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Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / / Er-Ping Li
| Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, c2012 |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
9786613650047
9781280673115 1280673117 9781118166741 1118166744 9781118166727 1118166728 9781118166758 1118166752 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9911020335303321 |
Li Er-Ping
|
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| Hoboken, N.J., : Wiley, c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li
| Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | [United States] : , : IEEE Press |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3015118 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
1-280-67311-7
9786613650047 1-118-16674-4 1-118-16672-8 1-118-16675-2 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9910141296603321 |
|
Li Er-Ping
|
||
| [United States] : , : IEEE Press | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li
| Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | [United States] : , : IEEE Press |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3015118 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
1-280-67311-7
9786613650047 1-118-16674-4 1-118-16672-8 1-118-16675-2 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9910830908503321 |
|
Li Er-Ping
|
||
| [United States] : , : IEEE Press | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
New Advances in Maxwell’s Equations and Applications / / by Er-Ping Li, Zhong Lin Wang
| New Advances in Maxwell’s Equations and Applications / / by Er-Ping Li, Zhong Lin Wang |
| Autore | Li Er-Ping |
| Edizione | [1st ed. 2024.] |
| Pubbl/distr/stampa | Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2024 |
| Descrizione fisica | 1 online resource (366 pages) |
| Disciplina | 620.5 |
| Altri autori (Persone) | WangZhong Lin |
| Collana | NanoScience and Technology |
| Soggetto topico |
Nanoelectromechanical systems
Electrodynamics Semiconductors Special relativity (Physics) Materials Photonics Mathematical physics Nanoscale Devices Classical Electrodynamics Special Relativity Photonic Devices Theoretical, Mathematical and Computational Physics |
| ISBN |
9783031757860
3031757866 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Classical Maxwell’s Equations -- Quantum Effects on Maxwell’s Equations -- Size-scale Effects on Maxwell’s Equations -- Maxwell's Equations for Advanced Electronic/Optoelectronic Devices -- Maxwell's Equations for Nanosize Devices with Quantum Effects -- Electromagnetism of Moving Observers in Free-space -- Maxwell’s Equations for a Mechano-driven Moving Objects System. |
| Record Nr. | UNINA-9910977980903321 |
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Li Er-Ping
|
||
| Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2024 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||