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Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim
| Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim |
| Edizione | [1st edition] |
| Pubbl/distr/stampa | Oxford ; ; Philadelphia, : Woodhead Pub., c2011 |
| Descrizione fisica | 1 online resource (353 p.) |
| Disciplina | 621.38152 |
| Altri autori (Persone) | KimChoong-Un |
| Collana | Woodhead Publishing Series in Electronic and Optical Materials |
| Soggetto topico |
Integrated circuits - Deterioration
Electrodiffusion Thin films Interconnects (Integrated circuit technology) |
| ISBN |
9780857093752
0857093754 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht. |
| Record Nr. | UNINA-9911004740003321 |
| Oxford ; ; Philadelphia, : Woodhead Pub., c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Fundamentals of Lead-Free Solder Interconnect Technology : From Microstructures to Reliability / / by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
| Fundamentals of Lead-Free Solder Interconnect Technology : From Microstructures to Reliability / / by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma |
| Autore | Lee Tae-Kyu |
| Edizione | [1st ed. 2015.] |
| Pubbl/distr/stampa | New York, NY : , : Springer US : , : Imprint : Springer, , 2015 |
| Descrizione fisica | 1 online resource (266 p.) |
| Disciplina |
620
620.11295 620.11297 621.381 621.3815 |
| Soggetto topico |
Electronics
Microelectronics Optical materials Electronics - Materials Electronic circuits Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Circuits and Systems |
| ISBN | 1-4614-9266-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again. |
| Record Nr. | UNINA-9910299663303321 |
Lee Tae-Kyu
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| New York, NY : , : Springer US : , : Imprint : Springer, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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