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Inkjet-based micromanufacturing [[electronic resource] /] / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin
Inkjet-based micromanufacturing [[electronic resource] /] / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin
Pubbl/distr/stampa Weinheim, Germany, : Wiley-VCH, c2012
Descrizione fisica 1 online resource (389 p.)
Disciplina 621.319
Altri autori (Persone) KorvinkJ. G (Jan G.)
SmithPatrick J., Dr.
ShinDong-Youn
Collana Advanced micro & nanosystems
Soggetto topico Microelectronics - Design
Microfabrication
Ink-jet printing
Microelectromechanical systems - Design and construction
ISBN 1-283-59695-4
9786613909404
3-527-64711-2
3-527-64710-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Inkjet-based Micromanufacturing; Contents; List of Contributors; 1 Overview of Inkjet-Based Micromanufacturing; 1.1 Introduction; 1.2 Inkjet Technology; 1.2.1 Continuous Mode Inkjet (CIJ) Technology; 1.2.2 Demand Mode Inkjet Technology; 1.3 Fluid Requirements; 1.4 Pattern Formation: Fluid/Substrate Interaction; 1.5 Micromanufacturing; 1.5.1 Introduction; 1.5.2 Limitations and Opportunities in Micromanufacturing; 1.5.3 Benefits of Inkjet in Microfabrication; 1.6 Examples of Inkjet in Micromanufacturing; 1.6.1 Chemical Sensors; 1.6.2 Optical MEMS Devices; 1.6.3 Bio-MEMS Devices
1.6.4 Assembly and Packaging1.7 Conclusions; Acknowledgments; References; 2 Combinatorial Screening of Materials Using Inkjet Printing as a Patterning Technique; 2.1 Introduction; 2.2 Inkjet Printing - from Well-Defined Dots to Homogeneous Films; 2.3 Thin-Film Libraries Prepared by Inkjet Printing; 2.4 Combinatorial Screening of Materials for Organic Solar Cells; 2.5 Conclusion and Outlook; References; 3 Thermal Inkjet; 3.1 History of Thermal Inkjet Technology; 3.2 Market Trends for Inkjet Products and Electrophotography; 3.3 Structures of Various TIJ Heads
3.4 Research on Rapid Boiling and Principle of TIJ3.5 Inkjetting Mechanism of TIJ; 3.6 Basic Jetting Behavior of TIJ; 3.6.1 Input Power Characteristics; 3.6.2 Frequency Characteristics; 3.6.3 Dependency on Temperature; 3.7 TIJ Behavior Analysis Using Simulation; 3.7.1 Cylindrical Thermal Propagating Calculation Based on the Finite Element Method (Software Name: Ansys); 3.7.2 Fluidic Free Boundary Calculation Based on the Finite Differentiation Method (Software name: Flow3D); 3.8 Issues with Reliability in TIJ; 3.9 Present and Future Evolution in TIJ Technology; References
4 High-Resolution Electrohydrodynamic Inkjet4.1 Introduction; 4.2 Printing System; 4.3 Control of Jet Motions; 4.4 Drop-on-Demand Mode Printing; 4.5 Versatility of Printable Materials and Resolutions; 4.6 Applications in Electronics and Biotechnology; 4.7 High-Resolution Printing of Charge; References; 5 Cross Talk in Piezo Inkjet; 5.1 Introduction; 5.2 Electrical Cross Talk; 5.3 Direct Cross Talk; 5.4 Pressure-Induced Cross Talk; 5.5 Acoustic Cross Talk; 5.6 Printhead Resonance; 5.7 Residual Vibrations; References; 6 Patterning; 6.1 Introduction; 6.1.1 Droplet Impact and Final Droplet Radius
6.1.2 Evaporation of Inkjet-Printed Droplets at Room Temperature6.1.3 Morphological Control for Ink Droplets, Lines, and Films; 6.2 Conclusion; References; 7 Drying of Inkjet-Printed Droplets; 7.1 Introduction; 7.2 Modeling of Drying of a Droplet; 7.2.1 Fluid Model; 7.2.2 Lubrication Approximation; 7.2.3 Solute Concentration; 7.2.4 Evaporation Velocity; 7.2.5 Numerical Method; 7.3 Results; 7.3.1 Droplet Shape Evolution; 7.3.2 Layer Thickness; 7.3.3 Effect of Diffusion; Acknowledgments; References; 8 Postprinting Processes for Inorganic Inks for Plastic Electronics Applications
8.1 Introduction
Record Nr. UNINA-9910130580503321
Weinheim, Germany, : Wiley-VCH, c2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Inkjet-based micromanufacturing / / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin
Inkjet-based micromanufacturing / / edited by Jan G. Korvink, Patrick J. Smith, and Dong-Youn Shin
Edizione [1st ed.]
Pubbl/distr/stampa Weinheim, Germany, : Wiley-VCH, c2012
Descrizione fisica 1 online resource (389 p.)
Disciplina 621.319
Altri autori (Persone) KorvinkJ. G (Jan G.)
SmithPatrick J., Dr.
ShinDong-Youn
Collana Advanced micro & nanosystems
Soggetto topico Microelectronics - Design
Microfabrication
Ink-jet printing
Microelectromechanical systems - Design and construction
ISBN 9786613909404
9781283596954
1283596954
9783527647118
3527647112
9783527647101
3527647104
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Inkjet-based Micromanufacturing; Contents; List of Contributors; 1 Overview of Inkjet-Based Micromanufacturing; 1.1 Introduction; 1.2 Inkjet Technology; 1.2.1 Continuous Mode Inkjet (CIJ) Technology; 1.2.2 Demand Mode Inkjet Technology; 1.3 Fluid Requirements; 1.4 Pattern Formation: Fluid/Substrate Interaction; 1.5 Micromanufacturing; 1.5.1 Introduction; 1.5.2 Limitations and Opportunities in Micromanufacturing; 1.5.3 Benefits of Inkjet in Microfabrication; 1.6 Examples of Inkjet in Micromanufacturing; 1.6.1 Chemical Sensors; 1.6.2 Optical MEMS Devices; 1.6.3 Bio-MEMS Devices
1.6.4 Assembly and Packaging1.7 Conclusions; Acknowledgments; References; 2 Combinatorial Screening of Materials Using Inkjet Printing as a Patterning Technique; 2.1 Introduction; 2.2 Inkjet Printing - from Well-Defined Dots to Homogeneous Films; 2.3 Thin-Film Libraries Prepared by Inkjet Printing; 2.4 Combinatorial Screening of Materials for Organic Solar Cells; 2.5 Conclusion and Outlook; References; 3 Thermal Inkjet; 3.1 History of Thermal Inkjet Technology; 3.2 Market Trends for Inkjet Products and Electrophotography; 3.3 Structures of Various TIJ Heads
3.4 Research on Rapid Boiling and Principle of TIJ3.5 Inkjetting Mechanism of TIJ; 3.6 Basic Jetting Behavior of TIJ; 3.6.1 Input Power Characteristics; 3.6.2 Frequency Characteristics; 3.6.3 Dependency on Temperature; 3.7 TIJ Behavior Analysis Using Simulation; 3.7.1 Cylindrical Thermal Propagating Calculation Based on the Finite Element Method (Software Name: Ansys); 3.7.2 Fluidic Free Boundary Calculation Based on the Finite Differentiation Method (Software name: Flow3D); 3.8 Issues with Reliability in TIJ; 3.9 Present and Future Evolution in TIJ Technology; References
4 High-Resolution Electrohydrodynamic Inkjet4.1 Introduction; 4.2 Printing System; 4.3 Control of Jet Motions; 4.4 Drop-on-Demand Mode Printing; 4.5 Versatility of Printable Materials and Resolutions; 4.6 Applications in Electronics and Biotechnology; 4.7 High-Resolution Printing of Charge; References; 5 Cross Talk in Piezo Inkjet; 5.1 Introduction; 5.2 Electrical Cross Talk; 5.3 Direct Cross Talk; 5.4 Pressure-Induced Cross Talk; 5.5 Acoustic Cross Talk; 5.6 Printhead Resonance; 5.7 Residual Vibrations; References; 6 Patterning; 6.1 Introduction; 6.1.1 Droplet Impact and Final Droplet Radius
6.1.2 Evaporation of Inkjet-Printed Droplets at Room Temperature6.1.3 Morphological Control for Ink Droplets, Lines, and Films; 6.2 Conclusion; References; 7 Drying of Inkjet-Printed Droplets; 7.1 Introduction; 7.2 Modeling of Drying of a Droplet; 7.2.1 Fluid Model; 7.2.2 Lubrication Approximation; 7.2.3 Solute Concentration; 7.2.4 Evaporation Velocity; 7.2.5 Numerical Method; 7.3 Results; 7.3.1 Droplet Shape Evolution; 7.3.2 Layer Thickness; 7.3.3 Effect of Diffusion; Acknowledgments; References; 8 Postprinting Processes for Inorganic Inks for Plastic Electronics Applications
8.1 Introduction
Record Nr. UNINA-9910817246103321
Weinheim, Germany, : Wiley-VCH, c2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
MEMS : a practical guide to design, analysis, and applications / / edited by Jan G. Korvink and Oliver Paul
MEMS : a practical guide to design, analysis, and applications / / edited by Jan G. Korvink and Oliver Paul
Pubbl/distr/stampa Norwich, NY, : W. Andrew Pub.
Descrizione fisica 1 online resource (993 p.)
Disciplina 621
Altri autori (Persone) KorvinkJ. G (Jan G.)
PaulOliver
Soggetto topico Microelectromechanical systems
ISBN 9786612253058
1-59124-988-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Front Cover; MEMS: A Practical Guide to Design, Analysis, and Applications; Copyright Page; Contents; Foreword; Preface; Chapter 1. Microtransducer Operation; 1.1 Introduction; 1.2 Transduction; 1.3 Microsystem Performance; 1.4 Transducer Operation Techniques; 1.5 Powering Microsystems; References; Chapter 2. Material Properties: Measurement and Data; 2.1 Introduction; 2.2 Measurement Methods; 2.3 Data; References; Chapter 3. MEMS and NEMS Simulation; 3.1 Introduction; 3.2 Simulation Scenario; 3.3 Generic Organization of a Computational Tool; 3.4 Methods for Materials Simulation
3.5 Computational Methods that Solve PDEs3.6 Design Automation Methods; 3.7 A Simulation Strategy; 3.8 Case Studies; 3.9 Summary; 3.10 Acknowledgments; References; Chapter 4. System-Level Simulation of Microsystems; 4.1 Introduction; 4.2 Behavioral Modeling of MEMS Components; 4.3 Formulation of Equations of Motion; 4.4 Structured Design Tools; 4.5 Conclusions; References; Chapter 5. Thermal-Based Microsensors; 5.1 Introduction; 5.2 Thermoresistors; 5.3 Silicon Diodes and Transistors as Thermal Microsensors; 5.4 Thermoelectric Microsensors
5.5 CMOS-Compatible Thermal-Based Microsensors and Microactuators5.6 Diagnostic Thermal-Based Microstructures; 5.7 Conclusion; References; Chapter 6. Photon Detectors; 6.1 Introduction; 6.2 Detectors; 6.3 Thin-Film Transistors; 6.4 Pixel Integration; 6.5 Imaging Arrays; 6.6 New Challenges in Large-Area Digital Imaging; References; Chapter 7. Free-Space Optical MEMS; 7.1 Introduction; 7.2 General Discussion of Micromirror Scanners; 7.3 Electrostatic Scanners; 7.4 Scanning Mirrors with Magnetic and Electromagnetic Actuators; 7.5 Micromirror Arrays with Mirror Size =100 Micrometers
9.5 Magnetoresistors9.6 Magnetodiodes; 9.7 Magnetotransistors and Related Microsensors; 9.8 Magnetic Field-based Functional Multisensors; 9.9 Interfaces and Improvement of Characteristics of Magnetic Microsensors; 9.10 Conclusions and Outlook; References; Chapter 10. Mechanical Microsensors; 10.1 Introduction; 10.2 Inertial Sensors; 10.3 Pressure Sensors; 10.4 Force and Torque Sensors; References; Chapter 11. Semiconductor-Based Chemical Microsensors; 11.1 Introduction; 11.2 Thermodynamics of Chemical Sensing; 11.3 Chemomechanical Sensors; 11.4 Thermal Sensors; 11.5 Optical Sensors
11.6 Electrochemical Sensors
Record Nr. UNINA-9911006981703321
Norwich, NY, : W. Andrew Pub.
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui