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2013 IEEE 77th Vehicular Technology Conference (VTC Spring) : Proceedings : Dresden, Germany 2-5 June 2013 / / Gerhard Fettweis, general chair
| 2013 IEEE 77th Vehicular Technology Conference (VTC Spring) : Proceedings : Dresden, Germany 2-5 June 2013 / / Gerhard Fettweis, general chair |
| Pubbl/distr/stampa | Piscataway, NJ, : , : IEEE, , 2013 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 388.312 |
| Soggetto topico |
Electronics in transportation
Artificial satellites in telecommunication Mobile communication systems |
| ISBN | 1-4673-6337-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
2013 IEEE 77th Vehicular Technology Conference
Vehicular Technology Conference |
| Record Nr. | UNISA-996280033703316 |
| Piscataway, NJ, : , : IEEE, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2013 IEEE 77th Vehicular Technology Conference (VTC Spring) : Proceedings : Dresden, Germany 2-5 June 2013 / / Gerhard Fettweis, general chair
| 2013 IEEE 77th Vehicular Technology Conference (VTC Spring) : Proceedings : Dresden, Germany 2-5 June 2013 / / Gerhard Fettweis, general chair |
| Pubbl/distr/stampa | Piscataway, NJ, : , : IEEE, , 2013 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 388.312 |
| Soggetto topico |
Electronics in transportation
Artificial satellites in telecommunication Mobile communication systems |
| ISBN | 1-4673-6337-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
2013 IEEE 77th Vehicular Technology Conference
Vehicular Technology Conference |
| Record Nr. | UNINA-9910132352703321 |
| Piscataway, NJ, : , : IEEE, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
| 3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Electronic circuits
Microprocessors Circuits and Systems Electronic Circuits and Devices Processor Architectures |
| ISBN | 3-319-20481-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to Electrical 3D Integration -- Copper-based TSV – Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-. |
| Record Nr. | UNINA-9910254242703321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||