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Microsystem engineering of lab-on-a-chip devices [[electronic resource] /] / [editors], Oliver Geschke, Henning Klank, Pieter Tellemann
| Microsystem engineering of lab-on-a-chip devices [[electronic resource] /] / [editors], Oliver Geschke, Henning Klank, Pieter Tellemann |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2004 |
| Descrizione fisica | 1 online resource (272 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) |
GeschkeOliver
KlankHenning TellemanPieter |
| Soggetto topico |
Microelectronics
Microtechnology |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-55863-6
9786610558636 3-527-60636-X 3-527-60165-1 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Microsystem Engineering of Lab-on-a-chip Devices; Contents; Preface; 1 Introduction; 1.1 Learning from the Experiences of Microelectronics; 1.2 The Advantages of Miniaturizing Systems for Chemical Analysis; 1.3 From Concept to μTAS; 1.4 References; 2 Clean Rooms; 3 Microfluidics - Theoretical Aspects; 3.1 Fluids and Flows; 3.2 Transport Processes; 3.2.1 Types of Transport; 3.2.1.1 Convection; 3.2.1.2 Migration; 3.2.1.3 Diffusion; 3.2.1.4 Dispersion; 3.3 System Design; 3.3.1 Laminar Flow and Diffusion in Action; 3.4 An Application: Biological Fluids; 3.5 References
4 Microfluidics - Components4.1 Valves and Pumps; 4.1.1 Moving Liquids by Electroosmosis; 4.1.2 Mixers; 4.2 Injecting, Dosing, and Metering; 4.3 Temperature Measurement in Microfluidic Systems; 4.3.1 Microreactors; 4.3.2 Temperature Sensors for Microsystems; 4.3.3 Resistance Temperature Detectors; 4.3.3.1 Metals; 4.3.3.2 Nonmetals; 4.3.4 Thermocouples; 4.3.5 Semiconductor Junction Sensors; 4.3.6 Temperature Sensors Built on Other Principles; 4.3.7 Conclusion; 4.4 Optical Sensors; 4.4.1 Instrumentation; 4.4.2 Absorption Detection; 4.4.3 Evanescent-wave Sensing; 4.4.4 Fluorescence Detection 4.5 Electrochemical Sensors4.6 References; 5 Simulations in Microfluidics; 5.1 Physical Aspects and Design; 5.2 Choosing Software and Hardware; 5.2.1 CFD-ACE+Version 6.6; 5.2.2 CoventorWareTM Version 2001.3; 5.2.3 Hardware; 5.2.4 The Core Elements of Typical CFD Software; 5.2.5 Pre-processors; 5.2.6 Solvers; 5.2.7 Post-processors; 5.3 Important Numerical Settings; 5.3.1 Boundary Conditions; 5.3.2 Solver Settings; 5.4 Errors and Uncertainties; 5.5 Interpretation and Evaluation of Simulations; 5.6 Example Simulations; 5.6.1 Fully-developed Flow in a Circular Capillary 5.6.2 Movement of a Chemical Plug by Electroosmotic Flow in a Detection Cell5.6.3 Conclusions; 5.7 References; 6 Silicon and Cleanroom Processing; 6.1 Substrate Fabrication; 6.2 Optical Lithography; 6.2.1 Photolithography; 6.2.2 Mask Design; 6.2.3 Hints in Planning Fabrication Runs; 6.3 Deposition; 6.3.1 Fundamentals of Coatings; 6.3.2 Deposition Methods; 6.3.3 Materials; 6.3.4 Lift-off; 6.3.5 Silicides; 6.4 Etching Removal; 6.4.1 Wet-etching Fundamentals; 6.4.2 Etching with HF; 6.4.3 Isotropic Silicon Etch; 6.4.4 Orientation-dependent Silicon Etching 6.4.5 Common Orientation-dependent Etchants6.4.6 Other Etchants; 6.4.7 Effects of Not Stirring a Transport-limited Etch; 6.5 Dry Etching; 6.5.1 Plasma Etching Fundamentals; 6.5.2 Plasma Etching Setups; 6.5.3 Etch Gases; 6.5.4 Laser-assisted Etching; 6.6 Heat Treatment; 6.6.1 Thermal Oxidation; 6.6.2 Diffusion; 6.6.3 Annealing; 6.6.4 Wafer Bonding; 6.7 References; 7 Glass Micromachining; 7.1 Wet Chemical Etching; 7.2 Reactive Ion Etching (RIE) of Glass; 7.3 Laser Patterning; 7.4 Powder Blasting; 7.5 Glass Bonding; 7.6 A Microfabrication Example; 7.7 References; 8 Polymer Micromachining 8.1 Hot Embossing |
| Record Nr. | UNINA-9910146236703321 |
| Weinheim, : Wiley-VCH, c2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Microsystem engineering of lab-on-a-chip devices [[electronic resource] /] / [editors], Oliver Geschke, Henning Klank, Pieter Tellemann
| Microsystem engineering of lab-on-a-chip devices [[electronic resource] /] / [editors], Oliver Geschke, Henning Klank, Pieter Tellemann |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2004 |
| Descrizione fisica | 1 online resource (272 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) |
GeschkeOliver
KlankHenning TellemanPieter |
| Soggetto topico |
Microelectronics
Microtechnology |
| ISBN |
1-280-55863-6
9786610558636 3-527-60636-X 3-527-60165-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Microsystem Engineering of Lab-on-a-chip Devices; Contents; Preface; 1 Introduction; 1.1 Learning from the Experiences of Microelectronics; 1.2 The Advantages of Miniaturizing Systems for Chemical Analysis; 1.3 From Concept to μTAS; 1.4 References; 2 Clean Rooms; 3 Microfluidics - Theoretical Aspects; 3.1 Fluids and Flows; 3.2 Transport Processes; 3.2.1 Types of Transport; 3.2.1.1 Convection; 3.2.1.2 Migration; 3.2.1.3 Diffusion; 3.2.1.4 Dispersion; 3.3 System Design; 3.3.1 Laminar Flow and Diffusion in Action; 3.4 An Application: Biological Fluids; 3.5 References
4 Microfluidics - Components4.1 Valves and Pumps; 4.1.1 Moving Liquids by Electroosmosis; 4.1.2 Mixers; 4.2 Injecting, Dosing, and Metering; 4.3 Temperature Measurement in Microfluidic Systems; 4.3.1 Microreactors; 4.3.2 Temperature Sensors for Microsystems; 4.3.3 Resistance Temperature Detectors; 4.3.3.1 Metals; 4.3.3.2 Nonmetals; 4.3.4 Thermocouples; 4.3.5 Semiconductor Junction Sensors; 4.3.6 Temperature Sensors Built on Other Principles; 4.3.7 Conclusion; 4.4 Optical Sensors; 4.4.1 Instrumentation; 4.4.2 Absorption Detection; 4.4.3 Evanescent-wave Sensing; 4.4.4 Fluorescence Detection 4.5 Electrochemical Sensors4.6 References; 5 Simulations in Microfluidics; 5.1 Physical Aspects and Design; 5.2 Choosing Software and Hardware; 5.2.1 CFD-ACE+Version 6.6; 5.2.2 CoventorWareTM Version 2001.3; 5.2.3 Hardware; 5.2.4 The Core Elements of Typical CFD Software; 5.2.5 Pre-processors; 5.2.6 Solvers; 5.2.7 Post-processors; 5.3 Important Numerical Settings; 5.3.1 Boundary Conditions; 5.3.2 Solver Settings; 5.4 Errors and Uncertainties; 5.5 Interpretation and Evaluation of Simulations; 5.6 Example Simulations; 5.6.1 Fully-developed Flow in a Circular Capillary 5.6.2 Movement of a Chemical Plug by Electroosmotic Flow in a Detection Cell5.6.3 Conclusions; 5.7 References; 6 Silicon and Cleanroom Processing; 6.1 Substrate Fabrication; 6.2 Optical Lithography; 6.2.1 Photolithography; 6.2.2 Mask Design; 6.2.3 Hints in Planning Fabrication Runs; 6.3 Deposition; 6.3.1 Fundamentals of Coatings; 6.3.2 Deposition Methods; 6.3.3 Materials; 6.3.4 Lift-off; 6.3.5 Silicides; 6.4 Etching Removal; 6.4.1 Wet-etching Fundamentals; 6.4.2 Etching with HF; 6.4.3 Isotropic Silicon Etch; 6.4.4 Orientation-dependent Silicon Etching 6.4.5 Common Orientation-dependent Etchants6.4.6 Other Etchants; 6.4.7 Effects of Not Stirring a Transport-limited Etch; 6.5 Dry Etching; 6.5.1 Plasma Etching Fundamentals; 6.5.2 Plasma Etching Setups; 6.5.3 Etch Gases; 6.5.4 Laser-assisted Etching; 6.6 Heat Treatment; 6.6.1 Thermal Oxidation; 6.6.2 Diffusion; 6.6.3 Annealing; 6.6.4 Wafer Bonding; 6.7 References; 7 Glass Micromachining; 7.1 Wet Chemical Etching; 7.2 Reactive Ion Etching (RIE) of Glass; 7.3 Laser Patterning; 7.4 Powder Blasting; 7.5 Glass Bonding; 7.6 A Microfabrication Example; 7.7 References; 8 Polymer Micromachining 8.1 Hot Embossing |
| Record Nr. | UNINA-9910830495903321 |
| Weinheim, : Wiley-VCH, c2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Microsystem engineering of lab-on-a-chip devices / / [editors], Oliver Geschke, Henning Klank, Pieter Tellemann
| Microsystem engineering of lab-on-a-chip devices / / [editors], Oliver Geschke, Henning Klank, Pieter Tellemann |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2004 |
| Descrizione fisica | 1 online resource (272 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) |
GeschkeOliver
KlankHenning TellemanPieter |
| Soggetto topico |
Microelectronics
Microtechnology |
| ISBN |
1-280-55863-6
9786610558636 3-527-60636-X 3-527-60165-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Microsystem Engineering of Lab-on-a-chip Devices; Contents; Preface; 1 Introduction; 1.1 Learning from the Experiences of Microelectronics; 1.2 The Advantages of Miniaturizing Systems for Chemical Analysis; 1.3 From Concept to μTAS; 1.4 References; 2 Clean Rooms; 3 Microfluidics - Theoretical Aspects; 3.1 Fluids and Flows; 3.2 Transport Processes; 3.2.1 Types of Transport; 3.2.1.1 Convection; 3.2.1.2 Migration; 3.2.1.3 Diffusion; 3.2.1.4 Dispersion; 3.3 System Design; 3.3.1 Laminar Flow and Diffusion in Action; 3.4 An Application: Biological Fluids; 3.5 References
4 Microfluidics - Components4.1 Valves and Pumps; 4.1.1 Moving Liquids by Electroosmosis; 4.1.2 Mixers; 4.2 Injecting, Dosing, and Metering; 4.3 Temperature Measurement in Microfluidic Systems; 4.3.1 Microreactors; 4.3.2 Temperature Sensors for Microsystems; 4.3.3 Resistance Temperature Detectors; 4.3.3.1 Metals; 4.3.3.2 Nonmetals; 4.3.4 Thermocouples; 4.3.5 Semiconductor Junction Sensors; 4.3.6 Temperature Sensors Built on Other Principles; 4.3.7 Conclusion; 4.4 Optical Sensors; 4.4.1 Instrumentation; 4.4.2 Absorption Detection; 4.4.3 Evanescent-wave Sensing; 4.4.4 Fluorescence Detection 4.5 Electrochemical Sensors4.6 References; 5 Simulations in Microfluidics; 5.1 Physical Aspects and Design; 5.2 Choosing Software and Hardware; 5.2.1 CFD-ACE+Version 6.6; 5.2.2 CoventorWareTM Version 2001.3; 5.2.3 Hardware; 5.2.4 The Core Elements of Typical CFD Software; 5.2.5 Pre-processors; 5.2.6 Solvers; 5.2.7 Post-processors; 5.3 Important Numerical Settings; 5.3.1 Boundary Conditions; 5.3.2 Solver Settings; 5.4 Errors and Uncertainties; 5.5 Interpretation and Evaluation of Simulations; 5.6 Example Simulations; 5.6.1 Fully-developed Flow in a Circular Capillary 5.6.2 Movement of a Chemical Plug by Electroosmotic Flow in a Detection Cell5.6.3 Conclusions; 5.7 References; 6 Silicon and Cleanroom Processing; 6.1 Substrate Fabrication; 6.2 Optical Lithography; 6.2.1 Photolithography; 6.2.2 Mask Design; 6.2.3 Hints in Planning Fabrication Runs; 6.3 Deposition; 6.3.1 Fundamentals of Coatings; 6.3.2 Deposition Methods; 6.3.3 Materials; 6.3.4 Lift-off; 6.3.5 Silicides; 6.4 Etching Removal; 6.4.1 Wet-etching Fundamentals; 6.4.2 Etching with HF; 6.4.3 Isotropic Silicon Etch; 6.4.4 Orientation-dependent Silicon Etching 6.4.5 Common Orientation-dependent Etchants6.4.6 Other Etchants; 6.4.7 Effects of Not Stirring a Transport-limited Etch; 6.5 Dry Etching; 6.5.1 Plasma Etching Fundamentals; 6.5.2 Plasma Etching Setups; 6.5.3 Etch Gases; 6.5.4 Laser-assisted Etching; 6.6 Heat Treatment; 6.6.1 Thermal Oxidation; 6.6.2 Diffusion; 6.6.3 Annealing; 6.6.4 Wafer Bonding; 6.7 References; 7 Glass Micromachining; 7.1 Wet Chemical Etching; 7.2 Reactive Ion Etching (RIE) of Glass; 7.3 Laser Patterning; 7.4 Powder Blasting; 7.5 Glass Bonding; 7.6 A Microfabrication Example; 7.7 References; 8 Polymer Micromachining 8.1 Hot Embossing |
| Record Nr. | UNINA-9910840502503321 |
| Weinheim, : Wiley-VCH, c2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||