top

  Info

  • Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.

  Info

  • Utilizzare questo link per rimuovere la selezione effettuata.
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Autore Bubert Henning
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, : Wiley, 2011
Descrizione fisica 1 online resource (559 p.)
Disciplina 530.4275
541.33
Altri autori (Persone) JenettHolger
Soggetto topico Thin films - Analysis - Surfaces
Electron spectroscopy
Spectrum analysis
Soggetto genere / forma Electronic books.
ISBN 1-280-55760-5
9786610557608
3-527-60016-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Surface and Thin Film Analysis: A Compendium of Principles, Instrumentation, and Applications; Contents; Preface to the First Edition; Preface to the Second Edition; List of Contributors; 1: Introduction; Part One: Electron Detection; 2: X-Ray Photoelectron Spectroscopy (XPS); 2.1 Principles; 2.2 Instrumentation; 2.2.1 Vacuum Requirements; 2.2.2 X-Ray Sources; 2.2.3 Synchrotron Radiation; 2.2.4 Electron Energy Analyzers; 2.2.5 Spatial Resolution; 2.3 Spectral Information and Chemical Shifts; 2.4 Quantification, Depth Profiling, and Imaging; 2.4.1 Quantification; 2.4.2 Depth Profiling
2.4.3 Imaging2.5 The A uger Parameter; 2.6 Applications; 2.6.1 Catalysis; 2.6.2 Polymers; 2.6.3 Corrosion and Passivation; 2.6.4 Adhesion; 2.6.5 Superconductors; 2.6.6 Semiconductors; 2.7 Ultraviolet Photoelectron Spectroscopy (UPS); References; 3: Auger Electron Spectroscopy (AES); 3.1 Principles; 3.2 Instrumentation; 3.2.1 Vacuum Requirements; 3.2.2 Electron Sources; 3.2.3 Electron-Energy Analyzers; 3.3 Spectral Information; 3.4 Quantification and Depth Profiling; 3.4.1 Quantification; 3.4.2 Depth Profiling; 3.5 Applications; 3.5.1 Grain Boundary Segregation; 3.5.2 Semiconductor Technology
3.5.3 Thin Films and Interfaces3.5.4 Surface Segregation; 3.6 Scanning A uger Microscopy (SAM); References; 4: Electron Energy-Loss Spectroscopy (EELS) and Energy-Filtering Transmission Electron Microscopy (EFTEM); 4.1 Principles; 4.2 Instrumentation; 4.3 Qualitative Spectral Information; 4.3.1 Low-Loss Excitations; 4.3.2 Ionization Losses; 4.3.3 Fine Structures; 4.4 Quantification; 4.5 Imaging of Element Distribution; 4.6 Summary; References; 5: Low-Energy Electron Diffraction (LEED); 5.1 Principles and History; 5.2 Instrumentation; 5.3 Qualitative Information; 5.3.1 LEED Pattern
5.3.2 Spot Profile Analysis5.3.3 Applications and Restrictions; 5.4 Quantitative Structural Information; 5.4.1 Principles; 5.4.2 Experimental Techniques; 5.4.3 Computer Programs; 5.4.4 Applications and Restrictions; 5.5 Low-Energy Electron Microscopy; 5.5.1 Principles of Operation; 5.5.2 Applications and Restrictions; References; 6: Other Electron-Detecting Techniques; 6.1 Ion (Excited) Auger Electron Spectroscopy (IAES); 6.2 Ion Neutralization Spectroscopy (INS); 6.3 Inelastic Electron Tunneling Spectroscopy (IETS); Reference; Part Two: Ion Detection
7: Static Secondary Ion Mass Spectrometry (SSIMS)7.1 Principles; 7.2 Instrumentation; 7.2.1 Ion Sources; 7.2.2 Mass Analyzers; 7.2.2.1 Quadrupole Mass Spectrometers; 7.2.2.2 Time-of-Flight Mass Spectrometry (TOF-MS); 7.3 Quantification; 7.4 Spectral Information; 7.5 Applications; 7.5.1 Oxide Films; 7.5.2 Interfaces; 7.5.3 Polymers; 7.5.4 Biosensors; 7.5.5 Surface Reactions; 7.5.6 Imaging; 7.5.7 Ultra-Shallow Depth Profiling; References; 8: Dynamic Secondary Ion Mass Spectrometry (SIMS); 8.1 Principles; 8.1.1 Compensation of Preferential Sputtering; 8.1.2 Atomic Mixing
8.1.3 Implantation of Primary Ions
Record Nr. UNINA-9910146242703321
Bubert Henning  
Hoboken, : Wiley, 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Autore Bubert Henning
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, : Wiley, 2011
Descrizione fisica 1 online resource (559 p.)
Disciplina 530.4275
541.33
Altri autori (Persone) JenettHolger
Soggetto topico Thin films - Analysis - Surfaces
Electron spectroscopy
Spectrum analysis
ISBN 1-280-55760-5
9786610557608
3-527-60016-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Surface and Thin Film Analysis: A Compendium of Principles, Instrumentation, and Applications; Contents; Preface to the First Edition; Preface to the Second Edition; List of Contributors; 1: Introduction; Part One: Electron Detection; 2: X-Ray Photoelectron Spectroscopy (XPS); 2.1 Principles; 2.2 Instrumentation; 2.2.1 Vacuum Requirements; 2.2.2 X-Ray Sources; 2.2.3 Synchrotron Radiation; 2.2.4 Electron Energy Analyzers; 2.2.5 Spatial Resolution; 2.3 Spectral Information and Chemical Shifts; 2.4 Quantification, Depth Profiling, and Imaging; 2.4.1 Quantification; 2.4.2 Depth Profiling
2.4.3 Imaging2.5 The A uger Parameter; 2.6 Applications; 2.6.1 Catalysis; 2.6.2 Polymers; 2.6.3 Corrosion and Passivation; 2.6.4 Adhesion; 2.6.5 Superconductors; 2.6.6 Semiconductors; 2.7 Ultraviolet Photoelectron Spectroscopy (UPS); References; 3: Auger Electron Spectroscopy (AES); 3.1 Principles; 3.2 Instrumentation; 3.2.1 Vacuum Requirements; 3.2.2 Electron Sources; 3.2.3 Electron-Energy Analyzers; 3.3 Spectral Information; 3.4 Quantification and Depth Profiling; 3.4.1 Quantification; 3.4.2 Depth Profiling; 3.5 Applications; 3.5.1 Grain Boundary Segregation; 3.5.2 Semiconductor Technology
3.5.3 Thin Films and Interfaces3.5.4 Surface Segregation; 3.6 Scanning A uger Microscopy (SAM); References; 4: Electron Energy-Loss Spectroscopy (EELS) and Energy-Filtering Transmission Electron Microscopy (EFTEM); 4.1 Principles; 4.2 Instrumentation; 4.3 Qualitative Spectral Information; 4.3.1 Low-Loss Excitations; 4.3.2 Ionization Losses; 4.3.3 Fine Structures; 4.4 Quantification; 4.5 Imaging of Element Distribution; 4.6 Summary; References; 5: Low-Energy Electron Diffraction (LEED); 5.1 Principles and History; 5.2 Instrumentation; 5.3 Qualitative Information; 5.3.1 LEED Pattern
5.3.2 Spot Profile Analysis5.3.3 Applications and Restrictions; 5.4 Quantitative Structural Information; 5.4.1 Principles; 5.4.2 Experimental Techniques; 5.4.3 Computer Programs; 5.4.4 Applications and Restrictions; 5.5 Low-Energy Electron Microscopy; 5.5.1 Principles of Operation; 5.5.2 Applications and Restrictions; References; 6: Other Electron-Detecting Techniques; 6.1 Ion (Excited) Auger Electron Spectroscopy (IAES); 6.2 Ion Neutralization Spectroscopy (INS); 6.3 Inelastic Electron Tunneling Spectroscopy (IETS); Reference; Part Two: Ion Detection
7: Static Secondary Ion Mass Spectrometry (SSIMS)7.1 Principles; 7.2 Instrumentation; 7.2.1 Ion Sources; 7.2.2 Mass Analyzers; 7.2.2.1 Quadrupole Mass Spectrometers; 7.2.2.2 Time-of-Flight Mass Spectrometry (TOF-MS); 7.3 Quantification; 7.4 Spectral Information; 7.5 Applications; 7.5.1 Oxide Films; 7.5.2 Interfaces; 7.5.3 Polymers; 7.5.4 Biosensors; 7.5.5 Surface Reactions; 7.5.6 Imaging; 7.5.7 Ultra-Shallow Depth Profiling; References; 8: Dynamic Secondary Ion Mass Spectrometry (SIMS); 8.1 Principles; 8.1.1 Compensation of Preferential Sputtering; 8.1.2 Atomic Mixing
8.1.3 Implantation of Primary Ions
Record Nr. UNISA-996216258403316
Bubert Henning  
Hoboken, : Wiley, 2011
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Autore Bubert Henning
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, : Wiley, 2011
Descrizione fisica 1 online resource (559 p.)
Disciplina 530.4275
541.33
Altri autori (Persone) JenettHolger
Soggetto topico Thin films - Analysis - Surfaces
Electron spectroscopy
Spectrum analysis
ISBN 1-280-55760-5
9786610557608
3-527-60016-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Surface and Thin Film Analysis: A Compendium of Principles, Instrumentation, and Applications; Contents; Preface to the First Edition; Preface to the Second Edition; List of Contributors; 1: Introduction; Part One: Electron Detection; 2: X-Ray Photoelectron Spectroscopy (XPS); 2.1 Principles; 2.2 Instrumentation; 2.2.1 Vacuum Requirements; 2.2.2 X-Ray Sources; 2.2.3 Synchrotron Radiation; 2.2.4 Electron Energy Analyzers; 2.2.5 Spatial Resolution; 2.3 Spectral Information and Chemical Shifts; 2.4 Quantification, Depth Profiling, and Imaging; 2.4.1 Quantification; 2.4.2 Depth Profiling
2.4.3 Imaging2.5 The A uger Parameter; 2.6 Applications; 2.6.1 Catalysis; 2.6.2 Polymers; 2.6.3 Corrosion and Passivation; 2.6.4 Adhesion; 2.6.5 Superconductors; 2.6.6 Semiconductors; 2.7 Ultraviolet Photoelectron Spectroscopy (UPS); References; 3: Auger Electron Spectroscopy (AES); 3.1 Principles; 3.2 Instrumentation; 3.2.1 Vacuum Requirements; 3.2.2 Electron Sources; 3.2.3 Electron-Energy Analyzers; 3.3 Spectral Information; 3.4 Quantification and Depth Profiling; 3.4.1 Quantification; 3.4.2 Depth Profiling; 3.5 Applications; 3.5.1 Grain Boundary Segregation; 3.5.2 Semiconductor Technology
3.5.3 Thin Films and Interfaces3.5.4 Surface Segregation; 3.6 Scanning A uger Microscopy (SAM); References; 4: Electron Energy-Loss Spectroscopy (EELS) and Energy-Filtering Transmission Electron Microscopy (EFTEM); 4.1 Principles; 4.2 Instrumentation; 4.3 Qualitative Spectral Information; 4.3.1 Low-Loss Excitations; 4.3.2 Ionization Losses; 4.3.3 Fine Structures; 4.4 Quantification; 4.5 Imaging of Element Distribution; 4.6 Summary; References; 5: Low-Energy Electron Diffraction (LEED); 5.1 Principles and History; 5.2 Instrumentation; 5.3 Qualitative Information; 5.3.1 LEED Pattern
5.3.2 Spot Profile Analysis5.3.3 Applications and Restrictions; 5.4 Quantitative Structural Information; 5.4.1 Principles; 5.4.2 Experimental Techniques; 5.4.3 Computer Programs; 5.4.4 Applications and Restrictions; 5.5 Low-Energy Electron Microscopy; 5.5.1 Principles of Operation; 5.5.2 Applications and Restrictions; References; 6: Other Electron-Detecting Techniques; 6.1 Ion (Excited) Auger Electron Spectroscopy (IAES); 6.2 Ion Neutralization Spectroscopy (INS); 6.3 Inelastic Electron Tunneling Spectroscopy (IETS); Reference; Part Two: Ion Detection
7: Static Secondary Ion Mass Spectrometry (SSIMS)7.1 Principles; 7.2 Instrumentation; 7.2.1 Ion Sources; 7.2.2 Mass Analyzers; 7.2.2.1 Quadrupole Mass Spectrometers; 7.2.2.2 Time-of-Flight Mass Spectrometry (TOF-MS); 7.3 Quantification; 7.4 Spectral Information; 7.5 Applications; 7.5.1 Oxide Films; 7.5.2 Interfaces; 7.5.3 Polymers; 7.5.4 Biosensors; 7.5.5 Surface Reactions; 7.5.6 Imaging; 7.5.7 Ultra-Shallow Depth Profiling; References; 8: Dynamic Secondary Ion Mass Spectrometry (SIMS); 8.1 Principles; 8.1.1 Compensation of Preferential Sputtering; 8.1.2 Atomic Mixing
8.1.3 Implantation of Primary Ions
Record Nr. UNINA-9910830454203321
Bubert Henning  
Hoboken, : Wiley, 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Surface and Thin Film Analysis : A Compendium of Principles, Instrumentation and Applications
Autore Bubert Henning
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, : Wiley, 2011
Descrizione fisica 1 online resource (559 p.)
Disciplina 530.4275
541.33
Altri autori (Persone) JenettHolger
Soggetto topico Thin films - Analysis - Surfaces
Electron spectroscopy
Spectrum analysis
ISBN 1-280-55760-5
9786610557608
3-527-60016-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Surface and Thin Film Analysis: A Compendium of Principles, Instrumentation, and Applications; Contents; Preface to the First Edition; Preface to the Second Edition; List of Contributors; 1: Introduction; Part One: Electron Detection; 2: X-Ray Photoelectron Spectroscopy (XPS); 2.1 Principles; 2.2 Instrumentation; 2.2.1 Vacuum Requirements; 2.2.2 X-Ray Sources; 2.2.3 Synchrotron Radiation; 2.2.4 Electron Energy Analyzers; 2.2.5 Spatial Resolution; 2.3 Spectral Information and Chemical Shifts; 2.4 Quantification, Depth Profiling, and Imaging; 2.4.1 Quantification; 2.4.2 Depth Profiling
2.4.3 Imaging2.5 The A uger Parameter; 2.6 Applications; 2.6.1 Catalysis; 2.6.2 Polymers; 2.6.3 Corrosion and Passivation; 2.6.4 Adhesion; 2.6.5 Superconductors; 2.6.6 Semiconductors; 2.7 Ultraviolet Photoelectron Spectroscopy (UPS); References; 3: Auger Electron Spectroscopy (AES); 3.1 Principles; 3.2 Instrumentation; 3.2.1 Vacuum Requirements; 3.2.2 Electron Sources; 3.2.3 Electron-Energy Analyzers; 3.3 Spectral Information; 3.4 Quantification and Depth Profiling; 3.4.1 Quantification; 3.4.2 Depth Profiling; 3.5 Applications; 3.5.1 Grain Boundary Segregation; 3.5.2 Semiconductor Technology
3.5.3 Thin Films and Interfaces3.5.4 Surface Segregation; 3.6 Scanning A uger Microscopy (SAM); References; 4: Electron Energy-Loss Spectroscopy (EELS) and Energy-Filtering Transmission Electron Microscopy (EFTEM); 4.1 Principles; 4.2 Instrumentation; 4.3 Qualitative Spectral Information; 4.3.1 Low-Loss Excitations; 4.3.2 Ionization Losses; 4.3.3 Fine Structures; 4.4 Quantification; 4.5 Imaging of Element Distribution; 4.6 Summary; References; 5: Low-Energy Electron Diffraction (LEED); 5.1 Principles and History; 5.2 Instrumentation; 5.3 Qualitative Information; 5.3.1 LEED Pattern
5.3.2 Spot Profile Analysis5.3.3 Applications and Restrictions; 5.4 Quantitative Structural Information; 5.4.1 Principles; 5.4.2 Experimental Techniques; 5.4.3 Computer Programs; 5.4.4 Applications and Restrictions; 5.5 Low-Energy Electron Microscopy; 5.5.1 Principles of Operation; 5.5.2 Applications and Restrictions; References; 6: Other Electron-Detecting Techniques; 6.1 Ion (Excited) Auger Electron Spectroscopy (IAES); 6.2 Ion Neutralization Spectroscopy (INS); 6.3 Inelastic Electron Tunneling Spectroscopy (IETS); Reference; Part Two: Ion Detection
7: Static Secondary Ion Mass Spectrometry (SSIMS)7.1 Principles; 7.2 Instrumentation; 7.2.1 Ion Sources; 7.2.2 Mass Analyzers; 7.2.2.1 Quadrupole Mass Spectrometers; 7.2.2.2 Time-of-Flight Mass Spectrometry (TOF-MS); 7.3 Quantification; 7.4 Spectral Information; 7.5 Applications; 7.5.1 Oxide Films; 7.5.2 Interfaces; 7.5.3 Polymers; 7.5.4 Biosensors; 7.5.5 Surface Reactions; 7.5.6 Imaging; 7.5.7 Ultra-Shallow Depth Profiling; References; 8: Dynamic Secondary Ion Mass Spectrometry (SIMS); 8.1 Principles; 8.1.1 Compensation of Preferential Sputtering; 8.1.2 Atomic Mixing
8.1.3 Implantation of Primary Ions
Record Nr. UNINA-9910840503903321
Bubert Henning  
Hoboken, : Wiley, 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui