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Chiplet Design and Heterogeneous Integration Packaging / / by John H. Lau
| Chiplet Design and Heterogeneous Integration Packaging / / by John H. Lau |
| Autore | Lau John H. |
| Edizione | [1st ed. 2023.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2023 |
| Descrizione fisica | 1 online resource (542 pages) |
| Disciplina | 354.81150006 |
| Soggetto topico |
Electronics
Electronic circuits Microtechnology Microelectromechanical systems Electronics and Microelectronics, Instrumentation Electronic Circuits and Systems Microsystems and MEMS |
| ISBN |
9789811999178
9789811999161 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding. |
| Record Nr. | UNINA-9910683350203321 |
Lau John H.
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| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2023 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Fan-out wafer-level packaging / / by John H. Lau
| Fan-out wafer-level packaging / / by John H. Lau |
| Autore | Lau John H. |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Springer, , 2018 |
| Descrizione fisica | 1 online resource (319 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Electronic circuits
Nanotechnology Optical materials Electronics - Materials |
| ISBN | 9789811088841 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910299927103321 |
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Lau John H.
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| Singapore : , : Springer Singapore : , : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Heterogeneous integrations / / by John H. Lau
| Heterogeneous integrations / / by John H. Lau |
| Autore | Lau John H. |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , [2019] |
| Descrizione fisica | 1 online resource (XXII, 368 p. 386 illus., 342 illus. in color.) |
| Disciplina | 621.381 |
| Soggetto topico |
Integrated circuits
Electronics Microelectronics Electronic circuits Electronics and Microelectronics, Instrumentation Circuits and Systems Electronic Circuits and Devices |
| ISBN | 981-13-7224-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations. |
| Record Nr. | UNINA-9910350298303321 |
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Lau John H.
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| Singapore : , : Springer Singapore : , : Imprint : Springer, , [2019] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Semiconductor advanced packaging / / John H. Lau
| Semiconductor advanced packaging / / John H. Lau |
| Autore | Lau John H. |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Gateway East, Singapore : , : Springer, , [2021] |
| Descrizione fisica | 1 online resource (XXII, 498 p. 557 illus., 530 illus. in color.) |
| Disciplina | 621.38152 |
| Soggetto topico | Semiconductors - Design and construction |
| ISBN | 981-16-1376-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging. |
| Record Nr. | UNINA-9910483477703321 |
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Lau John H.
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| Gateway East, Singapore : , : Springer, , [2021] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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