Info
- Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.
Microwave power amplifier design with MMIC modules / / Howard Hausman
| Microwave power amplifier design with MMIC modules / / Howard Hausman |
| Autore | Hausman Howard |
| Pubbl/distr/stampa | Norwood, Massachusetts : , : Artech House, , [2018] |
| Descrizione fisica | 1 online resource (xxii, 366 pages) |
| Disciplina | 621.38412 |
| Collana | Artech House microwave library |
| Soggetto topico |
Power amplifiers - Design and construction
Microwave amplifiers - Design and construction Microwave equipment - Circuits |
| Soggetto genere / forma | Electronic books. |
| ISBN | 1-63081-525-X |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Intro; Microwave Power Amplifier Design with MMIC Modules; Contents; Preface; Introduction; Part I: Useful Microwave Design Concepts; Part II: Designing the Power Amplifier; Part III: Designing the Power Amplifier System; Summary; Chapter 1 Introduction; 1.1 Introduction to Designing Microwave Solid State Power Amplifiers; 1.2 Applications of SSPAs; 1.3 A Typical SSPA Configuration; 1.4 Typical Documents Starting a Project; 1.5 General Format of the SCD; 1.5.1 Paragraph 1.0: Scope; 1.5.2 Paragraph 2.0: Applicable Documents; 1.5.3 Paragraph 3.0: Requirements; 1.5.4 Paragraph 4.0: Verification.
1.5.5 Paragraph 5.0: Packaging1.5.6 Paragraph 6.0: Notes; 1.6 Requirements Section of an SCD; 1.6.1 Electrical Requirements; 1.6.2 Mechanical Requirements; 1.6.3 Environmental Requirements; 1.6.4 Other Design Criteria; References; Part I Useful Microwave Design Concepts; Chapter 2 Lumped Components in RF and Microwave Circuitry; 2.1 Applicability of Lumped Element Analysis; 2.1.1 Calculating Wavelengths; 2.1.2 Example: Calculating Wavelengths for Lumped Circuit Analysis; 2.2 Capacitor Characteristics at High Frequencies; 2.2.1 Single-Layer and Multilayer Capacitor Construction. 2.2.2 High-Frequency Capacitor Models2.2.3 Capacitor Losses (Q); 2.2.4 Capacitor Resonance; 2.3 Resistor Characteristics at High Frequencies; 2.3.1 High-Frequency Surface Mount Resistors; 2.3.2 Flip-Chip Surface Mount Resistors; 2.3.3 Thick-Film and Thin-Film Surface-Mount Resistors; 2.3.4 High-Frequency Effects of Thick-Film and Thin-Film Resistors; 2.3.5 Notes on Thin-Film Resistors; 2.3.6 Notes on Thick-Film Resistors; 2.4 Inductors; 2.4.1 Calculating Inductance of a Cylindrical Coil of Wire; 2.4.2 Inductors at High Frequencies; 2.4.3 Inductors at Resonance. 2.4.4 Inductance of a Straight Wire2.4.5 Planar Spiral Inductors; 2.4.6 Conical Inductors; 2.4.7 Inductance of Via Holes; 2.4.8 Inductance of Bond Wire; 2.4.9 Inductance of Flat or Ribbon Wire; References; Chapter 3 Transmission Lines; 3.1 Introduction to Transmission Line Theory; 3.2 Common Transmission Line Topologies; 3.3 Transmission Line Characteristics Using Lumped Circuit Elements; 3.3.1 Distributed Lumped Constant Model; 3.3.2 Modeling a Microstrip Transmission Line with Distributed Lumped Elements; 3.3.3 Characteristic Impedance of Transmission Line from the Lumped Circuit Model. |
| Record Nr. | UNINA-9910480354303321 |
Hausman Howard
|
||
| Norwood, Massachusetts : , : Artech House, , [2018] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Microwave power amplifier design with MMIC modules / / Howard Hausman
| Microwave power amplifier design with MMIC modules / / Howard Hausman |
| Autore | Hausman Howard |
| Pubbl/distr/stampa | Norwood, Massachusetts : , : Artech House, , [2018] |
| Descrizione fisica | 1 online resource (xxii, 366 pages) |
| Disciplina | 621.38412 |
| Collana | Artech House microwave library |
| Soggetto topico |
Power amplifiers - Design and construction
Microwave amplifiers - Design and construction Microwave equipment - Circuits |
| ISBN | 1-63081-525-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Intro; Microwave Power Amplifier Design with MMIC Modules; Contents; Preface; Introduction; Part I: Useful Microwave Design Concepts; Part II: Designing the Power Amplifier; Part III: Designing the Power Amplifier System; Summary; Chapter 1 Introduction; 1.1 Introduction to Designing Microwave Solid State Power Amplifiers; 1.2 Applications of SSPAs; 1.3 A Typical SSPA Configuration; 1.4 Typical Documents Starting a Project; 1.5 General Format of the SCD; 1.5.1 Paragraph 1.0: Scope; 1.5.2 Paragraph 2.0: Applicable Documents; 1.5.3 Paragraph 3.0: Requirements; 1.5.4 Paragraph 4.0: Verification.
1.5.5 Paragraph 5.0: Packaging1.5.6 Paragraph 6.0: Notes; 1.6 Requirements Section of an SCD; 1.6.1 Electrical Requirements; 1.6.2 Mechanical Requirements; 1.6.3 Environmental Requirements; 1.6.4 Other Design Criteria; References; Part I Useful Microwave Design Concepts; Chapter 2 Lumped Components in RF and Microwave Circuitry; 2.1 Applicability of Lumped Element Analysis; 2.1.1 Calculating Wavelengths; 2.1.2 Example: Calculating Wavelengths for Lumped Circuit Analysis; 2.2 Capacitor Characteristics at High Frequencies; 2.2.1 Single-Layer and Multilayer Capacitor Construction. 2.2.2 High-Frequency Capacitor Models2.2.3 Capacitor Losses (Q); 2.2.4 Capacitor Resonance; 2.3 Resistor Characteristics at High Frequencies; 2.3.1 High-Frequency Surface Mount Resistors; 2.3.2 Flip-Chip Surface Mount Resistors; 2.3.3 Thick-Film and Thin-Film Surface-Mount Resistors; 2.3.4 High-Frequency Effects of Thick-Film and Thin-Film Resistors; 2.3.5 Notes on Thin-Film Resistors; 2.3.6 Notes on Thick-Film Resistors; 2.4 Inductors; 2.4.1 Calculating Inductance of a Cylindrical Coil of Wire; 2.4.2 Inductors at High Frequencies; 2.4.3 Inductors at Resonance. 2.4.4 Inductance of a Straight Wire2.4.5 Planar Spiral Inductors; 2.4.6 Conical Inductors; 2.4.7 Inductance of Via Holes; 2.4.8 Inductance of Bond Wire; 2.4.9 Inductance of Flat or Ribbon Wire; References; Chapter 3 Transmission Lines; 3.1 Introduction to Transmission Line Theory; 3.2 Common Transmission Line Topologies; 3.3 Transmission Line Characteristics Using Lumped Circuit Elements; 3.3.1 Distributed Lumped Constant Model; 3.3.2 Modeling a Microstrip Transmission Line with Distributed Lumped Elements; 3.3.3 Characteristic Impedance of Transmission Line from the Lumped Circuit Model. |
| Record Nr. | UNINA-9910793011803321 |
|
Hausman Howard
|
||
| Norwood, Massachusetts : , : Artech House, , [2018] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Microwave power amplifier design with MMIC modules / / Howard Hausman
| Microwave power amplifier design with MMIC modules / / Howard Hausman |
| Autore | Hausman Howard |
| Pubbl/distr/stampa | Norwood, Massachusetts : , : Artech House, , [2018] |
| Descrizione fisica | 1 online resource (xxii, 366 pages) |
| Disciplina | 621.38412 |
| Collana | Artech House microwave library |
| Soggetto topico |
Power amplifiers - Design and construction
Microwave amplifiers - Design and construction Microwave equipment - Circuits |
| ISBN | 1-63081-525-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Intro; Microwave Power Amplifier Design with MMIC Modules; Contents; Preface; Introduction; Part I: Useful Microwave Design Concepts; Part II: Designing the Power Amplifier; Part III: Designing the Power Amplifier System; Summary; Chapter 1 Introduction; 1.1 Introduction to Designing Microwave Solid State Power Amplifiers; 1.2 Applications of SSPAs; 1.3 A Typical SSPA Configuration; 1.4 Typical Documents Starting a Project; 1.5 General Format of the SCD; 1.5.1 Paragraph 1.0: Scope; 1.5.2 Paragraph 2.0: Applicable Documents; 1.5.3 Paragraph 3.0: Requirements; 1.5.4 Paragraph 4.0: Verification.
1.5.5 Paragraph 5.0: Packaging1.5.6 Paragraph 6.0: Notes; 1.6 Requirements Section of an SCD; 1.6.1 Electrical Requirements; 1.6.2 Mechanical Requirements; 1.6.3 Environmental Requirements; 1.6.4 Other Design Criteria; References; Part I Useful Microwave Design Concepts; Chapter 2 Lumped Components in RF and Microwave Circuitry; 2.1 Applicability of Lumped Element Analysis; 2.1.1 Calculating Wavelengths; 2.1.2 Example: Calculating Wavelengths for Lumped Circuit Analysis; 2.2 Capacitor Characteristics at High Frequencies; 2.2.1 Single-Layer and Multilayer Capacitor Construction. 2.2.2 High-Frequency Capacitor Models2.2.3 Capacitor Losses (Q); 2.2.4 Capacitor Resonance; 2.3 Resistor Characteristics at High Frequencies; 2.3.1 High-Frequency Surface Mount Resistors; 2.3.2 Flip-Chip Surface Mount Resistors; 2.3.3 Thick-Film and Thin-Film Surface-Mount Resistors; 2.3.4 High-Frequency Effects of Thick-Film and Thin-Film Resistors; 2.3.5 Notes on Thin-Film Resistors; 2.3.6 Notes on Thick-Film Resistors; 2.4 Inductors; 2.4.1 Calculating Inductance of a Cylindrical Coil of Wire; 2.4.2 Inductors at High Frequencies; 2.4.3 Inductors at Resonance. 2.4.4 Inductance of a Straight Wire2.4.5 Planar Spiral Inductors; 2.4.6 Conical Inductors; 2.4.7 Inductance of Via Holes; 2.4.8 Inductance of Bond Wire; 2.4.9 Inductance of Flat or Ribbon Wire; References; Chapter 3 Transmission Lines; 3.1 Introduction to Transmission Line Theory; 3.2 Common Transmission Line Topologies; 3.3 Transmission Line Characteristics Using Lumped Circuit Elements; 3.3.1 Distributed Lumped Constant Model; 3.3.2 Modeling a Microstrip Transmission Line with Distributed Lumped Elements; 3.3.3 Characteristic Impedance of Transmission Line from the Lumped Circuit Model. |
| Record Nr. | UNINA-9910817270903321 |
|
Hausman Howard
|
||
| Norwood, Massachusetts : , : Artech House, , [2018] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||