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Handbook of Thick- and Thin-Film Hybrid Microelectronics
| Handbook of Thick- and Thin-Film Hybrid Microelectronics |
| Autore | Gupta Tapan K |
| Pubbl/distr/stampa | [Place of publication not identified], : Wiley Interscience Imprint, 2003 |
| Descrizione fisica | 1 online resource (419 pages) |
| Disciplina | 621.381 |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-55712-5
9786610557127 0-470-30791-9 0-471-72366-5 0-471-72367-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910146077003321 |
Gupta Tapan K
|
||
| [Place of publication not identified], : Wiley Interscience Imprint, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Handbook of Thick- and Thin-Film Hybrid Microelectronics
| Handbook of Thick- and Thin-Film Hybrid Microelectronics |
| Autore | Gupta Tapan K |
| Pubbl/distr/stampa | [Place of publication not identified], : Wiley Interscience Imprint, 2003 |
| Descrizione fisica | 1 online resource (419 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Hybrid integrated circuits
Thick-film circuits Thin-film circuits |
| ISBN |
1-280-55712-5
9786610557127 0-470-30791-9 0-471-72366-5 0-471-72367-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Preface -- 1 Introduction -- 1.1 Hybrid Microcircuit Family, -- 1.1.1 Printed Circuit Board, -- 1.1.2 Thick Film, -- 1.1.3 Thin Film, -- 1.1.4 Integrated Circuit, -- 1.1.5 Modules, -- 1.2 Need for Hybrid Microcircuits, -- 1.2.1 Multilayer Circuits, -- 1.2.2 Military Applications, -- 1.2.3 Data Processing, -- 1.2.4 Telecommunications, -- 1.2.5 Automotive Industry, -- 1.2.6 Medical Science, -- 1.2.7 Aerospace Systems, -- 1.2.8 High-Frequency Circuits, -- 1.3 Why Hybrid Microcircuits? -- 1.4 Applications of Hybrid Microcircuits, -- 1.4.1 Automotive Industry, -- 1.4.2 Commercial Products, -- 1.4.3 Medical Science, -- 1.4.4 Telecommunications, -- 1.4.5 Consumer Electronics, -- 1.4.6 Military Applications, -- 1.5 Typical Microelectronic Products, -- 1.5.1 Consumer Electronics, -- 1.5.2 Industrial Applications, -- 1.5.3 Military and Aerospace Applications, -- 1.5.4 Automotive Industry, -- 1.5.5 Microwave Engineering, -- 1.5.6 Multichip Modules, -- 1.6 Summary, -- References, -- Recommended Reading, -- 2 Mathematical Foundations, Circuit Design, and Layout Rules for Hybrid Microcircuits -- 2.1 Mathematical Foundations, -- 2.1.1 Factors Affecting the Value of a Resistor, -- 2.1.2 Mathematical Model for Thick-Film Deposition, -- 2.1.3 Theoretical Model for Screen-Printed Film Thickness, -- 2.1.4 Thick-Film Resistor Design, -- 2.1.5 Theoretical Model for Thin-Film Thickness, -- 2.1.6 Dissipation Factor or Dielectric Loss within a Dielectric Material, -- 2.1.7 Inductors, -- 2.1.8 Theoretical Model for Transport Properties during Hermetic Sealing, -- 2.2 Circuit Design and Layout Rules, -- 2.2.1 Hybrid Circuit Design Elements, -- 2.2.2 Thick-Film Hybrid Circuit Design, -- 2.2.3 Basic Rules for Laying Out Hybrid Microcircuits, -- References, -- Recommended Reading, -- 3 Computer-Aided Design and Pattern Generation Techniques -- 3.1 Computer-Aided Design Techniques, -- 3.1.1 S ze and Complexity of Hybrid Microcircuits, -- 3.1.2 CALMA Online Design Process, -- 3.1.3 Computer-Aided Engineering to Design Hybrid Microcircuits, -- 3.1.4 Circuit Layout Design, -- 3.2 Pattern Generation Techniques, -- 3.2.1 Additive Processes, -- 3.2.2 Subtractive Processes, -- 3.2.3 Photolithography, -- References, -- Recommended Reading, -- 4 Thick-Film Fundamentals -- 4.1 Thick-Film Substrates, -- 4.1.1 Substrate Materials, -- 4.1.2 Physical Properties, -- 4.1.3 Substrate Fabrication, -- 4.1.4 Electrical Properties, -- 4.1.5 Multilayer Technology Using LTCC, -- 4.2 Thick-Film Conductors, -- 4.2.1 Conduction in Metals, -- 4.2.2 Conductor Materials, -- 4.2.3 Conductor Pastes, -- 4.3 Thick-Film Resistors, -- 4.3.1 Physical Properties, -- 4.3.2 Resistor Characteristics, -- 4.4 Dielectric Inks and Pastes, -- 4.4.1 Low-K Dielectric Materials, -- 4.4.2 High-K Dielectric Materials, -- 4.5 Thick-Film Inductors, -- References, -- Recommended Reading, -- 5 Thick-Film Deposition Techniques -- 5.1 Thick-Film Processing, -- 5.2 Screen Printing, -- 5.2.1 Screen Printer, -- 5.2.2 Drying and Firing, -- References, -- Recommended Reading, -- 6 Thin-Film Fundamentals -- 180 -- 6.1 Thin-Film Substrates, -- 6.1.1 Substrate Materials, -- 6.2 Physical Characteristics, -- 6.2.1 Characteristics of Substrates, -- 6.2.2 Characteristics of Metals, -- 6.3 Thin-Film Conductors, -- 6.3.1 Conductor Materials and Properties, -- 6.4 Thin-Film Resistors, -- 6.4.1 Resistor Properties, -- 6.4.2 Resistor Materials, -- 6.5 Thin-Film Capacitors, -- 6.5.1 Capacitor Properties, -- 6.5.2 Capacitor Materials, -- 6.6 Thin-Film Inductors, -- 6.7 Technologies of the Twenty-First Century, -- References, -- Recommended Reading, -- 219 -- 7 Thin-Film Deposition Techniques -- 7.1 Physical Vapor Deposition, -- 7.1.1 Turbo Pump, -- 7.1.2 Cryogenic Pump, -- 7.2 Flash Evaporation, -- 7.3 Sputter ng, -- 7.4 Chemical Vapor Deposition, -- 7.5 Ion-Beam Deposition, -- 7.5.1 Ion-Beam Sputter Deposition, -- 7.5.2 Ion-Beam-Assisted Deposition, -- 7.6 Pulsed-Laser Deposition (Laser Ablation), -- 7.7 High-Density Plasma-Assisted Deposition, -- 7.8 Electroplating, -- 7.8.1 Electrode Electroplating, -- 7.8.2 Electroless Electroplating, -- 7.9 Sol-Gel Coating, -- 7.10 Atomic Layer Deposition, -- 7.11 Summary, -- References, -- Recommended Reading, -- 8 Component Assembly and Interconnections -- 8.1 Component Assembly, -- 8.1.1 S licon-Gold Eutectic Bonding, -- 8.1.2 Adhesive and Epoxy Bonding, -- 8.1.3 Solder Joint Bonding, -- 8.1.4 Solder Alloys, -- 8.1.5 Solder Reflow System, -- 8.1.6 Lead-Free Interconnects, -- 8.2 Interconnections, -- 8.2.1 Thermocompression Wire Bonding, -- 8.2.2 Thermosonic Wire Bonding, -- 8.2.3 Ultrasonic Wire Bonding, -- 8.2.4 Automated Single-Point Tape Automated Bonding, -- 8.2.5 Laser Wire Bonding, -- 8.2.6 Flip-Chip Bonding, -- References, -- Recommended Reading, -- 9 Adjustment of Passive Components -- 9.l Airbrasive Trimming, -- 9.2 Laser Trimming, -- 9.2.1 Carbon Dioxide Laser, -- 9.2.2 Yttrium-Aluminum-Garnet Laser, -- 9.3 Laser Trimming Systems, -- 9.3.1 Trimming Procedure, -- 9.3.2 Design Criteria for Resistor Trimming, -- 9.4 Definitions, -- References, -- Recommended Reading, -- 10 Packaging and Thermal Considerations -- 10.1 Packaging Materials, -- 10.2 Packaging Systems, -- 10.2.1 TO Packages, -- 10.2.2 Flat-Case Packages, -- 10.2.3 Chip Carriers, -- 10.2.4 Small-Outline Packages, -- 10.2.5 Systems on a Chip, -- 10.2.6 Chip-Scale Packages, -- 10.2.7 Wafer-Level Packaging, -- 10.2.8 Three-Dimensional Packaging, -- 10.3 Package Sealing, -- 10.4 Thermal Effects on Electronic Packaging, -- 10.4.1 Power Dissipation, -- 10.4.2 Thermal Design Calculations, -- 10.5 Non-Steady-State Heat Transfer Model, -- 10.5.1 Thermal Resistance inside the Substrate, -- 10.5.2 Natural Convection, -- 10.5.3 Thermal Radiation, -- 10.5.4 Thermal Resistance of Nitrogen Gas, -- 10.5.5 Heat Conduction inside the Kovar Shell, -- 10.6 Flip-Chip Technology, -- 10.7 Packaging Material Reliability, -- References, -- Recommended Reading, -- 11 Multichip Module and Microwave Hybrid Circuits -- 331 -- 11.1 Multichip Module Circuits, -- 11.1.1 Conductor Materials, -- 11.1.2 Summary, -- 11.2 Microwave Hybrid Circuits, -- 344 -- 11.2.1 Major Circuit Requirements, -- 11.2.2 Waveguides, -- 11.2.3 Transmission Lines, -- 11.2.4 Lumped Circuit Elements, -- 11.2.5 Directional Couplers, -- 11.2.6 Impedance Matching, -- 11.2.7 Microwave Integrated Circuits, -- 11.2.8 Dielectric Resonators, -- References, -- Glossary -- Index -- Index397 -- 1558608168 -- Foreword -- Acknowledgements -- Introduction -- PART I THE MODEL -- 1 Foundations -- 1.1 A Core Concept -- 1.1.1 Life Is a Document -- 1.1.2 Scripture -- 1.1.3 Other Forms of Documents -- 1.2 Linear Concepts -- 1.2.1 Sequence -- 1.2.2 Hierarchy -- 1.3 Nonlinear Concepts -- 1.3.1 Bags -- 1.3.2 Annotations -- 1.3.3 Cross-References -- 1.4 Document-Centric vs.
Data-Centric Content -- 1.5 Document Schemata -- 1.5.1 A First Schema -- 1.5.2 Choice -- 1.5.3 Recursion -- 1.6 Grammars -- 1.6.1 Formal Grammars -- 1.6.2 Backus-Naur-Form (BNF) -- 1.6.3 Regular Sets and Regular Expressions -- 1.6.4 Trees, Hedges, and Forests -- 1.7 Regular Types -- 1.7.1 Types as Regular Expressions -- 1.7.2 Basic Composition -- 1.7.3 Basic Type Algebra -- 1.7.4 Subtypes -- 1.7.5 Generic Types -- 1.7.6 Deterministic Types -- 2 Conceptual Modeling -- 2.1 Motivation -- 2.2 Principles of Conceptual Modeling -- 2.3 Entity Relationship Diagrams -- 2.4 Reality of Conceptual Modeling -- 2.5 Introducing Asset Oriented Modeling -- 2.5.1 AOM Basics -- 2.5.2 Assets -- 2.5.3 Arcs and Clusters -- 2.5.4 Properties -- 2.5.5 Types -- 2.5.6 Inheritance -- 2.5.7 Constraints -- 2.5.8 Level 2 Structures -- 2.5.9 Models and Namespaces -- 2.5.10 Summary -- 3 Everybody Likes jazz -- 3.1 Informal Description -- 3.2 The Conceptual Model, First Draft -- 3.3 Asset or Property? -- 3.3.1 The Jazz Model -- 3.4 Normalization -- 3.5 Partitioned Normal Form -- 3.6 Resolving is a Relationships -- 3.7 Introducing Level 2 Structures -- PART II THE IMPLEMENTATION -- 4 XML Basics -- 4.1 Namespaces -- 4.2 The XML Information Model -- 4.2.1 Overview -- 4.2.2 Document Node -- 4.2.3 Elements -- 4.2.4 Attributes -- 4.2.5 Processing Instructions -- 4.2.6 Unexpanded Entity Reference -- 4.2.7 Character -- 4.2.8 Comment -- 4.2.9 Document Type Declaration -- 4.2.10 Unparsed Entity -- 4.2.11 Notation -- 4.2.12 Namespace -- 4.2.13 An Example -- 4.3 XML Canonical Form -- 4.3.1 Canonical Text -- 4.3.2 Canonical Whitespace -- 4.3.3 Resolved References -- 4.3.4 Removal of Redundant Nodes -- 4.3.5 Canonical Elements -- 4.3.6 Canonical Attributes -- 4.3.7 Canonical Processing Instructions -- 4.3.8 Canonical Comments -- 4.4 The Document Type Definition (DTD) -- 4.4.1 Document -- 4.4.2 Elements -- 4.4.3 Attributes -- 4.4.4 Cross-References -- 4.4.5 Extension Mechanisms -- 4.4.6 Document Composition -- 4.4.7 Schema Composition and Reuse Mechanisms -- 4.4.8 DTD Deficiencies -- 5 XML Schema -- 5.1 An Appetizer -- 5.2 Simple Data Types -- 5.2.1 Value Space -- 5.2.2 Lexical Representations and Canonical Representation -- 5.2.3 Fundamental Facets -- 5.2.4 Built-in Primitive Data Types -- 5.2.5 Constructed Types -- 5.2.6 Extending Data Types by List -- 5.2.7 Restricted Data Types -- 5.2.8 Built-in Constructed Data Types -- 5.2.9 The Hierarchy of Built-in Primitive and Constructed Data Types -- 5.2.10 Union Types -- 5.2.11 User-Defined Data Types -- 5.3 Structure in XML Schema -- 5.3.1 Hierarchy -- 5.3.2 Elements and Complex Types -- 5.3.3 Particles and Model Groups -- 5.3.4 Cardinality Constraints -- 5.3.5 Default Values and Fixed Values -- 5.3.6 Mixed Content -- 5.3.7 Simple Content -- 5.3.8 Complex Content -- 5.3.9 Type Hierarchies -- 5.3.10 Empty Elements -- 5.3.11 Attributes -- 5.3.12 Global and Local Types -- 5.3.13 Global Elements and Attributes -- 5.3.14 Recursive Structures -- 5.3.15 Wildcards -- 5.3.16 Nullability -- 5.3.17 Uniqueness, Keys, Reference -- 5.3.18 Deterministic Types -- 6 Authoring XML Schema -- 6.1 Namespaces -- 6.1.1 Target Namespace -- 6.1.2 Qualified and Unqualified Names -- 6.1.3 Wildcards -- 6.1.4 Schema Default Namespace -- 6.2 Reuse Mechanisms -- 6.2.1 Global Elements and Global Types -- 6.2.2 Groups -- 6.2.3 Attribute Groups -- 6.2.4 Instance Type Overriding -- 6.2.5 Substitution Groups -- 6.3 Schema Composition -- 6.3.1 The Schema Clause -- 6.3.2 Locating Schemata -- 6.3.3 Include -- 6.3.4 Redefine -- 6.3.5 Import -- 6.3.6 Notation -- 6.3.7 Annotations -- 6.4 Usage Patterns -- 6.4.1 Chameleon Components and Type Libraries -- 6.4.2 Defining Schema Families -- 7 Relax NG -- 7.1 Structure -- 7.1.1 The Relax NG Data Model -- 7.1.2 Elements and Attributes -- 7.1.3 Model Groups and Particles -- 7.1.4 Empty and not Allowed -- 7.1.5 Annotations -- 7.1.6 Default and Fixed Values -- 7.2 Types, Grammars, Patterns 226 -- 7.2.1 Data Types in Relax NG -- 7.2.2 Grammars and Named Patterns -- 7.2.3 External Patterns and Grammars -- 7.2.4 Keys and Key References -- 7.3 Namespaces and Name Classes -- 7.3.1 Namespaces -- 7.3.2 Name Classes and Wildcards -- 7.3.3 Comparison with DTDs -- 7.3.4 Comparison with XML Schema -- 7.3.5 Tool Support for Relax NG -- 8 From Conceptual Model to Schema -- 8.1 A Knowledge Base -- 8.1.1 Jazz Musicians -- 8.1.2 Styles -- 8.1.3 Collaborations -- 8.1.4 Albums -- 8.1.5 Reviews -- 8.1.6 Critics -- 8.2 Implementation in XML Schema -- 8.2.1 Design Options -- 8.2.2 Business Objects -- 8.2.3 Creating a Type Library -- 8.2.4 Handling Inheritance -- 8.2.5 The Complete Type Library -- 8.2.6 Implementing a Business Object -- 8.2.7 Dealing with Cross-References -- 8.2.8 Using Substitution Groups -- 8.2.9 Implementing Clusters -- 8.2.10 Business Objects critic and style -- 8.3 Implementation in Relax NG -- 8.3.1 Creating a Type Library -- 8.3.2 Handling Inheritance -- 8.3.3 The Complete Type Library -- 8.3.4 Implementing a Business Object -- 8.3.5 Dealing with Cross-References -- 8.3.6 Resolving Multiple Display Labels -- 8.3.7 Implementing Clusters -- 8.3.8 Business Objects critic and style -- 8.4 Summary -- 8.4.1 Synopsis of Implementation Steps -- 8.4.2 Remarks -- 9 Validation beyond XML Schema -- 9.1 About Meaning -- 9.2 Constraints -- 9.2.1 Constraints in XML Schema -- 9.2.2 Constraints beyond XML Schema -- 9.3 Constraints in Conceptual Models -- 9.4 Validation of General Constraints -- 9.4.1 Hard-Coded Constraint Checks -- 9.4.2 XSLT -- 9.4.3 Schematron -- 9.5 An XML Processing Model -- 9.6 A Framework for Schema Languages -- PART III THE ENVIRONMENT -- 10 Reality Check: The World Is Object-Oriented -- 10.1 Object-Oriented Implementations of the XML Data Model -- 10.2 Encapsulation and Behavior -- 10.3 Class, Instance, Type -- 10.3.1 Class Hierarchies -- 10.3.2 Type Hierarchies Based on Behavior -- 10.3.3 Type Hierarchies Based on Syntax -- 10.3.4 Object-Oriented Types vs. XML Types -- 10.4 Simple Types -- 10.4.1 String Data Types -- 10.4.2 Binary Data Types -- 10.4.3 The Boolean Data Type -- 10.4.4 Exact Numeric Types -- 10.4.5 Approximate Numeric Types -- 10.4.6 Date and Time -- 10.4.7 Other Data Types -- 10.4.8 Type Restrictions -- 10.4.9 Type Extensions -- 10.4.10 Null Values -- 10.4.11 Implementing a Type Hierarchy -- 10.5 Complex Types -- 10.5.1 Hierarchy -- 10.5.2 Sequence -- 10.5.3 Repetition -- 10.5.4 Choice -- 10.5.5 Recursion -- 10.5.6 Global and Local Elements -- 10.6 Global Types -- 10.7 Inheritance -- 10.8 Polymorphism -- 10.9 Dynamic Marshaling -- 10.10 Constraints -- 10.10.1 Simple Types -- 10.10.2 Cross-References -- 10.10.3 When to Check -- 10.10.4 Conceptual Constraints -- 10.10.5 Automatic Code Generation -- 10.11 Identity -- 10.12 Visibility -- 11 Reality Check: The World Is Relational -- 11.1 Motivation -- 11.2 Databases -- 11.3 The Relational Data Model -- 11.4 The Relational Algebra -- 11.5 Normalization -- 11.5.1 Defining the Target Format -- 11.5.2 The Original Schema -- 11.5.3 Steamrolling the Schema -- 11.5.4 Introducing Key Relationships -- 11.5.5 Preserving Sequential Order -- 11.5.6 Recomposing Original Document Nodes -- 11.6 Brief Introduction to SQL -- 11.6.1 Queries -- 11.6.2 Table Creation -- 11.6.3 Table Modification -- 11.6.4 Views -- 11.6.5 SQL-99 -- 11.7 Simple Data Types -- 11.7.1 String Data Types -- 11.7.2 Binary Data Types -- 11.7.3 The Boolean Data Type -- 11.7.4 Exact Numeric Types -- 11.7.5 Approximate Numeric Types -- 11.7.6 Date and Time -- 11.7.7 Other Data Types -- 11.7.8 Type Restrictions -- 11.7.9 Type Extensions -- 11.7.10 Null Values -- 11.8 Complex Types -- 11.8.1 Hierarchy -- 11.8.2 Sequence -- 11.8.3 Choice -- 11.8.4 Recursion -- 11.9 Constraints -- 11.10 From Relational Tables to XML Schema -- 11.11 Mediation between RDBMS and XML Databases -- 11.11.1 Tamino X-Node -- 11.11.2 Experanto -- 12 Schema Evolution -- 12.1 Derived Types -- 12.1.1 Schema-Conservative Evolution -- 12.1.2 Using Chameleon Components -- 12.1.3 Creating Derived Schemata -- 12.1.4 Dialecting with Substitution Groups -- 12.1.5 Inhibiting Change -- 12.2 Authoring for Redefinition -- 12.2.1 Adding an Attribute to a Simple Type Element -- 12.2.2 Appending Child Nodes to Nested Structures -- 12.2.3 Inserting Elements at an Arbitrary Position -- 12.2.4 Allowing Choices -- 12.2.5 Conservative Schema Modification -- 12.3 Open Content Model -- 12.4 Versioning -- 13 Schemata in Large Environments -- 13.1 Combining Diverse Schemata -- 13.1.1 The Problem -- 13.1.2 Model Fusion -- 13.1.3 Combining Document Instance Sets -- 13.1.4 Schema-Driven View Definition -- 13.1.5 Embedded Queries -- 13.1.6 Model-Driven Schema Mediation -- 13.2 Centralized and Decentralized Change Management -- 13.2.1 Decentralized Change Management of Document Instances -- 13.2.2 Decentralized Change Management of Document Schemata -- 14 Outlook -- 14.1 Integration of Core Technologies -- 14.2 Grammar-Driven Data Models -- 14.2.1 XML as a Mainstream Technology -- Appendix -- Glossary -- Bibliography -- Index -- About the Author. |
| Record Nr. | UNINA-9910830324803321 |
|
Gupta Tapan K
|
||
| [Place of publication not identified], : Wiley Interscience Imprint, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Handbook of Thick- and Thin-Film Hybrid Microelectronics
| Handbook of Thick- and Thin-Film Hybrid Microelectronics |
| Autore | Gupta Tapan K |
| Pubbl/distr/stampa | [Place of publication not identified], : Wiley Interscience Imprint, 2003 |
| Descrizione fisica | 1 online resource (419 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Hybrid integrated circuits
Thick-film circuits Thin-film circuits |
| ISBN |
1-280-55712-5
9786610557127 0-470-30791-9 0-471-72366-5 0-471-72367-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Preface -- 1 Introduction -- 1.1 Hybrid Microcircuit Family, -- 1.1.1 Printed Circuit Board, -- 1.1.2 Thick Film, -- 1.1.3 Thin Film, -- 1.1.4 Integrated Circuit, -- 1.1.5 Modules, -- 1.2 Need for Hybrid Microcircuits, -- 1.2.1 Multilayer Circuits, -- 1.2.2 Military Applications, -- 1.2.3 Data Processing, -- 1.2.4 Telecommunications, -- 1.2.5 Automotive Industry, -- 1.2.6 Medical Science, -- 1.2.7 Aerospace Systems, -- 1.2.8 High-Frequency Circuits, -- 1.3 Why Hybrid Microcircuits? -- 1.4 Applications of Hybrid Microcircuits, -- 1.4.1 Automotive Industry, -- 1.4.2 Commercial Products, -- 1.4.3 Medical Science, -- 1.4.4 Telecommunications, -- 1.4.5 Consumer Electronics, -- 1.4.6 Military Applications, -- 1.5 Typical Microelectronic Products, -- 1.5.1 Consumer Electronics, -- 1.5.2 Industrial Applications, -- 1.5.3 Military and Aerospace Applications, -- 1.5.4 Automotive Industry, -- 1.5.5 Microwave Engineering, -- 1.5.6 Multichip Modules, -- 1.6 Summary, -- References, -- Recommended Reading, -- 2 Mathematical Foundations, Circuit Design, and Layout Rules for Hybrid Microcircuits -- 2.1 Mathematical Foundations, -- 2.1.1 Factors Affecting the Value of a Resistor, -- 2.1.2 Mathematical Model for Thick-Film Deposition, -- 2.1.3 Theoretical Model for Screen-Printed Film Thickness, -- 2.1.4 Thick-Film Resistor Design, -- 2.1.5 Theoretical Model for Thin-Film Thickness, -- 2.1.6 Dissipation Factor or Dielectric Loss within a Dielectric Material, -- 2.1.7 Inductors, -- 2.1.8 Theoretical Model for Transport Properties during Hermetic Sealing, -- 2.2 Circuit Design and Layout Rules, -- 2.2.1 Hybrid Circuit Design Elements, -- 2.2.2 Thick-Film Hybrid Circuit Design, -- 2.2.3 Basic Rules for Laying Out Hybrid Microcircuits, -- References, -- Recommended Reading, -- 3 Computer-Aided Design and Pattern Generation Techniques -- 3.1 Computer-Aided Design Techniques, -- 3.1.1 S ze and Complexity of Hybrid Microcircuits, -- 3.1.2 CALMA Online Design Process, -- 3.1.3 Computer-Aided Engineering to Design Hybrid Microcircuits, -- 3.1.4 Circuit Layout Design, -- 3.2 Pattern Generation Techniques, -- 3.2.1 Additive Processes, -- 3.2.2 Subtractive Processes, -- 3.2.3 Photolithography, -- References, -- Recommended Reading, -- 4 Thick-Film Fundamentals -- 4.1 Thick-Film Substrates, -- 4.1.1 Substrate Materials, -- 4.1.2 Physical Properties, -- 4.1.3 Substrate Fabrication, -- 4.1.4 Electrical Properties, -- 4.1.5 Multilayer Technology Using LTCC, -- 4.2 Thick-Film Conductors, -- 4.2.1 Conduction in Metals, -- 4.2.2 Conductor Materials, -- 4.2.3 Conductor Pastes, -- 4.3 Thick-Film Resistors, -- 4.3.1 Physical Properties, -- 4.3.2 Resistor Characteristics, -- 4.4 Dielectric Inks and Pastes, -- 4.4.1 Low-K Dielectric Materials, -- 4.4.2 High-K Dielectric Materials, -- 4.5 Thick-Film Inductors, -- References, -- Recommended Reading, -- 5 Thick-Film Deposition Techniques -- 5.1 Thick-Film Processing, -- 5.2 Screen Printing, -- 5.2.1 Screen Printer, -- 5.2.2 Drying and Firing, -- References, -- Recommended Reading, -- 6 Thin-Film Fundamentals -- 180 -- 6.1 Thin-Film Substrates, -- 6.1.1 Substrate Materials, -- 6.2 Physical Characteristics, -- 6.2.1 Characteristics of Substrates, -- 6.2.2 Characteristics of Metals, -- 6.3 Thin-Film Conductors, -- 6.3.1 Conductor Materials and Properties, -- 6.4 Thin-Film Resistors, -- 6.4.1 Resistor Properties, -- 6.4.2 Resistor Materials, -- 6.5 Thin-Film Capacitors, -- 6.5.1 Capacitor Properties, -- 6.5.2 Capacitor Materials, -- 6.6 Thin-Film Inductors, -- 6.7 Technologies of the Twenty-First Century, -- References, -- Recommended Reading, -- 219 -- 7 Thin-Film Deposition Techniques -- 7.1 Physical Vapor Deposition, -- 7.1.1 Turbo Pump, -- 7.1.2 Cryogenic Pump, -- 7.2 Flash Evaporation, -- 7.3 Sputter ng, -- 7.4 Chemical Vapor Deposition, -- 7.5 Ion-Beam Deposition, -- 7.5.1 Ion-Beam Sputter Deposition, -- 7.5.2 Ion-Beam-Assisted Deposition, -- 7.6 Pulsed-Laser Deposition (Laser Ablation), -- 7.7 High-Density Plasma-Assisted Deposition, -- 7.8 Electroplating, -- 7.8.1 Electrode Electroplating, -- 7.8.2 Electroless Electroplating, -- 7.9 Sol-Gel Coating, -- 7.10 Atomic Layer Deposition, -- 7.11 Summary, -- References, -- Recommended Reading, -- 8 Component Assembly and Interconnections -- 8.1 Component Assembly, -- 8.1.1 S licon-Gold Eutectic Bonding, -- 8.1.2 Adhesive and Epoxy Bonding, -- 8.1.3 Solder Joint Bonding, -- 8.1.4 Solder Alloys, -- 8.1.5 Solder Reflow System, -- 8.1.6 Lead-Free Interconnects, -- 8.2 Interconnections, -- 8.2.1 Thermocompression Wire Bonding, -- 8.2.2 Thermosonic Wire Bonding, -- 8.2.3 Ultrasonic Wire Bonding, -- 8.2.4 Automated Single-Point Tape Automated Bonding, -- 8.2.5 Laser Wire Bonding, -- 8.2.6 Flip-Chip Bonding, -- References, -- Recommended Reading, -- 9 Adjustment of Passive Components -- 9.l Airbrasive Trimming, -- 9.2 Laser Trimming, -- 9.2.1 Carbon Dioxide Laser, -- 9.2.2 Yttrium-Aluminum-Garnet Laser, -- 9.3 Laser Trimming Systems, -- 9.3.1 Trimming Procedure, -- 9.3.2 Design Criteria for Resistor Trimming, -- 9.4 Definitions, -- References, -- Recommended Reading, -- 10 Packaging and Thermal Considerations -- 10.1 Packaging Materials, -- 10.2 Packaging Systems, -- 10.2.1 TO Packages, -- 10.2.2 Flat-Case Packages, -- 10.2.3 Chip Carriers, -- 10.2.4 Small-Outline Packages, -- 10.2.5 Systems on a Chip, -- 10.2.6 Chip-Scale Packages, -- 10.2.7 Wafer-Level Packaging, -- 10.2.8 Three-Dimensional Packaging, -- 10.3 Package Sealing, -- 10.4 Thermal Effects on Electronic Packaging, -- 10.4.1 Power Dissipation, -- 10.4.2 Thermal Design Calculations, -- 10.5 Non-Steady-State Heat Transfer Model, -- 10.5.1 Thermal Resistance inside the Substrate, -- 10.5.2 Natural Convection, -- 10.5.3 Thermal Radiation, -- 10.5.4 Thermal Resistance of Nitrogen Gas, -- 10.5.5 Heat Conduction inside the Kovar Shell, -- 10.6 Flip-Chip Technology, -- 10.7 Packaging Material Reliability, -- References, -- Recommended Reading, -- 11 Multichip Module and Microwave Hybrid Circuits -- 331 -- 11.1 Multichip Module Circuits, -- 11.1.1 Conductor Materials, -- 11.1.2 Summary, -- 11.2 Microwave Hybrid Circuits, -- 344 -- 11.2.1 Major Circuit Requirements, -- 11.2.2 Waveguides, -- 11.2.3 Transmission Lines, -- 11.2.4 Lumped Circuit Elements, -- 11.2.5 Directional Couplers, -- 11.2.6 Impedance Matching, -- 11.2.7 Microwave Integrated Circuits, -- 11.2.8 Dielectric Resonators, -- References, -- Glossary -- Index -- Index397 -- 1558608168 -- Foreword -- Acknowledgements -- Introduction -- PART I THE MODEL -- 1 Foundations -- 1.1 A Core Concept -- 1.1.1 Life Is a Document -- 1.1.2 Scripture -- 1.1.3 Other Forms of Documents -- 1.2 Linear Concepts -- 1.2.1 Sequence -- 1.2.2 Hierarchy -- 1.3 Nonlinear Concepts -- 1.3.1 Bags -- 1.3.2 Annotations -- 1.3.3 Cross-References -- 1.4 Document-Centric vs.
Data-Centric Content -- 1.5 Document Schemata -- 1.5.1 A First Schema -- 1.5.2 Choice -- 1.5.3 Recursion -- 1.6 Grammars -- 1.6.1 Formal Grammars -- 1.6.2 Backus-Naur-Form (BNF) -- 1.6.3 Regular Sets and Regular Expressions -- 1.6.4 Trees, Hedges, and Forests -- 1.7 Regular Types -- 1.7.1 Types as Regular Expressions -- 1.7.2 Basic Composition -- 1.7.3 Basic Type Algebra -- 1.7.4 Subtypes -- 1.7.5 Generic Types -- 1.7.6 Deterministic Types -- 2 Conceptual Modeling -- 2.1 Motivation -- 2.2 Principles of Conceptual Modeling -- 2.3 Entity Relationship Diagrams -- 2.4 Reality of Conceptual Modeling -- 2.5 Introducing Asset Oriented Modeling -- 2.5.1 AOM Basics -- 2.5.2 Assets -- 2.5.3 Arcs and Clusters -- 2.5.4 Properties -- 2.5.5 Types -- 2.5.6 Inheritance -- 2.5.7 Constraints -- 2.5.8 Level 2 Structures -- 2.5.9 Models and Namespaces -- 2.5.10 Summary -- 3 Everybody Likes jazz -- 3.1 Informal Description -- 3.2 The Conceptual Model, First Draft -- 3.3 Asset or Property? -- 3.3.1 The Jazz Model -- 3.4 Normalization -- 3.5 Partitioned Normal Form -- 3.6 Resolving is a Relationships -- 3.7 Introducing Level 2 Structures -- PART II THE IMPLEMENTATION -- 4 XML Basics -- 4.1 Namespaces -- 4.2 The XML Information Model -- 4.2.1 Overview -- 4.2.2 Document Node -- 4.2.3 Elements -- 4.2.4 Attributes -- 4.2.5 Processing Instructions -- 4.2.6 Unexpanded Entity Reference -- 4.2.7 Character -- 4.2.8 Comment -- 4.2.9 Document Type Declaration -- 4.2.10 Unparsed Entity -- 4.2.11 Notation -- 4.2.12 Namespace -- 4.2.13 An Example -- 4.3 XML Canonical Form -- 4.3.1 Canonical Text -- 4.3.2 Canonical Whitespace -- 4.3.3 Resolved References -- 4.3.4 Removal of Redundant Nodes -- 4.3.5 Canonical Elements -- 4.3.6 Canonical Attributes -- 4.3.7 Canonical Processing Instructions -- 4.3.8 Canonical Comments -- 4.4 The Document Type Definition (DTD) -- 4.4.1 Document -- 4.4.2 Elements -- 4.4.3 Attributes -- 4.4.4 Cross-References -- 4.4.5 Extension Mechanisms -- 4.4.6 Document Composition -- 4.4.7 Schema Composition and Reuse Mechanisms -- 4.4.8 DTD Deficiencies -- 5 XML Schema -- 5.1 An Appetizer -- 5.2 Simple Data Types -- 5.2.1 Value Space -- 5.2.2 Lexical Representations and Canonical Representation -- 5.2.3 Fundamental Facets -- 5.2.4 Built-in Primitive Data Types -- 5.2.5 Constructed Types -- 5.2.6 Extending Data Types by List -- 5.2.7 Restricted Data Types -- 5.2.8 Built-in Constructed Data Types -- 5.2.9 The Hierarchy of Built-in Primitive and Constructed Data Types -- 5.2.10 Union Types -- 5.2.11 User-Defined Data Types -- 5.3 Structure in XML Schema -- 5.3.1 Hierarchy -- 5.3.2 Elements and Complex Types -- 5.3.3 Particles and Model Groups -- 5.3.4 Cardinality Constraints -- 5.3.5 Default Values and Fixed Values -- 5.3.6 Mixed Content -- 5.3.7 Simple Content -- 5.3.8 Complex Content -- 5.3.9 Type Hierarchies -- 5.3.10 Empty Elements -- 5.3.11 Attributes -- 5.3.12 Global and Local Types -- 5.3.13 Global Elements and Attributes -- 5.3.14 Recursive Structures -- 5.3.15 Wildcards -- 5.3.16 Nullability -- 5.3.17 Uniqueness, Keys, Reference -- 5.3.18 Deterministic Types -- 6 Authoring XML Schema -- 6.1 Namespaces -- 6.1.1 Target Namespace -- 6.1.2 Qualified and Unqualified Names -- 6.1.3 Wildcards -- 6.1.4 Schema Default Namespace -- 6.2 Reuse Mechanisms -- 6.2.1 Global Elements and Global Types -- 6.2.2 Groups -- 6.2.3 Attribute Groups -- 6.2.4 Instance Type Overriding -- 6.2.5 Substitution Groups -- 6.3 Schema Composition -- 6.3.1 The Schema Clause -- 6.3.2 Locating Schemata -- 6.3.3 Include -- 6.3.4 Redefine -- 6.3.5 Import -- 6.3.6 Notation -- 6.3.7 Annotations -- 6.4 Usage Patterns -- 6.4.1 Chameleon Components and Type Libraries -- 6.4.2 Defining Schema Families -- 7 Relax NG -- 7.1 Structure -- 7.1.1 The Relax NG Data Model -- 7.1.2 Elements and Attributes -- 7.1.3 Model Groups and Particles -- 7.1.4 Empty and not Allowed -- 7.1.5 Annotations -- 7.1.6 Default and Fixed Values -- 7.2 Types, Grammars, Patterns 226 -- 7.2.1 Data Types in Relax NG -- 7.2.2 Grammars and Named Patterns -- 7.2.3 External Patterns and Grammars -- 7.2.4 Keys and Key References -- 7.3 Namespaces and Name Classes -- 7.3.1 Namespaces -- 7.3.2 Name Classes and Wildcards -- 7.3.3 Comparison with DTDs -- 7.3.4 Comparison with XML Schema -- 7.3.5 Tool Support for Relax NG -- 8 From Conceptual Model to Schema -- 8.1 A Knowledge Base -- 8.1.1 Jazz Musicians -- 8.1.2 Styles -- 8.1.3 Collaborations -- 8.1.4 Albums -- 8.1.5 Reviews -- 8.1.6 Critics -- 8.2 Implementation in XML Schema -- 8.2.1 Design Options -- 8.2.2 Business Objects -- 8.2.3 Creating a Type Library -- 8.2.4 Handling Inheritance -- 8.2.5 The Complete Type Library -- 8.2.6 Implementing a Business Object -- 8.2.7 Dealing with Cross-References -- 8.2.8 Using Substitution Groups -- 8.2.9 Implementing Clusters -- 8.2.10 Business Objects critic and style -- 8.3 Implementation in Relax NG -- 8.3.1 Creating a Type Library -- 8.3.2 Handling Inheritance -- 8.3.3 The Complete Type Library -- 8.3.4 Implementing a Business Object -- 8.3.5 Dealing with Cross-References -- 8.3.6 Resolving Multiple Display Labels -- 8.3.7 Implementing Clusters -- 8.3.8 Business Objects critic and style -- 8.4 Summary -- 8.4.1 Synopsis of Implementation Steps -- 8.4.2 Remarks -- 9 Validation beyond XML Schema -- 9.1 About Meaning -- 9.2 Constraints -- 9.2.1 Constraints in XML Schema -- 9.2.2 Constraints beyond XML Schema -- 9.3 Constraints in Conceptual Models -- 9.4 Validation of General Constraints -- 9.4.1 Hard-Coded Constraint Checks -- 9.4.2 XSLT -- 9.4.3 Schematron -- 9.5 An XML Processing Model -- 9.6 A Framework for Schema Languages -- PART III THE ENVIRONMENT -- 10 Reality Check: The World Is Object-Oriented -- 10.1 Object-Oriented Implementations of the XML Data Model -- 10.2 Encapsulation and Behavior -- 10.3 Class, Instance, Type -- 10.3.1 Class Hierarchies -- 10.3.2 Type Hierarchies Based on Behavior -- 10.3.3 Type Hierarchies Based on Syntax -- 10.3.4 Object-Oriented Types vs. XML Types -- 10.4 Simple Types -- 10.4.1 String Data Types -- 10.4.2 Binary Data Types -- 10.4.3 The Boolean Data Type -- 10.4.4 Exact Numeric Types -- 10.4.5 Approximate Numeric Types -- 10.4.6 Date and Time -- 10.4.7 Other Data Types -- 10.4.8 Type Restrictions -- 10.4.9 Type Extensions -- 10.4.10 Null Values -- 10.4.11 Implementing a Type Hierarchy -- 10.5 Complex Types -- 10.5.1 Hierarchy -- 10.5.2 Sequence -- 10.5.3 Repetition -- 10.5.4 Choice -- 10.5.5 Recursion -- 10.5.6 Global and Local Elements -- 10.6 Global Types -- 10.7 Inheritance -- 10.8 Polymorphism -- 10.9 Dynamic Marshaling -- 10.10 Constraints -- 10.10.1 Simple Types -- 10.10.2 Cross-References -- 10.10.3 When to Check -- 10.10.4 Conceptual Constraints -- 10.10.5 Automatic Code Generation -- 10.11 Identity -- 10.12 Visibility -- 11 Reality Check: The World Is Relational -- 11.1 Motivation -- 11.2 Databases -- 11.3 The Relational Data Model -- 11.4 The Relational Algebra -- 11.5 Normalization -- 11.5.1 Defining the Target Format -- 11.5.2 The Original Schema -- 11.5.3 Steamrolling the Schema -- 11.5.4 Introducing Key Relationships -- 11.5.5 Preserving Sequential Order -- 11.5.6 Recomposing Original Document Nodes -- 11.6 Brief Introduction to SQL -- 11.6.1 Queries -- 11.6.2 Table Creation -- 11.6.3 Table Modification -- 11.6.4 Views -- 11.6.5 SQL-99 -- 11.7 Simple Data Types -- 11.7.1 String Data Types -- 11.7.2 Binary Data Types -- 11.7.3 The Boolean Data Type -- 11.7.4 Exact Numeric Types -- 11.7.5 Approximate Numeric Types -- 11.7.6 Date and Time -- 11.7.7 Other Data Types -- 11.7.8 Type Restrictions -- 11.7.9 Type Extensions -- 11.7.10 Null Values -- 11.8 Complex Types -- 11.8.1 Hierarchy -- 11.8.2 Sequence -- 11.8.3 Choice -- 11.8.4 Recursion -- 11.9 Constraints -- 11.10 From Relational Tables to XML Schema -- 11.11 Mediation between RDBMS and XML Databases -- 11.11.1 Tamino X-Node -- 11.11.2 Experanto -- 12 Schema Evolution -- 12.1 Derived Types -- 12.1.1 Schema-Conservative Evolution -- 12.1.2 Using Chameleon Components -- 12.1.3 Creating Derived Schemata -- 12.1.4 Dialecting with Substitution Groups -- 12.1.5 Inhibiting Change -- 12.2 Authoring for Redefinition -- 12.2.1 Adding an Attribute to a Simple Type Element -- 12.2.2 Appending Child Nodes to Nested Structures -- 12.2.3 Inserting Elements at an Arbitrary Position -- 12.2.4 Allowing Choices -- 12.2.5 Conservative Schema Modification -- 12.3 Open Content Model -- 12.4 Versioning -- 13 Schemata in Large Environments -- 13.1 Combining Diverse Schemata -- 13.1.1 The Problem -- 13.1.2 Model Fusion -- 13.1.3 Combining Document Instance Sets -- 13.1.4 Schema-Driven View Definition -- 13.1.5 Embedded Queries -- 13.1.6 Model-Driven Schema Mediation -- 13.2 Centralized and Decentralized Change Management -- 13.2.1 Decentralized Change Management of Document Instances -- 13.2.2 Decentralized Change Management of Document Schemata -- 14 Outlook -- 14.1 Integration of Core Technologies -- 14.2 Grammar-Driven Data Models -- 14.2.1 XML as a Mainstream Technology -- Appendix -- Glossary -- Bibliography -- Index -- About the Author. |
| Record Nr. | UNINA-9910840863503321 |
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Gupta Tapan K
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| [Place of publication not identified], : Wiley Interscience Imprint, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Radiation, Ionization, and Detection in Nuclear Medicine [[electronic resource] /] / by Tapan K. Gupta
| Radiation, Ionization, and Detection in Nuclear Medicine [[electronic resource] /] / by Tapan K. Gupta |
| Autore | Gupta Tapan K |
| Edizione | [1st ed. 2013.] |
| Pubbl/distr/stampa | Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2013 |
| Descrizione fisica | 1 online resource (528 p.) |
| Disciplina |
610
610.153 616.07548 616.07575 |
| Soggetto topico |
Nuclear medicine
Medical physics Radiation Nuclear Medicine Medical and Radiation Physics |
| ISBN | 3-642-34076-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Radiation, Ionization, and Detection in Nuclear Medicine ""; ""Copyright""; ""Dedication""; ""Preface""; ""Acknowledgments""; ""Contents""; ""1: Nuclear Radiation, Ionization, and Radioactivity""; ""1.1 Introduction""; ""1.2 Ionizing Radiation and Consequences""; ""1.3 Visual Demonstration of Radiation""; ""1.4 Definition""; ""1.4.1 Roentgen""; ""1.4.2 Fluence""; ""1.4.3 Quality Factor""; ""1.4.4 Radiation Dose""; ""1.4.5 Rem""; ""1.4.6 Energy""; ""1.4.7 Relationship Between Kerma, Exposure, and Absorbed Dose""; ""1.4.8 Radioactivity""; ""1.4.9 Radioactive Decay""; ""1.4.10 Positron""
""1.5 Sources of Nuclear Radiation""""1.5.1 Alpha (α) Particle""; ""1.5.2 Beta (beta) Particles""; ""1.5.3 Gamma (gamma) Rays""; ""1.6 Attenuation Coefficient of gamma-Rays""; ""1.7 Half-Value Layer""; ""1.8 Neutrons""; ""1.9 Neutron Scattering""; ""1.9.1 Elastic Scattering""; ""1.9.2 Energy Distribution of Elastically Scattered Neutrons""; ""1.9.3 Inelastic Scattering""; ""1.10 The Cross-Section Concept""; ""1.11 Thermal Neutrons""; ""1.12 Neutron Sources""; ""1.13 Neutron Shielding""; ""1.14 X-Rays""; ""1.14.1 Production and Properties of X-Ray""; ""1.14.2 Beam Quality"" ""1.15 Interactions of X-Rays""""1.16 Photoelectric Effect""; ""1.17 Pair Production""; ""1.18 Use of Natural Forces for the Material Improvement of Mankind""; ""1.19 Radionuclides""; ""1.20 Production of Radionuclides""; ""1.20.1 Cyclotron""; ""1.20.2 Reactor""; ""1.21 Developments and Uses of Radionuclides""; ""1.22 Summary""; ""References""; ""2: Radiation Exposure: Consequences, Detection, and Measurements""; ""2.1 Introduction""; ""2.2 Sources of Radiation Exposure""; ""2.2.1 Natural Sources""; ""2.3 Biological and Related Effects of Radiation"" ""2.4 Effects of Radiation on Consumable Products""""2.5 Effects of Radiation""; ""2.5.1 Plants and Vegetations""; ""2.5.2 Electronics and Associated Active and Passive Elements""; ""2.6 Detection of Radiation""; ""2.6.1 Detection of Alpha (α) and Beta (beta) Particles""; ""2.6.2 Detection of Gamma Ray""; ""2.6.3 Detection of X-Ray""; ""2.7 Neutron Detection""; ""2.7.1 Thermal Neutrons""; ""2.7.2 Slow Neutrons""; ""2.8 Boron Reaction""; ""2.9 Lithium Reaction""; ""2.10 Instrumentation""; ""2.10.1 Ion Chamber""; ""2.10.2 Free-Air Ionization Chamber""; ""2.10.3 Proportional Counter (PC)"" ""2.10.4 Position-Sensitive Proportional Counter""""2.10.5 Parallel-Plate Avalanche Counter""; ""2.10.6 Geiger-Muller (GM) Counter""; ""2.11 Photomultiplier""; ""2.11.1 Tube""; ""2.11.2 Solid-State Photomultiplier (SSPM)""; ""2.12 Modes of Detector Operation""; ""2.12.1 Current Mode""; ""2.12.2 Mean-Square Voltage Mode (MSV)""; ""2.12.3 Pulse Mode""; ""2.13 Recording and Measurement Techniques""; ""2.13.1 Spectroscopy and Spectrometry""; ""2.13.2 Gamma-Ray Spectroscopy""; ""2.13.3 Neutron Spectroscopy""; ""2.13.4 X-Ray Spectroscopy""; ""2.13.5 Characteristic Parameters of the Spectrum"" ""2.13.5.1 Energy Resolution"" |
| Record Nr. | UNINA-9910437989203321 |
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Gupta Tapan K
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| Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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