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3D Stacked Chips [[electronic resource] ] : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
| 3D Stacked Chips [[electronic resource] ] : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Electronic circuits
Microprocessors Circuits and Systems Electronic Circuits and Devices Processor Architectures |
| ISBN | 3-319-20481-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to Electrical 3D Integration -- Copper-based TSV – Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-. |
| Record Nr. | UNINA-9910254242703321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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The IoT Physical Layer [[electronic resource] ] : Design and Implementation / / edited by Ibrahim (Abe) M. Elfadel, Mohammed Ismail
| The IoT Physical Layer [[electronic resource] ] : Design and Implementation / / edited by Ibrahim (Abe) M. Elfadel, Mohammed Ismail |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (395 pages) |
| Disciplina | 004.678 |
| Soggetto topico |
Electronic circuits
Signal processing Image processing Speech processing systems Electronics Microelectronics Circuits and Systems Signal, Image and Speech Processing Electronics and Microelectronics, Instrumentation |
| ISBN | 3-319-93100-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Part 1. Advanced Materials and Sensors -- Reduced Graphene Oxide for the Design of Electrocardiogram Sensors: Current Status and Perspectives -- A Preliminary Evaluation of Continuous, Shoe-IntegratedWeight Measurements for Heart Failure Patients -- ALD Al-doped ZnO Thin Film as Semiconductor and Piezoelectric Material: Process Synthesis -- ALD Al-doped ZnO Thin Film as Semiconductor and Piezoelectric Material: Characterization -- ALD Al doped ZnO Thin Film as Semiconductor and Piezoelectric Material: Transistors and Sensors -- Lab-on-Chip Silicon Photonics Sensor -- Part 2. Architectures and Circuits -- Design Challenges in Wireless Sensors for Dental Applications -- Energy-Efficient Body Area Network Transceiver Using Body Coupled Communication -- Ultra-low power ECG Processor for IoT SOCs -- Time-delay Array Beamforming for Millimeter Wave IoT Systems -- Part 3. Algorithms and Protocols -- Nature-Inspired Optimization in the Era of IoT: Particle Swarm Optimization (PSO) Applied to Indoor Distributed Antenna Systems (I-DAS) -- Low-power, Dynamic-data-rate Protocol for IoT Communication -- Efficient Algorithm for VT/VF Prediction for IoT SoCs -- MSER-in-chip: An Efficient Vision Tool for IoT Devices -- Part 4. Power Management -- A Low Power, High Resolution ZCS Control for Inductor-based Converters -- Power Management Unit for IoT -- Macromodeling of Microbatteries for IoT Micro-power Source Integration -- Part 5. Systems and Security -- Self-Powered SoC Platform forWearable Health Care -- Toward An Integrated, Low-power Platform for Continuous Congestive Heart-failure Monitoring -- Hardware Security and Trust: Logic Locking as a Design-for-Trust Solution. |
| Record Nr. | UNINA-9910337646403321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Machine Learning in VLSI Computer-Aided Design [[electronic resource] /] / edited by Ibrahim (Abe) M. Elfadel, Duane S. Boning, Xin Li
| Machine Learning in VLSI Computer-Aided Design [[electronic resource] /] / edited by Ibrahim (Abe) M. Elfadel, Duane S. Boning, Xin Li |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (697 pages) |
| Disciplina | 621.395 |
| Soggetto topico |
Electronic circuits
Microprocessors Logic design Circuits and Systems Processor Architectures Logic Design |
| ISBN | 3-030-04666-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter1: A Preliminary Taxonomy for Machine Learning in VLSI CAD -- Chapter2: Machine Learning for Compact Lithographic Process Models -- Chapter3: Machine Learning for Mask Synthesis -- Chapter4: Machine Learning in Physical Verification, Mask Synthesis, and Physical Design -- Chapter5: Gaussian Process-Based Wafer-Level Correlation Modeling and its Applications -- Chapter6: Machine Learning Approaches for IC Manufacturing Yield Enhancement -- Chapter7: Efficient Process Variation Characterization by Virtual Probe -- Chapter8: Machine learning for VLSI chip testing and semiconductor manufacturing process monitoring and improvement -- Chapter9: Machine Learning based Aging Analysis -- Chapter10: Extreme Statistics in Memories -- Chapter11: Fast Statistical Analysis Using Machine Learning -- Chapter12: Fast Statistical Analysis of Rare Circuit Failure Events -- Chapter13: Learning from Limited Data in VLSI CAD -- Chapter14: Large-Scale Circuit Performance Modeling by Bayesian Model Fusion -- Chapter15: Sparse Relevance Kernel Machine Based Performance Dependency Analysis of Analog and Mixed-Signal Circuits -- Chapter16: SiLVR: Projection Pursuit for Response Surface Modeling -- Chapter17: Machine Learning based System Optimization and Uncertainty Quantification of Integrated Systems -- Chapter18: SynTunSys: A Synthesis Parameter Autotuning System for Optimizing High-Performance Processors -- Chapter19: Multicore Power and Thermal Proxies Using Least-Angle -- Chapter20: A Comparative Study of Assertion Mining Algorithms in GoldMine -- Chapter21: Energy-Efficient Design of Advanced Machine Learning Hardware. |
| Record Nr. | UNINA-9910337639903321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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MEMS Accelerometers
| MEMS Accelerometers |
| Autore | Ngo Ha Duong |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2019 |
| Descrizione fisica | 1 electronic resource (252 p.) |
| Soggetto non controllato |
micromachining
turbulent kinetic energy dissipation rate microelectromechanical systems (MEMS) piezoresistive sensor chip WiFi-RSSI radio map step detection built-in self-test regularity of activity motion analysis gait analysis frequency acceleration MEMS accelerometer zero-velocity update rehabilitation assessment vacuum microelectronic dance classification Kerr noise MEMS micro machining MEMS sensors stereo visual-inertial odometry self-coaching miniaturization wavelet packet three-axis acceleration sensor MEMS-IMU accelerometer performance characterization electrostatic stiffness delaying mechanism three-axis accelerometer angular-rate sensing indoor positioning whispering-gallery-mode sensitivity heat convection multi-axis sensing L-shaped beam stride length estimation activity monitoring process optimization mismatch of parasitic capacitance electromechanical delta-sigma cathode tips array in situ self-testing high acceleration sensor deep learning marine environmental monitoring accelerometer fault tolerant hostile environment micro-electro-mechanical systems (MEMS) low-temperature co-fired ceramic (LTCC) classification of horse gaits Taguchi method interface ASIC capacitive transduction digital resonator safety and arming system inertial sensors MEMS technology sleep time duration detection field emission probe piezoresistive effect capacitive accelerometer auto-encoder MEMS-IMU body sensor network optical microresonator wireless hybrid integrated mode splitting |
| ISBN | 3-03897-415-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910346853503321 |
Ngo Ha Duong
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| MDPI - Multidisciplinary Digital Publishing Institute, 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things [[electronic resource] ] : 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers / / edited by Michail Maniatakos, Ibrahim (Abe) M. Elfadel, Matteo Sonza Reorda, H. Fatih Ugurdag, José Monteiro, Ricardo Reis
| VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things [[electronic resource] ] : 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers / / edited by Michail Maniatakos, Ibrahim (Abe) M. Elfadel, Matteo Sonza Reorda, H. Fatih Ugurdag, José Monteiro, Ricardo Reis |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (XIV, 257 p. 181 illus., 145 illus. in color.) |
| Disciplina | 621.395 |
| Collana | IFIP Advances in Information and Communication Technology |
| Soggetto topico |
Computer organization
Logic design Operating systems (Computers) Input-output equipment (Computers) Microprogramming Application software Computer Systems Organization and Communication Networks Logic Design Operating Systems Input/Output and Data Communications Control Structures and Microprogramming Information Systems Applications (incl. Internet) |
| ISBN | 3-030-15663-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910337845403321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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