Impedance Matching Network Built by One Part; 3.3.1 One Part Inserted into Impedance Matching Network in Series; 3.3.2 One Part Inserted into the Impedance Matching Network in Parallel; 3.4 Impedance Matching Network Built by Two Parts; 3.4.1 Regions in a Smith Chart; 3.4.2 Values of Parts; 3.4.3 Selection of Topology; 3.5 Impedance Matching Network Built By Three Parts; 3.5.1 """" Type and ""T"" Type Topologies; 3.5.2 Recommended Topology; 3.6 Impedance Matching When ZS Or ZL Is Not 50 _; 3.7 Parts In An Impedance Matching Network
Appendices3.A.1 Fundamentals of the Smith Chart; 3.A.2 Formula for Two-Part Impedance Matching Network; 3.A.3 Topology Limitations of the Two-Part Impedance Matching Network; 3.A.4 Topology Limitation of Three Parts Impedance Matching Network; 3.A.5 Conversion between _ and T Type Matching Network; 3.A.6 Possible _ and T Impedance Matching Networks; Reference; Further Reading; Exercises; Answers; 4 IMPEDANCE MATCHING IN THE WIDEBAND CASE; 4.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart; 4.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch
4.2.1 An Inductor Inserted into Impedance Matching Network in Series
Record Nr. UNINA-9910812926803321
Li Richard Chi-Hsi <1938->  
Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
Autore Li Richard Chi-Hsi <1938->
Pubbl/distr/stampa Hoboken, N.J., : Wiley, c2009
Descrizione fisica 1 online resource (843 p.)
Disciplina 621.384/12
621.38412
Collana Wiley series on information and communication technologies
Soggetto topico Radio circuits - Design and construction
Electronic circuit design
Radio frequency
Soggetto genere / forma Electronic books.
ISBN 1-281-93857-2
9786611938574
0-470-40575-9
0-470-40572-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto RF CIRCUIT DESIGN; CONTENTS; PREFACE; PART I INDIVIDUAL RF BLOCKS; 1 LNA (LOW NOISE AMPLIFIER); 1.1 Introduction; 1.2 Single-Ended Single Device LNA; 1.3 Single-Ended Cascode LNA; 1.4 LNA with AGC (Automatic Gain Control); References; 2 MIXERS; 2.1 Introduction; 2.2 Passive Mixers; 2.3 Active Mixers; 2.4 Design Schemes; Appendices; References; 3 DIFFERENTIAL PAIRS; 3.1 Why Differential Pairs?; 3.2 Can DC Offset be Blocked by a Capacitor?; 3.3 Fundamentals of Differential Pairs; 3.4 CMRR (Common Mode Rejection Ratio); Appendices; References; 4 RF BALUN; 4.1 Introduction; 4.2 Transformer Baluns
4.3 LC Baluns4.4 Micro Strip Line Baluns; 4.5 Mixed Types of Baluns; Appendices; References; 5 TUNABLE FILTERS; 5.1 Tunable Filters in Communication Systems; 5.2 Coupling Between Two Tank Circuits; 5.3 Circuit Description; 5.4 Effect of Second Coupling; 5.5 Performance; References; 6 VCO (VOLTAGE-CONTROLLED OSCILLATOR); 6.1 "Three-Point" Type Oscillators; 6.2 Other Single-Ended Oscillators; 6.3 VCO and PLL; 6.4 Design Example of a Single-Ended VCO; 6.5 Differential VCO and Quad Phases VCO; References; 7 POWER AMPLIFIERS (PA); 7.1 Classifications of Power Amplifiers; 7.2 Single-Ended PA Design
7.3 Single-Ended PA-IC Design7.4 Push-Pull PA Design; 7.5 PA with Temperature Compensation; 7.6 PA with Output Power Control; 7.7 Linear PA; References; PART II DESIGN TECHNOLOGIES AND SCHEMES; 8 DIFFERENT METHODOLOGY BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 8.1 Controversy; 8.2 Differences between RF and Digital Blocks in a Communication System; 8.3 Conclusion; 8.4 Notes for High-Speed Digital Circuit Design; References; 9 VOLTAGE AND POWER TRANSPORTATION; 9.1 Voltage Delivered from a Source to a Load; 9.2 Power Delivered from a Source to a Load; 9.3 Impedance Conjugate Matching
9.4 Additional Effects of Impedance MatchingAppendices; References; 10 IMPEDANCE MATCHING IN NARROW-BAND CASE; 10.1 Introduction; 10.2 Impedance Matching by Means of Return Loss Adjustment; 10.3 Impedance Matching Network Built of One Part; 10.4 Impedance Matching Network Built of Two Parts; 10.5 Impedance Matching Network Built of Three Parts; 10.6 Impedance Matching When Z(S) or Z(L) Is Not 50 Ω; 10.7 Parts in an Impedance Matching Network; Appendices; References; 11 IMPEDANCE MATCHING IN A WIDE-BAND CASE; 11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart
11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch; 11.4 Impedance Matching in IQ Modulator Design for a UWB System; 11.5 Discussion of Wide-band Impedance Matching Networks; References; 12 IMPEDANCE AND GAIN OF A RAW DEVICE; 12.1 Introduction; 12.2 Miller Effect; 12.3 Small Signal Model of a Bipolar Transistor; 12.4 Bipolar Transistor with CE (Common Emitter) Configuration; 12.5 Bipolar Transistor with CB (Common Base) Configuration
12.6 Bipolar Transistor with CC (Common Collector) Configuration
Record Nr. UNINA-9910144094003321
Li Richard Chi-Hsi <1938->  
Hoboken, N.J., : Wiley, c2009
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
Autore Li Richard Chi-Hsi <1938->
Pubbl/distr/stampa Hoboken, N.J., : Wiley, c2009
Descrizione fisica 1 online resource (843 p.)
Disciplina 621.384/12
621.38412
Collana Wiley series on information and communication technologies
Soggetto topico Radio circuits - Design and construction
Electronic circuit design
Radio frequency
ISBN 1-281-93857-2
9786611938574
0-470-40575-9
0-470-40572-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto RF CIRCUIT DESIGN; CONTENTS; PREFACE; PART I INDIVIDUAL RF BLOCKS; 1 LNA (LOW NOISE AMPLIFIER); 1.1 Introduction; 1.2 Single-Ended Single Device LNA; 1.3 Single-Ended Cascode LNA; 1.4 LNA with AGC (Automatic Gain Control); References; 2 MIXERS; 2.1 Introduction; 2.2 Passive Mixers; 2.3 Active Mixers; 2.4 Design Schemes; Appendices; References; 3 DIFFERENTIAL PAIRS; 3.1 Why Differential Pairs?; 3.2 Can DC Offset be Blocked by a Capacitor?; 3.3 Fundamentals of Differential Pairs; 3.4 CMRR (Common Mode Rejection Ratio); Appendices; References; 4 RF BALUN; 4.1 Introduction; 4.2 Transformer Baluns
4.3 LC Baluns4.4 Micro Strip Line Baluns; 4.5 Mixed Types of Baluns; Appendices; References; 5 TUNABLE FILTERS; 5.1 Tunable Filters in Communication Systems; 5.2 Coupling Between Two Tank Circuits; 5.3 Circuit Description; 5.4 Effect of Second Coupling; 5.5 Performance; References; 6 VCO (VOLTAGE-CONTROLLED OSCILLATOR); 6.1 "Three-Point" Type Oscillators; 6.2 Other Single-Ended Oscillators; 6.3 VCO and PLL; 6.4 Design Example of a Single-Ended VCO; 6.5 Differential VCO and Quad Phases VCO; References; 7 POWER AMPLIFIERS (PA); 7.1 Classifications of Power Amplifiers; 7.2 Single-Ended PA Design
7.3 Single-Ended PA-IC Design7.4 Push-Pull PA Design; 7.5 PA with Temperature Compensation; 7.6 PA with Output Power Control; 7.7 Linear PA; References; PART II DESIGN TECHNOLOGIES AND SCHEMES; 8 DIFFERENT METHODOLOGY BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 8.1 Controversy; 8.2 Differences between RF and Digital Blocks in a Communication System; 8.3 Conclusion; 8.4 Notes for High-Speed Digital Circuit Design; References; 9 VOLTAGE AND POWER TRANSPORTATION; 9.1 Voltage Delivered from a Source to a Load; 9.2 Power Delivered from a Source to a Load; 9.3 Impedance Conjugate Matching
9.4 Additional Effects of Impedance MatchingAppendices; References; 10 IMPEDANCE MATCHING IN NARROW-BAND CASE; 10.1 Introduction; 10.2 Impedance Matching by Means of Return Loss Adjustment; 10.3 Impedance Matching Network Built of One Part; 10.4 Impedance Matching Network Built of Two Parts; 10.5 Impedance Matching Network Built of Three Parts; 10.6 Impedance Matching When Z(S) or Z(L) Is Not 50 Ω; 10.7 Parts in an Impedance Matching Network; Appendices; References; 11 IMPEDANCE MATCHING IN A WIDE-BAND CASE; 11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart
11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch; 11.4 Impedance Matching in IQ Modulator Design for a UWB System; 11.5 Discussion of Wide-band Impedance Matching Networks; References; 12 IMPEDANCE AND GAIN OF A RAW DEVICE; 12.1 Introduction; 12.2 Miller Effect; 12.3 Small Signal Model of a Bipolar Transistor; 12.4 Bipolar Transistor with CE (Common Emitter) Configuration; 12.5 Bipolar Transistor with CB (Common Base) Configuration
12.6 Bipolar Transistor with CC (Common Collector) Configuration
Record Nr. UNINA-9910829931703321
Li Richard Chi-Hsi <1938->  
Hoboken, N.J., : Wiley, c2009
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
Autore Li Richard Chi-Hsi <1938->
Pubbl/distr/stampa Hoboken, N.J., : Wiley, c2009
Descrizione fisica 1 online resource (843 p.)
Disciplina 621.384/12
621.38412
Collana Wiley series on information and communication technologies
Soggetto topico Radio circuits - Design and construction
Electronic circuit design
Radio frequency
ISBN 1-281-93857-2
9786611938574
0-470-40575-9
0-470-40572-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto RF CIRCUIT DESIGN; CONTENTS; PREFACE; PART I INDIVIDUAL RF BLOCKS; 1 LNA (LOW NOISE AMPLIFIER); 1.1 Introduction; 1.2 Single-Ended Single Device LNA; 1.3 Single-Ended Cascode LNA; 1.4 LNA with AGC (Automatic Gain Control); References; 2 MIXERS; 2.1 Introduction; 2.2 Passive Mixers; 2.3 Active Mixers; 2.4 Design Schemes; Appendices; References; 3 DIFFERENTIAL PAIRS; 3.1 Why Differential Pairs?; 3.2 Can DC Offset be Blocked by a Capacitor?; 3.3 Fundamentals of Differential Pairs; 3.4 CMRR (Common Mode Rejection Ratio); Appendices; References; 4 RF BALUN; 4.1 Introduction; 4.2 Transformer Baluns
4.3 LC Baluns4.4 Micro Strip Line Baluns; 4.5 Mixed Types of Baluns; Appendices; References; 5 TUNABLE FILTERS; 5.1 Tunable Filters in Communication Systems; 5.2 Coupling Between Two Tank Circuits; 5.3 Circuit Description; 5.4 Effect of Second Coupling; 5.5 Performance; References; 6 VCO (VOLTAGE-CONTROLLED OSCILLATOR); 6.1 "Three-Point" Type Oscillators; 6.2 Other Single-Ended Oscillators; 6.3 VCO and PLL; 6.4 Design Example of a Single-Ended VCO; 6.5 Differential VCO and Quad Phases VCO; References; 7 POWER AMPLIFIERS (PA); 7.1 Classifications of Power Amplifiers; 7.2 Single-Ended PA Design
7.3 Single-Ended PA-IC Design7.4 Push-Pull PA Design; 7.5 PA with Temperature Compensation; 7.6 PA with Output Power Control; 7.7 Linear PA; References; PART II DESIGN TECHNOLOGIES AND SCHEMES; 8 DIFFERENT METHODOLOGY BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 8.1 Controversy; 8.2 Differences between RF and Digital Blocks in a Communication System; 8.3 Conclusion; 8.4 Notes for High-Speed Digital Circuit Design; References; 9 VOLTAGE AND POWER TRANSPORTATION; 9.1 Voltage Delivered from a Source to a Load; 9.2 Power Delivered from a Source to a Load; 9.3 Impedance Conjugate Matching
9.4 Additional Effects of Impedance MatchingAppendices; References; 10 IMPEDANCE MATCHING IN NARROW-BAND CASE; 10.1 Introduction; 10.2 Impedance Matching by Means of Return Loss Adjustment; 10.3 Impedance Matching Network Built of One Part; 10.4 Impedance Matching Network Built of Two Parts; 10.5 Impedance Matching Network Built of Three Parts; 10.6 Impedance Matching When Z(S) or Z(L) Is Not 50 Ω; 10.7 Parts in an Impedance Matching Network; Appendices; References; 11 IMPEDANCE MATCHING IN A WIDE-BAND CASE; 11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart
11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch; 11.4 Impedance Matching in IQ Modulator Design for a UWB System; 11.5 Discussion of Wide-band Impedance Matching Networks; References; 12 IMPEDANCE AND GAIN OF A RAW DEVICE; 12.1 Introduction; 12.2 Miller Effect; 12.3 Small Signal Model of a Bipolar Transistor; 12.4 Bipolar Transistor with CE (Common Emitter) Configuration; 12.5 Bipolar Transistor with CB (Common Base) Configuration
12.6 Bipolar Transistor with CC (Common Collector) Configuration
Record Nr. UNINA-9910841720803321
Li Richard Chi-Hsi <1938->  
Hoboken, N.J., : Wiley, c2009
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui