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CODES+ISSS 2007 : Embedded Systems Week 2007 : International Conference on Hardware/Software Codesign and System Synthesis : Sept. 30 - Oct. 3, 2007, Salzburg, Austria
CODES+ISSS 2007 : Embedded Systems Week 2007 : International Conference on Hardware/Software Codesign and System Synthesis : Sept. 30 - Oct. 3, 2007, Salzburg, Austria
Autore Ha Soonhoi
Pubbl/distr/stampa [Place of publication not identified], : ACM, 2007
Descrizione fisica 1 online resource (266 pages)
Collana ACM Conferences
Soggetto topico Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti CODES+ISSS '07
Record Nr. UNISA-996199660303316
Ha Soonhoi  
[Place of publication not identified], : ACM, 2007
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
CODES+ISSS 2007 : Embedded Systems Week 2007 : International Conference on Hardware/Software Codesign and System Synthesis : Sept. 30 - Oct. 3, 2007, Salzburg, Austria
CODES+ISSS 2007 : Embedded Systems Week 2007 : International Conference on Hardware/Software Codesign and System Synthesis : Sept. 30 - Oct. 3, 2007, Salzburg, Austria
Autore Ha Soonhoi
Pubbl/distr/stampa [Place of publication not identified], : ACM, 2007
Descrizione fisica 1 online resource (266 pages)
Collana ACM Conferences
Soggetto topico Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti CODES+ISSS '07
Record Nr. UNINA-9910138565603321
Ha Soonhoi  
[Place of publication not identified], : ACM, 2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Dependable embedded systems / / editors, Jörg Henkel, Nikil Dutt
Dependable embedded systems / / editors, Jörg Henkel, Nikil Dutt
Autore Henkel Jörg
Edizione [1st edition 2021.]
Pubbl/distr/stampa Springer Nature, 2021
Descrizione fisica 1 online resource (XIII, 608 p. 293 illus., 250 illus. in color.)
Disciplina 621.3815
Collana Embedded systems (Springer (Firm))
Soggetto topico Electronic circuits
Computer engineering
Internet of things
Embedded computer systems
Microprocessors
ISBN 3-030-52017-X
Classificazione COM011000TEC007000TEC008010
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction -- Design of efficient, dependable SoCs based on cross-layer-reliability approach with emphasis on wireless communication as application and DRAM memories -- CRAU: Compositional System-Level Reliability Analysis in the Presence of Uncertainties -- Semantics-aware Soft Error Handling for Embedded Systems using Compiler-OS Interaction -- ARES: Self-Adaptive Coarse-Grained Reconfigurable Architectures as Reliability Enhancers in Embedded Systems -- Cross-Layer Techniques for Dependable Software Execution on Embedded Systems -- Ambrosia: Cross-layer Modeling and Mitigation of Aging Effects in Embedded Systems -- Cross-Layer Dependability for Embedded Hardware/Software Systems -- Fault-Tolerant Computing with Heterogeneous Hardware/Software Hardening Modes -- Robust Computing for Machine Learning-Based Systems -- Hardening embedded system software -- LIFT: Lifting Device-Level Characteristics for Error Resilient System Level Design: A Crosslayer Approach -- VirTherm-3D: Communication Virtualization Enabling System Management for Dependable 3D MPSoCs -- OTERA: Online Test Strategies for Reliable Reconfigurable Architectures -- Variability-Aware Software: Recent Results and Contributions -- EM Lifetime Constrained Optimization for Multi-Segment Power Grid Networks -- Lightweight Software-Assisted Memory Error Correction -- Reliability-Driven Resource Management for Multi-Core Systems-on-Chip -- Monitor Circuits for Device-Circuit Interaction -- PERCIES: Providing Efficient Reliability in Critical Embedded Systems.
Record Nr. UNINA-9910427734503321
Henkel Jörg  
Springer Nature, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
On-chip communication architectures : system on chip interconnect / / Sudeep Pasricha, Nikil Dutt
On-chip communication architectures : system on chip interconnect / / Sudeep Pasricha, Nikil Dutt
Autore Pasricha Sudeep
Edizione [1st edition]
Pubbl/distr/stampa Amsterdam ; ; Boston, : Elsevier / Morgan Kaufmann Publishers, c2008
Descrizione fisica 1 online resource (541 p.)
Disciplina 621.3815
Altri autori (Persone) DuttNikil
Collana Systems on Silicon
Soggetto topico Systems on a chip
Microcomputers - Buses
Computer architecture
Interconnects (Integrated circuit technology)
ISBN 9786611370947
9781281370945
1281370940
9780080558288
0080558283
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Front Cover; On-Chip Communication Architectures: System on Chip Interconnect; Copyright Page; Contents; Preface; About the Authors; Acknowledgments; List of Contributors; CHAPTER 1 Introduction; 1.1. Trends in System-On-Chip Design; 1.2. Coping with Soc Design Complexity; 1.3. ESL Design Flow; 1.4. On-Chip Communication Architectures: A Quick Look; 1.5. Book Outline; CHAPTER 2 Basic Concepts of Bus-Based Communication Architectures; 2.1. Terminology; 2.2. Characteristics of Bus-Based Communication Architectures; 2.3. Data Transfer Modes; 2.4. Bus Topology Types
2.5. Physical Implementation of Bus Wires2.6. Discussion: Buses in the DSM Era; 2.7. Summary; CHAPTER 3 On-Chip Communication Architecture Standards; 3.1. Standard On-Chip Bus-Based Communication Architectures; 3.2. Socket-Based On-Chip Bus Interface Standards; 3.3. Discussion: Off-Chip Bus Architecture Standards; 3.4. Summary; CHAPTER 4 Models for Performance Exploration; 4.1. Static Performance Estimation Models; 4.2. Dynamic (Simulation-Based) Performance Estimation Models; 4.3. Hybrid Communication Architecture Performance Estimation Approaches; 4.4. Summary
CHAPTER 5 Models for Power and Thermal Estimation5.1. Bus Wire Power Models; 5.2. Comprehensive Bus Architecture Power Models; 5.3. Bus Wire Thermal Models; 5.4. Discussion: PVT Variation-Aware Power Estimation; 5.5. Summary; CHAPTER 6 Synthesis of On-Chip Communication Architectures; 6.1. Bus Topology Synthesis; 6.2. Bus Protocol Parameter Synthesis; 6.3. Bus Topology and Protocol Parameter Synthesis; 6.4. Physical Implementation Aware Synthesis; 6.5. Memory-Communication Architecture Co-synthesis; 6.6. Discussion: Physical and Circuit Level Design of On-Chip Communication Architectures
6.7. SummaryCHAPTER 7 Encoding Techniques for On-Chip Communication Architectures; 7.1. Techniques for Power Reduction; 7.2. Techniques for Reducing Capacitive Crosstalk Delay; 7.3. Techniques for Reducing Power and Capacitive Crosstalk Effects; 7.4. Techniques for Reducing Inductive Crosstalk Effects; 7.5. Techniques for Fault Tolerance and Reliability; 7.6. Summary; CHAPTER 8 Custom Bus-Based On-Chip Communication Architecture Design; 8.1. Split Bus Architectures; 8.2. Serial Bus Architectures; 8.3. CDMA-Based Bus Architectures; 8.4. Asynchronous Bus Architectures
8.5. Dynamically Reconfigurable Bus Architectures8.6. Summary; CHAPTER 9 On-Chip Communication Architecture Refinement and Interface Synthesis; 9.1. On-Chip Communication Architecture Refinement; 9.2. Interface Synthesis; 9.3. Discussion: Interface Synthesis; 9.4. Summary; CHAPTER 10 Verification and Security Issues in On-Chip Communication Architecture Design; 10.1. Verification of On-Chip Communication Protocols; 10.2. Compliance Verification for IP Block Integration; 10.3. Basic Concepts of SoC Security; 10.4. Security Support in Standard Bus Protocols
10.5. Communication Architecture Enhancements for Improving SoC Security
Record Nr. UNINA-9911006627103321
Pasricha Sudeep  
Amsterdam ; ; Boston, : Elsevier / Morgan Kaufmann Publishers, c2008
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Proceedings of the 48th Design Automation Conference
Proceedings of the 48th Design Automation Conference
Pubbl/distr/stampa [Place of publication not identified], : ACM, 2011
Descrizione fisica 1 online resource (1055 pages)
Collana ACM Conferences
Soggetto topico Civil & Environmental Engineering
Engineering & Applied Sciences
Civil Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti DAC '11
Record Nr. UNISA-996206195903316
[Place of publication not identified], : ACM, 2011
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Proceedings of the 48th Design Automation Conference
Proceedings of the 48th Design Automation Conference
Pubbl/distr/stampa [Place of publication not identified], : ACM, 2011
Descrizione fisica 1 online resource (1055 pages)
Collana ACM Conferences
Soggetto topico Civil & Environmental Engineering
Engineering & Applied Sciences
Civil Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti DAC '11
Record Nr. UNINA-9910139622903321
[Place of publication not identified], : ACM, 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui