Blockchain Security in Cloud Computing [[electronic resource] /] / edited by K.M. Baalamurugan, S. Rakesh Kumar, Abhishek Kumar, Vishal Kumar, Sanjeevikumar Padmanaban
| Blockchain Security in Cloud Computing [[electronic resource] /] / edited by K.M. Baalamurugan, S. Rakesh Kumar, Abhishek Kumar, Vishal Kumar, Sanjeevikumar Padmanaban |
| Edizione | [1st ed. 2022.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022 |
| Descrizione fisica | 1 online resource (XIII, 317 p. 111 illus., 90 illus. in color.) |
| Disciplina | 621.382 |
| Collana | EAI/Springer Innovations in Communication and Computing |
| Soggetto topico |
Electrical engineering
Computational intelligence Computer security Communications Engineering, Networks Computational Intelligence Systems and Data Security Privacy |
| Soggetto genere / forma | Electronic books. |
| ISBN | 3-030-70501-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Cloud Security -- Block Chain -- Block Chain Cloud Paradigm -- Block Chain Security -- Blockchain for Cloud -- Block chain-based cloud data storage security -- Clustering using Blockchain for cloud -- Cloud Assisted Secure Health System using blockchain -- Next Generation AI&ML using Blockchain -- Cloud Key Management for Secure Connection -- Computational Efficiency of Blockchain on cloud paradigm -- Conclusion. |
| Record Nr. | UNINA-9910497110003321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022 | ||
| Lo trovi qui: Univ. Federico II | ||
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Creating Capacity and Capability: Embracing Advanced Technologies and Innovations for Sustainable Future in Building Education and Practice : Innovations and Technologies in Building and Construction, Volume III / / edited by Mostafa Babaeian Jelodar, Ruggiero Lovreglio, Zhenan Feng, Daniel Paes, Vishal Kumar, Chandana Siriwardana
| Creating Capacity and Capability: Embracing Advanced Technologies and Innovations for Sustainable Future in Building Education and Practice : Innovations and Technologies in Building and Construction, Volume III / / edited by Mostafa Babaeian Jelodar, Ruggiero Lovreglio, Zhenan Feng, Daniel Paes, Vishal Kumar, Chandana Siriwardana |
| Autore | Jelodar Mostafa Babaeian |
| Edizione | [1st ed. 2025.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025 |
| Descrizione fisica | 1 online resource (657 pages) |
| Disciplina | 624 |
| Altri autori (Persone) |
LovreglioRuggiero
FengZhenan PaesDaniel KumarVishal SiriwardanaChandana |
| Collana | Lecture Notes in Civil Engineering |
| Soggetto topico |
Civil engineering
Technological innovations Environmental education Civil Engineering Innovation and Technology Management Environmental and Sustainability Education |
| ISBN | 981-9628-02-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Part I: Innovations in Building / Construction -- Chapter 1: Harmonising aesthetics, functionality, stability, buildability, serviceability, maintainability and cost in infrastructure development -- Chapter 2: Developing a Theoretical Model for Health, Safety, and Well-being (HSW) Practices at the Construction Procurement Stages -- Chapter 3: A Systematic Literature Review of the Previous Applications to the Systems Theoretic Accident Model and Process (STAMP) -- Chapter 4: Analysis of Safety and well-being factors related to the ageing construction workforce -- Chapter 5: Making a case for Circular Economy principles in Modular Construction: Identifying Key Determinant Factors -- Chapter 6: Examining Construction Contracting Innovation: Reality and Misconceptions -- Chapter 7: Impact of covid-19 on supply chain management of the offsite construction sector in New Zealand -- Chapter 8: Automatic identification of indoor movement pattern of older adults living alone at smart homes: rethinking in the post-COVID era -- Chapter 9: Exploring causes and mitigation strategies for variations in residential building projects in Sri Lanka -- Chapter 10: Performance Management in Team Projects: Preparing Work-ready Graduates -- etc. |
| Record Nr. | UNINA-9911015683403321 |
Jelodar Mostafa Babaeian
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| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2025 | ||
| Lo trovi qui: Univ. Federico II | ||
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Insights into Avascular Necrosis of the Femoral Head : Learning for the Trainees and Professionals / / edited by Prasoon Kumar, Sameer Aggarwal, Vishal Kumar
| Insights into Avascular Necrosis of the Femoral Head : Learning for the Trainees and Professionals / / edited by Prasoon Kumar, Sameer Aggarwal, Vishal Kumar |
| Autore | Kumar Prasoon |
| Edizione | [1st ed. 2023.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2023 |
| Descrizione fisica | 1 online resource (201 pages) |
| Disciplina | 617.581 |
| Altri autori (Persone) |
AggarwalSameer
KumarVishal |
| Soggetto topico |
Orthopedics
Orthopedic surgery Epidemiology Diseases - Causes and theories of causation Orthopaedics Surgical Orthopedics Pathogenesis |
| ISBN | 981-9913-46-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Femoral Head- Anatomical Considerations -- Avascular Necrosis Of Hip- Historical Perspective -- Epidemiology And Risk Factors -- Etiology & Pathophysiology -- Clinical Features And Staging -- Avascular Necrosis Hip: How To Examine A Suspected Case -- AVN Hip: Radiology -- Treatment Principles An Overview -- Core Decompression -- Osteotomies For Osteonecrosis Hip -- Head Preservation Recent Advances -- Hip Arthrodesis Current Concepts -- Hip Arthroplasty.-Avascular Necrosis Of Hip Replace Or Resurface -- AVN Hip Bedside Case Presentation -- FAQs For Trainees -- MCQs. |
| Record Nr. | UNINA-9910735796303321 |
Kumar Prasoon
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| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2023 | ||
| Lo trovi qui: Univ. Federico II | ||
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Proceedings on 2018 IEEE 3rd International Conference on Computing, Communication and Security (ICCCS) : October 25th - 27th, 2018, Kathmandu, Nepal / / editors, S. D. Sudarsan, Vishal Kumar, Ravi Tomar ; co-sponsor, Tribhuvan University
| Proceedings on 2018 IEEE 3rd International Conference on Computing, Communication and Security (ICCCS) : October 25th - 27th, 2018, Kathmandu, Nepal / / editors, S. D. Sudarsan, Vishal Kumar, Ravi Tomar ; co-sponsor, Tribhuvan University |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (iii, 235 pages) |
| Disciplina | 004 |
| Soggetto topico |
Computer science
Telecommunication |
| Soggetto genere / forma | Electronic books. |
| ISBN | 1-5386-6227-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910304156603321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Lo trovi qui: Univ. Federico II | ||
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Proceedings on 2018 IEEE 3rd International Conference on Computing, Communication and Security (ICCCS) : October 25th - 27th, 2018, Kathmandu, Nepal / / editors, S. D. Sudarsan, Vishal Kumar, Ravi Tomar ; co-sponsor, Tribhuvan University
| Proceedings on 2018 IEEE 3rd International Conference on Computing, Communication and Security (ICCCS) : October 25th - 27th, 2018, Kathmandu, Nepal / / editors, S. D. Sudarsan, Vishal Kumar, Ravi Tomar ; co-sponsor, Tribhuvan University |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (iii, 235 pages) |
| Disciplina | 004 |
| Soggetto topico |
Computer science
Telecommunication |
| ISBN | 1-5386-6227-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996580862403316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Lo trovi qui: Univ. di Salerno | ||
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