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Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang
| Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang |
| Autore | Huang YongAn |
| Edizione | [1st ed. 2022.] |
| Pubbl/distr/stampa | Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381 |
| Soggetto topico | Flexible electronics |
| ISBN | 981-19-6623-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction of flexible electronics -- Chapter 2. Buckling of film-on-substrate -- Chapter 3. Buckling of fibers-on-substrate -- Chapter 4. Self-similar design without substrate -- Chapter 5. Self-similar design with substrate -- Chapter 6. Conformal design with rigid substrate -- Chapter 7. Conformal design with soft substrate -- Chapter 8. Deformation instability under compression -- Chapter 9. Deformation instability under stretching -- Chapter 10. Multiple neutral layer design for flexible electronics -- Chapter 11. Liquid metal for stretchable electronics -- Chapter 12. Devices and applications of flexible electronics. |
| Record Nr. | UNISA-996503462803316 |
Huang YongAn
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| Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang
| Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang |
| Autore | Huang YongAn |
| Edizione | [1st ed. 2022.] |
| Pubbl/distr/stampa | Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381 |
| Soggetto topico | Flexible electronics |
| ISBN | 981-19-6623-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction of flexible electronics -- Chapter 2. Buckling of film-on-substrate -- Chapter 3. Buckling of fibers-on-substrate -- Chapter 4. Self-similar design without substrate -- Chapter 5. Self-similar design with substrate -- Chapter 6. Conformal design with rigid substrate -- Chapter 7. Conformal design with soft substrate -- Chapter 8. Deformation instability under compression -- Chapter 9. Deformation instability under stretching -- Chapter 10. Multiple neutral layer design for flexible electronics -- Chapter 11. Liquid metal for stretchable electronics -- Chapter 12. Devices and applications of flexible electronics. |
| Record Nr. | UNINA-9910637720703321 |
|
Huang YongAn
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| Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Modeling and Application of Flexible Electronics Packaging [[electronic resource] /] / by YongAn Huang, Zhouping Yin, Xiaodong Wan
| Modeling and Application of Flexible Electronics Packaging [[electronic resource] /] / by YongAn Huang, Zhouping Yin, Xiaodong Wan |
| Autore | Huang YongAn |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (XVII, 287 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics
Microelectronics Optical materials Electronic materials Manufactures Mechanics Mechanics, Applied Computer simulation Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Manufacturing, Machines, Tools, Processes Theoretical and Applied Mechanics Simulation and Modeling |
| ISBN | 981-13-3627-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on. |
| Record Nr. | UNINA-9910350301703321 |
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Huang YongAn
|
||
| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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