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Etching in microsystem technology / / Michael Kohler ; translated by Antje Wiegand
| Etching in microsystem technology / / Michael Kohler ; translated by Antje Wiegand |
| Autore | Kohler J. M (J. Michael), <1956-> |
| Pubbl/distr/stampa | Weinheim ; ; New York, : Wiley-VCH, c1999 |
| Descrizione fisica | 1 online resource (386 p.) |
| Disciplina | 621.3815/31 |
| Soggetto topico |
Masks (Electronics)
Microlithography Plasma etching |
| ISBN |
1-281-76426-4
9786611764265 3-527-61378-1 3-527-61379-X |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Etching in Microsystem Technology; Preface; Contents; Table of Contents; Symbols; Abbreviations; 1 Introduction; 2 Distinctive Features of Microtechnical Etching; 2.1 Etching as a Fashioning Method; 2.1.1 Limits of Additive Microtechnical Pattern Generation; 2.1.2 Subtractive Pattern Generation; 2.2 Etch Rate and Selectivity; 2.2.1 Etch Rate and Time Request; 2.2.2 The Etching Process; 2.2.3 Transport Processes; 2.2.4 Process Velocities; 2.3. Isotropic and Anisotropic Etching; 2.4 Edge Geometry and Roughness; 2.4.1 Deviations from Ideal Geometry; 2.4.2 Flank Geometry in Isotropic Etching
2.4.3 Fabrication of Low Slope Angles by Isotropic Etching2.4.4 Flank Geometries in Anisotropic Etching; 2.4.5 Setting the Flank Geometry by Partial Anisotropic Etching; 2.5 Accuracy; 2.6 Monitoring of Etching Processes; 3 Wet-Chemical Etching Methods; 3.1 Etching at the Interface Solid-Liquid; 3.2 Preparation of the Surface; 3.2.1 Surface Condition; 3.2.2 Cleaning; 3.2.3 Digital Etching; 3.3 Etching of Dielectric Materials; 3.3.1 Wet Etching by Physical Dissolution; 3.3.2 Wet-Chemical Etching of Non-Metals; 3.4 Etching of Metals and Semiconductors; 3.4.1 Outer-Currentless Etching 3.4.2 Selectivity in Outer-Currentless Etching3.4.3 Etching of Multilayer Systems Forming Local Elements; 3.4.4 Geometry-Dependent Etch Rates; 3.4.5 Geometry-Dependent Passivation; 3.4.6 Electrochemical Etching; 3.4.7 Photochemical Wet Etching; 3.4.8 Photoelectrochemical Etching(PEC); 3.5 Crystallographic Etching; 3.5.1 Chemical Wet-Etching of Monocrystalline Surfaces; 3.5.2 Anisotropic Etching of Monocrystalline Metals; 3.5.3 Anisotropic Etching of Silicon; 3.5.4 Anisotropic Electrochemical and Photoelectrochemical Etching; 3.5.5 Porous Silicon 3 S.6 Anisotropic Etching of Compound Semiconductors3.6 Preparation of Free-Standing Micropatterns; 3.6.1 Surface Micromachining; 3.6.2 Bulk Micromachining; 3.6.3 Porous Silicon as Sacrificial Material; 4 Dry-Etching Methods; 4.1 Removal at the Interface Solid-Gas; 4.2 Plasma-Free Etching in the Gas Phase; 4.2.1 Plasma-Free Dry-Etching with Reactive Gases; 4.2.2 Photo-Assisted Dry Etching with Reactive Gases; 4.2.3 Directly Writing Micropatterning by Laser Scanning Etching; 4.2.4 Electron-Beam-Assisted Vapour Etching; 4.3 Plasma Etching Methods 4.3.1 Material Removal by Reactions with Plasma Species4.3.2 Plasma Generation; 4.3.3 Plasma Etching in the Barrel Reactor; 4.3.4 Plasma Etching in the Down-Stream Reactor; 4.3.5 Plasma Etching in the Planar-Plate Reactor; 4.3.6 Magnetic-Field-Enhanced Plasma Etching; 4.3.7 Plasma Etching at Low Pressure and High Ion Density; 4.3.8 Forming of Etch Structures in Plasma Etching; 4.3.9 Geometry Influence on Plasma Etching; 4.3.10 Plasma Jet Etching (PJE); 4.3.11 Applications of Plasma Etching; 4.4 Etchig Methods with Energized Particles; 4.4.1 Sputter-Etching; 4.4.2 Reactive Ion Etching (RIE) 4.4.3 Magnetic-Field-Enhanced Reactive Ion Etching (MERIE) |
| Record Nr. | UNINA-9910876976503321 |
Kohler J. M (J. Michael), <1956->
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| Weinheim ; ; New York, : Wiley-VCH, c1999 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Nanotechnology : an introduction to nanostructuring techniques / / Michael Kohler and Wolfgang Fritzsche
| Nanotechnology : an introduction to nanostructuring techniques / / Michael Kohler and Wolfgang Fritzsche |
| Autore | Kohler J. M (J. Michael), <1956-> |
| Edizione | [2nd, compl. rev. ed.] |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, 2007 |
| Descrizione fisica | 1 online resource (337 p.) |
| Disciplina | 620.5 |
| Altri autori (Persone) | FritzscheWolfgang, Dr. |
| Soggetto topico |
Nanotechnology
Nanostructures |
| ISBN |
1-281-31184-7
9786611311841 3-527-62114-8 3-527-62113-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Nanotechnology; Contents; Abbreviations and Acronyms; 1 Introduction; 1.1 The Way into the Nanoworld; 1.1.1 From Micro- to Nanotechniques; 1.1.2 Definition of Nanostructures; 1.1.3 Insight into the Nanoworld; 1.1.4 Intervention into the Nanoworld; 1.2 Building Blocks in Nanotechnology; 1.3 Interactions and Topology; 1.4 The Microscopic Environment of the Nanoworld; 2 Molecular Basics; 2.1 Particles and Bonds; 2.1.1 Chemical Bonds in Nanotechnology; 2.1.2 Van der Waals Interactions; 2.1.3 Dipole-Dipole Interactions; 2.1.4 Ionic Interactions; 2.1.5 Metal Bonds; 2.1.6 Covalent Bonds
2.1.7 Coordinative Bonds2.1.8 Hydrogen Bridge Bonds; 2.1.9 Polyvalent Bonds; 2.2 Chemical Structure; 2.2.1 Binding Topologies; 2.2.2 Building Blocks of Covalent Architecture; 2.2.3 Units for a Coordinative Architecture; 2.2.4 Building Blocks for Weakly Bound Aggregates; 2.2.5 Assembly of Complex Structures through the Internal Hierarchy of Binding Strengths; 2.2.6 Reaction Probability and Reaction Equilibrium; 3 Microtechnological Foundations; 3.1 Planar Technology; 3.2 Preparation of Thin Layers; 3.2.1 Condition and Preprocessing of the Substrate Surface 3.2.2 Layer Deposition from the Gas Phase3.2.3 Evaporation; 3.2.4 Sputtering; 3.2.5 Chemical Vapor Deposition; 3.2.6 Galvanic Deposition; 3.2.7 Deposition by Spinning (Spin Coating); 3.2.8 Shadow-mask Deposition Techniques; 3.3 Preparation of Ultrathin Inorganic Layers and Surface-bound Nanoparticles; 3.3.1 Ultrathin Layers by Vacuum Deposition Processes; 3.3.2 Deposition of Ultrathin Films from the Liquid Phase; 3.3.3 In Situ Generation of Ultrathin Inorganic Films by Chemical Surface Modification; 3.3.4 In Situ Formation of Ultrathin Inorganic Layers on Heteroorganic Materials 3.3.5 Immobilization of Nanoparticles3.3.6 In Situ Formation of Inorganic Nanoparticles; 3.4 Structure Generation and Fabrication of Lithographic Masks; 3.4.1 Adhesive Mask Technique; 3.4.2 Role of Resist in Photolithography; 3.4.3 Serial Pattern Transfer; 3.4.4 Group Transfer Processes; 3.4.5 Maskless Structure Generation; 3.4.6 Soft Lithography; 3.5 Etching Processes; 3.5.1 Etching Rate and Selectivity; 3.5.2 Isotropic and Anisotropic Etching Processes; 3.5.3 Lithographic Resolution in Etching Processes; 3.5.4 Wet Etching Processes; 3.5.5 Dry Etching Processes 3.5.6 High-resolution Dry Etching Techniques3.5.7 Choice of Mask for Nanolithographic Etching Processes; 3.6 Packaging; 3.7 Biogenic and Bioanalogue Molecules in Technical Microstructures; 4 Preparation of Nanostructures; 4.1 Principles of Fabrication; 4.1.1 Subtractive and Additive Creation of Nanostructures; 4.1.2 Nanostructure Generation by Lift-off Processes; 4.1.3 Principles of Nanotechnical Shape-definition and Construction; 4.2 Nanomechanical Structure Generation; 4.2.1 Scaling Down of Mechanical Processing Techniques; 4.2.2 Local Mechanical Cutting Processes 4.2.3 Surface Transport Methods |
| Altri titoli varianti | Nanostructuring techniques |
| Record Nr. | UNINA-9910877529403321 |
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Kohler J. M (J. Michael), <1956->
|
||
| Weinheim, : Wiley-VCH, 2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||