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Lead-free solder process development / / edited by Greg Henshall, Jasbir Bath, Carol A. Handwerker
| Lead-free solder process development / / edited by Greg Henshall, Jasbir Bath, Carol A. Handwerker |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2011 |
| Descrizione fisica | 1 online resource (286 p.) |
| Disciplina | 621.9/77 |
| Altri autori (Persone) |
HenshallGregory Arthur
BathJasbir HandwerkerCarol A |
| Soggetto topico |
Lead-free electronics manufacturing processes
Solder and soldering |
| ISBN |
1-283-02524-8
9786613025241 1-118-10274-6 0-470-90119-5 0-470-90118-7 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Front Matter -- Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, Life-Cycle Design, and End of Life / John Hawley -- Lead-Free Surface Mount Technology / Jasbir Bath, Jennifer Nguyen, Sundar Sethuraman -- Lead-Free Wave Soldering / Denis Barbini, Jasbir Bath -- Lead-Free Rework / Alan Donaldson -- Lead-Free Alloys for BGA/CSP Components / Gregory Henshall -- Growth Mechanisms and Mitigation Strategies of Tin Whisker Growth / Peng Su -- Testability of Lead-Free Printed Circuit Assemblies / Rosa D Reinosa, Aileen M Allen -- Board-Level Solder Joint Reliability of High-Performance Computers Under Mechanical Loading / Keith Newman -- Lead-Free Reliability in Aerospace/Military Environments / Thomas A Woodrow, Jasbir Bath -- Lead-Free Reliability in Automotive Environments / Richard D Parker -- Index. |
| Record Nr. | UNINA-9910876686203321 |
| Hoboken, NJ, : Wiley, c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Lead-free soldering process development and reliability / / edited by Jasbir Bath
| Lead-free soldering process development and reliability / / edited by Jasbir Bath |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , 2020 |
| Descrizione fisica | 1 online resource (515 pages) |
| Disciplina | 621.381/046 |
| Collana | Wiley Series in Quality & Reliability Engineering |
| Soggetto topico |
Electronic packaging
Solder and soldering |
| ISBN |
1-119-48204-6
1-119-48209-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910554854203321 |
| Hoboken, New Jersey : , : Wiley, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Lead-free soldering process development and reliability / / edited by Jasbir Bath
| Lead-free soldering process development and reliability / / edited by Jasbir Bath |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , 2020 |
| Descrizione fisica | 1 online resource (515 pages) |
| Disciplina | 621.381/046 |
| Collana | Wiley Series in Quality & Reliability Engineering |
| Soggetto topico |
Electronic packaging
Solder and soldering |
| ISBN |
1-119-48204-6
1-119-48209-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910824582703321 |
| Hoboken, New Jersey : , : Wiley, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Mitigating tin whisker risks : theory and practice / / Takahiko Kato, Carol A. Handwerker, Jasbir Bath
| Mitigating tin whisker risks : theory and practice / / Takahiko Kato, Carol A. Handwerker, Jasbir Bath |
| Autore | Kato Takahiko |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2016] |
| Descrizione fisica | 1 online resource (299 p.) |
| Disciplina | 671.5/6 |
| Collana | Wiley series on processing of engineering materials |
| Soggetto topico |
Solder and soldering
Failure analysis (Engineering) |
| ISBN |
1-119-01196-5
1-119-01194-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
List of Contributors ix -- Introduction xi -- 1 A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties 1 /Pylin Sarobol, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, John P. Koppes, John E. Blendell and Carol A. Handwerker -- 1.1 Introduction, 1 -- 1.2 Characteristics of Whisker and Hillock Growth from Surface Grains, 3 -- 1.3 Summary and Recommendations, 17 -- Acknowledgments, 18 -- References, 19 -- 2 Major Driving Forces and Growth Mechanisms for TinWhiskers 21 /Eric Chason and Nitin Jadhav -- 2.1 Introduction, 21 -- 2.2 Understanding the Mechanisms Behind Imc-Induced Stress Evolution and Whisker Growth, 24 -- 2.3 Relation of Stress to Whisker Growth, 34 -- 2.4 Conclusions, 39 -- Acknowledgments, 40 -- References, 40 -- 3 Approaches of Modeling and Simulation of Stresses in Sn Finishes 43 /Peng Su and Min Ding -- 3.1 Introduction, 43 -- 3.2 Constitutive Model, 44 -- 3.3 Strain Energy Density, 46 -- 3.4 Grain Orientation, 46 -- 3.5 Finite Element Modeling of Triple-Grain Junction, 48 -- 3.6 Finite Element Modeling of Sn Finish with Multiple Grains, 55 -- References, 66 -- 4 Properties and Whisker Formation Behavior of Tin-Based Alloy Finishes 69 /Takahiko Kato and Asao Nishimura -- 4.1 Introduction, 69 -- 4.2 General Properties of Tin-based Alloy Finishes (Asao Nishimura), 70 -- 4.3 Effect of Alloying Elements on Whisker Formation and Mitigation (Asao Nishimura), 75 -- 4.4 Dependence of Whisker Propensity of Matte Tin / Copper Finish on Copper Lead-Frame Material (Takahiko Kato), 89 -- 4.5 Conclusions, 118 -- Acknowledgments, 118 -- References, 119 -- 5 Characterization Techniques for Film Characteristics 125 /Takahiko Kato and Yukiko Mizuguchi -- 5.1 Introduction, 125 -- 5.2 TEM (Takahiko Kato), 125 -- 5.3 SEM (Yukiko Mizuguchi), 140 -- 5.4 EBSD (Yukiko Mizuguchi), 146 -- 5.5 Conclusions, 154 -- Acknowledgments, 155 -- References, 155 -- 6 Overview of Whisker-Mitigation Strategies for High-Reliability Electronic Systems 159 /David Pinsky.
6.1 Overview of Tin Whisker Risk Management, 159 -- 6.2 Details of Tin Whisker Mitigation, 164 -- 6.3 Managing Tin Whisker Risks at the System Level, 173 -- 6.4 Control of Subcontractors and Suppliers, 183 -- 6.5 Conclusions, 185 -- References, 185 -- 7 Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects 187 /Nicholas G. Clore, Dennis D. Fritz, Wei-Hsun Chen, Maureen E. Williams, John E. Blendell and Carol A. Handwerker -- 7.1 Introduction, 187 -- 7.2 Surface-Defect Classification and Measurement Method, 189 -- 7.3 Preparation and Storage Conditions of Electroplated Films on Substrates, 194 -- 7.4 Surface Defect Formation as a Function of Tin Film Type, Substrate, and Storage Condition, 195 -- 7.5 Conclusions, 209 -- Appendix, 209 -- Acknowledgments, 209 -- References, 213 -- 8 Board Reflow Processes and their Effect on Tin Whisker Growth 215 /Jasbir Bath -- 8.1 Introduction, 215 -- 8.2 The Effect of Reflowed Components on Tin Whisker Growth in Terms of Grain Size and Grain Orientation Distribution, 215 -- 8.3 Reflow Profiles and the Effect on Tin Whisker Growth, 216 -- 8.4 Influence of Reflow Atmosphere and Flux on Tin Whisker Growth, 219 -- 8.5 Effect of Solder Paste Volume on Component Tin Whisker Growth during Electronics Assembly, 220 -- 8.6 Conclusions, 221 -- Acknowledgments, 222 -- References, 222 -- 9 Mechanically Induced TinWhiskers 225 /Tadahiro Shibutani and Michael Osterman -- 9.1 Introduction, 225 -- 9.2 Overview of Mechanically Induced Tin Whisker Formation, 227 -- 9.3 Theory, 228 -- 9.4 Case Studies, 237 -- 9.5 Conclusions, 245 -- References, 246 -- Index 249. |
| Record Nr. | UNINA-9910136920903321 |
Kato Takahiko
|
||
| Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2016] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Mitigating tin whisker risks : theory and practice / / Takahiko Kato, Carol A. Handwerker, Jasbir Bath
| Mitigating tin whisker risks : theory and practice / / Takahiko Kato, Carol A. Handwerker, Jasbir Bath |
| Autore | Kato Takahiko |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2016] |
| Descrizione fisica | 1 online resource (299 p.) |
| Disciplina | 671.5/6 |
| Collana | Wiley series on processing of engineering materials |
| Soggetto topico |
Solder and soldering
Failure analysis (Engineering) |
| ISBN |
1-119-01196-5
1-119-01194-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
List of Contributors ix -- Introduction xi -- 1 A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties 1 /Pylin Sarobol, Ying Wang, Wei-Hsun Chen, Aaron E. Pedigo, John P. Koppes, John E. Blendell and Carol A. Handwerker -- 1.1 Introduction, 1 -- 1.2 Characteristics of Whisker and Hillock Growth from Surface Grains, 3 -- 1.3 Summary and Recommendations, 17 -- Acknowledgments, 18 -- References, 19 -- 2 Major Driving Forces and Growth Mechanisms for TinWhiskers 21 /Eric Chason and Nitin Jadhav -- 2.1 Introduction, 21 -- 2.2 Understanding the Mechanisms Behind Imc-Induced Stress Evolution and Whisker Growth, 24 -- 2.3 Relation of Stress to Whisker Growth, 34 -- 2.4 Conclusions, 39 -- Acknowledgments, 40 -- References, 40 -- 3 Approaches of Modeling and Simulation of Stresses in Sn Finishes 43 /Peng Su and Min Ding -- 3.1 Introduction, 43 -- 3.2 Constitutive Model, 44 -- 3.3 Strain Energy Density, 46 -- 3.4 Grain Orientation, 46 -- 3.5 Finite Element Modeling of Triple-Grain Junction, 48 -- 3.6 Finite Element Modeling of Sn Finish with Multiple Grains, 55 -- References, 66 -- 4 Properties and Whisker Formation Behavior of Tin-Based Alloy Finishes 69 /Takahiko Kato and Asao Nishimura -- 4.1 Introduction, 69 -- 4.2 General Properties of Tin-based Alloy Finishes (Asao Nishimura), 70 -- 4.3 Effect of Alloying Elements on Whisker Formation and Mitigation (Asao Nishimura), 75 -- 4.4 Dependence of Whisker Propensity of Matte Tin / Copper Finish on Copper Lead-Frame Material (Takahiko Kato), 89 -- 4.5 Conclusions, 118 -- Acknowledgments, 118 -- References, 119 -- 5 Characterization Techniques for Film Characteristics 125 /Takahiko Kato and Yukiko Mizuguchi -- 5.1 Introduction, 125 -- 5.2 TEM (Takahiko Kato), 125 -- 5.3 SEM (Yukiko Mizuguchi), 140 -- 5.4 EBSD (Yukiko Mizuguchi), 146 -- 5.5 Conclusions, 154 -- Acknowledgments, 155 -- References, 155 -- 6 Overview of Whisker-Mitigation Strategies for High-Reliability Electronic Systems 159 /David Pinsky.
6.1 Overview of Tin Whisker Risk Management, 159 -- 6.2 Details of Tin Whisker Mitigation, 164 -- 6.3 Managing Tin Whisker Risks at the System Level, 173 -- 6.4 Control of Subcontractors and Suppliers, 183 -- 6.5 Conclusions, 185 -- References, 185 -- 7 Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects 187 /Nicholas G. Clore, Dennis D. Fritz, Wei-Hsun Chen, Maureen E. Williams, John E. Blendell and Carol A. Handwerker -- 7.1 Introduction, 187 -- 7.2 Surface-Defect Classification and Measurement Method, 189 -- 7.3 Preparation and Storage Conditions of Electroplated Films on Substrates, 194 -- 7.4 Surface Defect Formation as a Function of Tin Film Type, Substrate, and Storage Condition, 195 -- 7.5 Conclusions, 209 -- Appendix, 209 -- Acknowledgments, 209 -- References, 213 -- 8 Board Reflow Processes and their Effect on Tin Whisker Growth 215 /Jasbir Bath -- 8.1 Introduction, 215 -- 8.2 The Effect of Reflowed Components on Tin Whisker Growth in Terms of Grain Size and Grain Orientation Distribution, 215 -- 8.3 Reflow Profiles and the Effect on Tin Whisker Growth, 216 -- 8.4 Influence of Reflow Atmosphere and Flux on Tin Whisker Growth, 219 -- 8.5 Effect of Solder Paste Volume on Component Tin Whisker Growth during Electronics Assembly, 220 -- 8.6 Conclusions, 221 -- Acknowledgments, 222 -- References, 222 -- 9 Mechanically Induced TinWhiskers 225 /Tadahiro Shibutani and Michael Osterman -- 9.1 Introduction, 225 -- 9.2 Overview of Mechanically Induced Tin Whisker Formation, 227 -- 9.3 Theory, 228 -- 9.4 Case Studies, 237 -- 9.5 Conclusions, 245 -- References, 246 -- Index 249. |
| Record Nr. | UNINA-9910822586103321 |
|
Kato Takahiko
|
||
| Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2016] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||