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RF MEMS and their applications [[electronic resource] /] / Vijay K. Varadan, K. J. Vinoy, K.A. Jose
| RF MEMS and their applications [[electronic resource] /] / Vijay K. Varadan, K. J. Vinoy, K.A. Jose |
| Autore | Varadan V. K. <1943-> |
| Pubbl/distr/stampa | West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 |
| Descrizione fisica | 1 online resource (408 p.) |
| Disciplina |
621.3815
621.38413 |
| Altri autori (Persone) |
VinoyK. J <1969-> (Kalarickaparambil Joseph)
JoseK. A |
| Soggetto topico |
Radio circuits - Equipment and supplies
Microelectromechanical systems Microwave circuits |
| ISBN |
1-280-26970-7
9786610269709 0-470-34173-4 0-470-84619-4 0-470-85660-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RF MEMS and Their Applications; Contents; Preface; 1 Microelectromechanical systems (MEMS) and radio frequency MEMS; 1.1 Introduction; 1.2 MEMS; 1.3 Microfabrications for MEMS; 1.3.1 Bulk micromachining of silicon; 1.3.2 Surface micromachining of silicon; 1.3.3 Wafer bonding for MEMS; 1.3.4 LIGA process; 1.3.5 Micromachining of polymeric MEMS devices; 1.3.6 Three-dimensional microfabrications; 1.4 Electromechanical transducers; 1.4.1 Piezoelectric transducers; 1.4.2 Electrostrictive transducers; 1.4.3 Magnetostrictive transducers; 1.4.4 Electrostatic actuators
1.4.5 Electromagnetic transducers1.4.6 Electrodynamic transducers; 1.4.7 Electrothermal actuators; 1.4.8 Comparison of electromechanical actuation schemes; 1.5 Microsensing for MEMS; 1.5.1 Piezoresistive sensing; 1.5.2 Capacitive sensing; 1.5.3 Piezoelectric sensing; 1.5.4 Resonant sensing; 1.5.5 Surface acoustic wave sensors; 1.6 Materials for MEMS; 1.6.1 Metal and metal alloys for MEMS; 1.6.2 Polymers for MEMS; 1.6.3 Other materials for MEMS; 1.7 Scope of this book; References; 2 MEMS materials and fabrication techniques; 2.1 Metals; 2.1.1 Evaporation; 2.1.2 Sputtering; 2.2 Semiconductors 2.2.1 Electrical and chemical properties2.2.2 Growth and deposition; 2.3 Thin films for MEMS and their deposition techniques; 2.3.1 Oxide film formation by thermal oxidation; 2.3.2 Deposition of silicon dioxide and silicon nitride; 2.3.3 Polysilicon film deposition; 2.3.4 Ferroelectric thin films; 2.4 Materials for polymer MEMS; 2.4.1 Classification of polymers; 2.4.2 UV radiation curing; 2.4.3 SU-8 for polymer MEMS; 2.5 Bulk micromachining for silicon-based MEMS; 2.5.1 Isotropic and orientation-dependent wet etching; 2.5.2 Dry etching; 2.5.3 Buried oxide process; 2.5.4 Silicon fusion bonding 2.5.5 Anodic bonding2.6 Silicon surface micromachining; 2.6.1 Sacrificial layer technology; 2.6.2 Material systems in sacrificial layer technology; 2.6.3 Surface micromachining using plasma etching; 2.6.4 Combined integrated-circuit technology and anisotropic wet etching; 2.7 Microstereolithography for polymer MEMS; 2.7.1 Scanning method; 2.7.2 Two-photon microstereolithography; 2.7.3 Surface micromachining of polymer MEMS; 2.7.4 Projection method; 2.7.5 Polymeric MEMS architecture with silicon, metal and ceramics; 2.7.6 Microstereolithography integrated with thick-film lithography 2.8 ConclusionsReferences; 3 RF MEMS switches and micro relays; 3.1 Introduction; 3.2 Switch parameters; 3.3 Basics of switching; 3.3.1 Mechanical switches; 3.3.2 Electronic switches; 3.4 Switches for RF and microwave applications; 3.4.1 Mechanical RF switches; 3.4.2 PIN diode RF switches; 3.4.3 Metal oxide semiconductor field effect transistors and monolithic microwave integrated circuits; 3.4.4 RF MEMS switches; 3.4.5 Integration and biasing issues for RF switches; 3.5 Actuation mechanisms for MEMS devices; 3.5.1 Electrostatic switching; 3.5.2 Approaches for low-actuation-voltage switches 3.5.3 Mercury contact switches |
| Record Nr. | UNINA-9910830401703321 |
Varadan V. K. <1943->
|
||
| West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF MEMS and their applications / / Vijay K. Varadan, K. J. Vinoy, K.A. Jose
| RF MEMS and their applications / / Vijay K. Varadan, K. J. Vinoy, K.A. Jose |
| Autore | Varadan V. K. <1943-> |
| Pubbl/distr/stampa | West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 |
| Descrizione fisica | 1 online resource (408 p.) |
| Disciplina | 621.384/13 |
| Altri autori (Persone) |
VinoyK. J <1969-> (Kalarickaparambil Joseph)
JoseK. A |
| Soggetto topico |
Radio circuits - Equipment and supplies
Microelectromechanical systems Microwave circuits |
| ISBN |
1-280-26970-7
9786610269709 0-470-34173-4 0-470-84619-4 0-470-85660-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RF MEMS and Their Applications; Contents; Preface; 1 Microelectromechanical systems (MEMS) and radio frequency MEMS; 1.1 Introduction; 1.2 MEMS; 1.3 Microfabrications for MEMS; 1.3.1 Bulk micromachining of silicon; 1.3.2 Surface micromachining of silicon; 1.3.3 Wafer bonding for MEMS; 1.3.4 LIGA process; 1.3.5 Micromachining of polymeric MEMS devices; 1.3.6 Three-dimensional microfabrications; 1.4 Electromechanical transducers; 1.4.1 Piezoelectric transducers; 1.4.2 Electrostrictive transducers; 1.4.3 Magnetostrictive transducers; 1.4.4 Electrostatic actuators
1.4.5 Electromagnetic transducers1.4.6 Electrodynamic transducers; 1.4.7 Electrothermal actuators; 1.4.8 Comparison of electromechanical actuation schemes; 1.5 Microsensing for MEMS; 1.5.1 Piezoresistive sensing; 1.5.2 Capacitive sensing; 1.5.3 Piezoelectric sensing; 1.5.4 Resonant sensing; 1.5.5 Surface acoustic wave sensors; 1.6 Materials for MEMS; 1.6.1 Metal and metal alloys for MEMS; 1.6.2 Polymers for MEMS; 1.6.3 Other materials for MEMS; 1.7 Scope of this book; References; 2 MEMS materials and fabrication techniques; 2.1 Metals; 2.1.1 Evaporation; 2.1.2 Sputtering; 2.2 Semiconductors 2.2.1 Electrical and chemical properties2.2.2 Growth and deposition; 2.3 Thin films for MEMS and their deposition techniques; 2.3.1 Oxide film formation by thermal oxidation; 2.3.2 Deposition of silicon dioxide and silicon nitride; 2.3.3 Polysilicon film deposition; 2.3.4 Ferroelectric thin films; 2.4 Materials for polymer MEMS; 2.4.1 Classification of polymers; 2.4.2 UV radiation curing; 2.4.3 SU-8 for polymer MEMS; 2.5 Bulk micromachining for silicon-based MEMS; 2.5.1 Isotropic and orientation-dependent wet etching; 2.5.2 Dry etching; 2.5.3 Buried oxide process; 2.5.4 Silicon fusion bonding 2.5.5 Anodic bonding2.6 Silicon surface micromachining; 2.6.1 Sacrificial layer technology; 2.6.2 Material systems in sacrificial layer technology; 2.6.3 Surface micromachining using plasma etching; 2.6.4 Combined integrated-circuit technology and anisotropic wet etching; 2.7 Microstereolithography for polymer MEMS; 2.7.1 Scanning method; 2.7.2 Two-photon microstereolithography; 2.7.3 Surface micromachining of polymer MEMS; 2.7.4 Projection method; 2.7.5 Polymeric MEMS architecture with silicon, metal and ceramics; 2.7.6 Microstereolithography integrated with thick-film lithography 2.8 ConclusionsReferences; 3 RF MEMS switches and micro relays; 3.1 Introduction; 3.2 Switch parameters; 3.3 Basics of switching; 3.3.1 Mechanical switches; 3.3.2 Electronic switches; 3.4 Switches for RF and microwave applications; 3.4.1 Mechanical RF switches; 3.4.2 PIN diode RF switches; 3.4.3 Metal oxide semiconductor field effect transistors and monolithic microwave integrated circuits; 3.4.4 RF MEMS switches; 3.4.5 Integration and biasing issues for RF switches; 3.5 Actuation mechanisms for MEMS devices; 3.5.1 Electrostatic switching; 3.5.2 Approaches for low-actuation-voltage switches 3.5.3 Mercury contact switches |
| Record Nr. | UNINA-9910877226603321 |
|
Varadan V. K. <1943->
|
||
| West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||