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Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang
| Flexible Electronics : Theory and Method of Structural Design / / Yongan Huang, YeWang Su, and Shan Jiang |
| Autore | Huang YongAn |
| Edizione | [1st ed. 2022.] |
| Pubbl/distr/stampa | Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381 |
| Soggetto topico | Flexible electronics |
| ISBN | 981-19-6623-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction of flexible electronics -- Chapter 2. Buckling of film-on-substrate -- Chapter 3. Buckling of fibers-on-substrate -- Chapter 4. Self-similar design without substrate -- Chapter 5. Self-similar design with substrate -- Chapter 6. Conformal design with rigid substrate -- Chapter 7. Conformal design with soft substrate -- Chapter 8. Deformation instability under compression -- Chapter 9. Deformation instability under stretching -- Chapter 10. Multiple neutral layer design for flexible electronics -- Chapter 11. Liquid metal for stretchable electronics -- Chapter 12. Devices and applications of flexible electronics. |
| Record Nr. | UNISA-996503462803316 |
Huang YongAn
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| Singapore ; ; Beijing, China : , : Springer : , : Science Press, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Flexible Electronics : Theory and Method of Structural Design / / by YongAn Huang, YeWang Su, Shan Jiang
| Flexible Electronics : Theory and Method of Structural Design / / by YongAn Huang, YeWang Su, Shan Jiang |
| Autore | Huang YongAn |
| Edizione | [1st ed. 2022.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2022 |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Mechanics, Applied
Solids Materials Production engineering Solid Mechanics Materials Engineering Process Engineering |
| ISBN | 981-19-6623-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction of flexible electronics -- Chapter 2. Buckling of film-on-substrate -- Chapter 3. Buckling of fibers-on-substrate -- Chapter 4. Self-similar design without substrate -- Chapter 5. Self-similar design with substrate -- Chapter 6. Conformal design with rigid substrate -- Chapter 7. Conformal design with soft substrate -- Chapter 8. Deformation instability under compression -- Chapter 9. Deformation instability under stretching -- Chapter 10. Multiple neutral layer design for flexible electronics -- Chapter 11. Liquid metal for stretchable electronics -- Chapter 12. Devices and applications of flexible electronics. |
| Record Nr. | UNINA-9910637720703321 |
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Huang YongAn
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| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Modeling and Application of Flexible Electronics Packaging / / by YongAn Huang, Zhouping Yin, Xiaodong Wan
| Modeling and Application of Flexible Electronics Packaging / / by YongAn Huang, Zhouping Yin, Xiaodong Wan |
| Autore | Huang YongAn |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (XVII, 287 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics
Microelectronics Optical materials Electronics - Materials Manufactures Mechanics Mechanics, Applied Computer simulation Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Manufacturing, Machines, Tools, Processes Theoretical and Applied Mechanics Simulation and Modeling |
| ISBN | 981-13-3627-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on. |
| Record Nr. | UNINA-9910350301703321 |
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Huang YongAn
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| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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