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Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee
| Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee |
| Autore | Lau John H |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020 |
| Descrizione fisica | 1 online resource (545 pages) |
| Disciplina | 671.56 |
| Soggetto topico |
Joints (Engineering)
Solder and soldering |
| ISBN | 981-15-3920-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints. |
| Record Nr. | UNINA-9910403764003321 |
Lau John H
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| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology / / by John H. Lau
| Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology / / by John H. Lau |
| Autore | Lau John H |
| Edizione | [1st ed. 2024.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2024 |
| Descrizione fisica | 1 online resource (515 pages) |
| Disciplina | 621,381 |
| Soggetto topico |
Electronics
Solid state physics Lasers Optics Electronics and Microelectronics, Instrumentation Electronic Devices Laser Technology Optics and Photonics |
| ISBN | 981-9721-40-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics. |
| Record Nr. | UNINA-9910864189803321 |
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Lau John H
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| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2024 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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