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Advanced interconnects for ULSI technology [[electronic resource] /] / edited by Mikhail Baklanov, Paul S. Ho and Ehrenfried Zschech
| Advanced interconnects for ULSI technology [[electronic resource] /] / edited by Mikhail Baklanov, Paul S. Ho and Ehrenfried Zschech |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Chichester, West Susex, : Wiley, 2012 |
| Descrizione fisica | 1 online resource (615 p.) |
| Disciplina | 621.39/5 |
| Altri autori (Persone) |
BaklanovMikhail
HoP. S ZschechEhrenfried |
| Soggetto topico |
Integrated circuits - Ultra large scale integration
Interconnects (Integrated circuit technology) |
| ISBN |
1-119-96686-8
1-119-96367-2 1-280-59080-7 9786613620637 1-119-96324-9 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Advanced Interconnects for ULSI Technology; Contents; About the Editors; List of Contributors; Preface; Abbreviations; Section I Low-k Materials; 1 Low-k Materials: Recent Advances; 1.1 Introduction; 1.2 Integration Challenges; 1.2.1 Process-Induced Damage; 1.2.2 Mechanical Properties; 1.3 Processing Approaches to Existing Integration Issues; 1.3.1 Post-deposition Treatments; 1.3.2 Prevention or Repair of Plasma-Induced Processing Damage; 1.3.3 Multilayer Structures; 1.4 Material Advances to Overcome Current Limitations; 1.4.1 Silica Zeolites; 1.4.2 Hybrid Organic-Inorganic: Oxycarbosilanes
1.5 ConclusionReferences; 2 Ultra-Low-k by CVD: Deposition and Curing; 2.1 Introduction; 2.2 Porogen Approach by PECVD; 2.2.1 Precursors and Deposition Conditions; 2.2.2 Mystery Still Unsolved: From Porogens to Pores; 2.3 UV Curing; 2.3.1 General Overview of Curing; 2.3.2 UV Curing Mechanisms; 2.4 Impact of Curing on Structure and Physical Properties: Benefits of UV Curing; 2.4.1 Porosity; 2.4.2 Chemical Structure and Mechanical Properties; 2.4.3 Electrical Properties; 2.5 Limit/Issues with the Porogen Approach; 2.5.1 Porosity Creation Limit; 2.5.2 Porogen Residues; 2.6 Future of CVD Low-k 2.6.1 New Matrix Precursor2.6.2 Other Deposition Strategies; 2.6.3 New Deposition Techniques; 2.7 Material Engineering: Adaptation to Integration Schemes; 2.8 Conclusion; References; 3 Plasma Processing of Low-k Dielectrics; 3.1 Introduction; 3.2 Materials and Equipment; 3.3 Process Results Characterization; 3.4 Interaction of Low-k Dielectrics with Plasma; 3.4.1 Low-k Etch Chemistries; 3.4.2 Patterning Strategies and Masking Materials; 3.4.3 Etch Mechanisms; 3.5 Mechanisms of Plasma Damage; 3.5.1 Gap Structure Studies; 3.5.2 Effect of Radical Density; 3.5.3 Effect of Ion Energy 3.5.4 Effect of Photon Energy and Intensity3.5.5 Plasma Damage by Oxidative Radicals; 3.5.6 Hydrogen-Based Plasma; 3.5.7 Minimization of Plasma Damage; 3.6 Dielectric Recovery; 3.6.1 CH4 Beam Treatment; 3.6.2 Dielectric Recovery by Silylation; 3.6.3 UV Radiation; 3.7 Conclusions; References; 4 Wet Clean Applications in Porous Low-k Patterning Processes; 4.1 Introduction; 4.2 Silica and Porous Hybrid Dielectric Materials; 4.3 Impact of Plasma and Subsequent Wet Clean Processes on the Stability of Porous Low-k Dielectrics; 4.3.1 Stability in Pure Chemical Solutions 4.3.2 Stability in Commercial Chemistries4.3.3 Hydrophobicity of Hybrid Low-k Materials; 4.4 Removal of Post-Etch Residues and Copper Surface Cleaning; 4.5 Plasma Modification and Removal of Post-Etch 193 nm Photoresist; 4.5.1 Modification of 193 nm Photoresist by Plasma Etch; 4.5.2 Wet Removal of 193 nm Photoresist; Acknowledgments; References; Section II Conductive Layers and Barriers; 5 Copper Electroplating for On-Chip Metallization; 5.1 Introduction; 5.2 Copper Electroplating Techniques; 5.3 Copper Electroplating Superfill; 5.3.1 The Role of Accelerator; 5.3.2 The Role of Suppressor 5.3.3 The Role of Leveler |
| Record Nr. | UNINA-9910141346803321 |
| Chichester, West Susex, : Wiley, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced interconnects for ULSI technology [[electronic resource] /] / edited by Mikhail Baklanov, Paul S. Ho and Ehrenfried Zschech
| Advanced interconnects for ULSI technology [[electronic resource] /] / edited by Mikhail Baklanov, Paul S. Ho and Ehrenfried Zschech |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Chichester, West Susex, : Wiley, 2012 |
| Descrizione fisica | 1 online resource (615 p.) |
| Disciplina | 621.39/5 |
| Altri autori (Persone) |
BaklanovMikhail
HoP. S ZschechEhrenfried |
| Soggetto topico |
Integrated circuits - Ultra large scale integration
Interconnects (Integrated circuit technology) |
| ISBN |
1-119-96686-8
1-119-96367-2 1-280-59080-7 9786613620637 1-119-96324-9 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Advanced Interconnects for ULSI Technology; Contents; About the Editors; List of Contributors; Preface; Abbreviations; Section I Low-k Materials; 1 Low-k Materials: Recent Advances; 1.1 Introduction; 1.2 Integration Challenges; 1.2.1 Process-Induced Damage; 1.2.2 Mechanical Properties; 1.3 Processing Approaches to Existing Integration Issues; 1.3.1 Post-deposition Treatments; 1.3.2 Prevention or Repair of Plasma-Induced Processing Damage; 1.3.3 Multilayer Structures; 1.4 Material Advances to Overcome Current Limitations; 1.4.1 Silica Zeolites; 1.4.2 Hybrid Organic-Inorganic: Oxycarbosilanes
1.5 ConclusionReferences; 2 Ultra-Low-k by CVD: Deposition and Curing; 2.1 Introduction; 2.2 Porogen Approach by PECVD; 2.2.1 Precursors and Deposition Conditions; 2.2.2 Mystery Still Unsolved: From Porogens to Pores; 2.3 UV Curing; 2.3.1 General Overview of Curing; 2.3.2 UV Curing Mechanisms; 2.4 Impact of Curing on Structure and Physical Properties: Benefits of UV Curing; 2.4.1 Porosity; 2.4.2 Chemical Structure and Mechanical Properties; 2.4.3 Electrical Properties; 2.5 Limit/Issues with the Porogen Approach; 2.5.1 Porosity Creation Limit; 2.5.2 Porogen Residues; 2.6 Future of CVD Low-k 2.6.1 New Matrix Precursor2.6.2 Other Deposition Strategies; 2.6.3 New Deposition Techniques; 2.7 Material Engineering: Adaptation to Integration Schemes; 2.8 Conclusion; References; 3 Plasma Processing of Low-k Dielectrics; 3.1 Introduction; 3.2 Materials and Equipment; 3.3 Process Results Characterization; 3.4 Interaction of Low-k Dielectrics with Plasma; 3.4.1 Low-k Etch Chemistries; 3.4.2 Patterning Strategies and Masking Materials; 3.4.3 Etch Mechanisms; 3.5 Mechanisms of Plasma Damage; 3.5.1 Gap Structure Studies; 3.5.2 Effect of Radical Density; 3.5.3 Effect of Ion Energy 3.5.4 Effect of Photon Energy and Intensity3.5.5 Plasma Damage by Oxidative Radicals; 3.5.6 Hydrogen-Based Plasma; 3.5.7 Minimization of Plasma Damage; 3.6 Dielectric Recovery; 3.6.1 CH4 Beam Treatment; 3.6.2 Dielectric Recovery by Silylation; 3.6.3 UV Radiation; 3.7 Conclusions; References; 4 Wet Clean Applications in Porous Low-k Patterning Processes; 4.1 Introduction; 4.2 Silica and Porous Hybrid Dielectric Materials; 4.3 Impact of Plasma and Subsequent Wet Clean Processes on the Stability of Porous Low-k Dielectrics; 4.3.1 Stability in Pure Chemical Solutions 4.3.2 Stability in Commercial Chemistries4.3.3 Hydrophobicity of Hybrid Low-k Materials; 4.4 Removal of Post-Etch Residues and Copper Surface Cleaning; 4.5 Plasma Modification and Removal of Post-Etch 193 nm Photoresist; 4.5.1 Modification of 193 nm Photoresist by Plasma Etch; 4.5.2 Wet Removal of 193 nm Photoresist; Acknowledgments; References; Section II Conductive Layers and Barriers; 5 Copper Electroplating for On-Chip Metallization; 5.1 Introduction; 5.2 Copper Electroplating Techniques; 5.3 Copper Electroplating Superfill; 5.3.1 The Role of Accelerator; 5.3.2 The Role of Suppressor 5.3.3 The Role of Leveler |
| Record Nr. | UNINA-9910825297303321 |
| Chichester, West Susex, : Wiley, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Dielectric films for advanced microelectronics [[electronic resource] /] / edited by Mikhail Baklanov, Martin Green, and Karen Maex
| Dielectric films for advanced microelectronics [[electronic resource] /] / edited by Mikhail Baklanov, Martin Green, and Karen Maex |
| Pubbl/distr/stampa | Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2007 |
| Descrizione fisica | 1 online resource (510 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) |
BaklanovMikhail
GreenMartin MaexKaren |
| Collana | Wiley series in materials for electronic and optoelectronic applications |
| Soggetto topico |
Dielectric films
Microelectronics - Materials |
| ISBN |
1-282-34620-2
9786612346200 0-470-01794-5 0-470-06541-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition / A. Grill -- Spin-on dielectric materials / Geraud Dubois, Robert D. Miller, Willi Volksen -- Positron annihilation spectroscopy / David W. Gidley, Hua-Gen Peng, Richard Vallery -- Structure characterization of nanoporous interlevel dielectric thin films with x-ray and neutron radiation / Christopher L. Soles ... [et al.] -- Ellipsometric porosimetry / Mikhail R. Baklanov -- Mechanical and transport properties of low-k dielectrics / J. L. Plawsky ... [et al.] -- Integration of low-k dielectric films in damascene processes / R. J. O. M. Hoofman ... [et al.] -- ONO structures and oxynitrides in modern microelectronics : material science, characterization and application / Yakov Roizin, Vladimir Gritsenko -- Material engineering of high-k gate dielectrics / Akira Toriumi, Koji Kita -- Physical characterization of ultra-thin high-k dielectric / T. Conard, H. Bender, W. Vandervorst -- Electrical characterization of advanced gate dielectrics / Robin Degraeve ... [et al.] -- Integration issues of high-k gate dielectrics / Yasuo Nara -- Anisotropic conductive film (ACF) for advanced microelectronic interconnects / Yi Li, C. P. Wong. |
| Record Nr. | UNINA-9910143706103321 |
| Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Dielectric films for advanced microelectronics [[electronic resource] /] / edited by Mikhail Baklanov, Martin Green, and Karen Maex
| Dielectric films for advanced microelectronics [[electronic resource] /] / edited by Mikhail Baklanov, Martin Green, and Karen Maex |
| Pubbl/distr/stampa | Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2007 |
| Descrizione fisica | 1 online resource (510 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) |
BaklanovMikhail
GreenMartin MaexKaren |
| Collana | Wiley series in materials for electronic and optoelectronic applications |
| Soggetto topico |
Dielectric films
Microelectronics - Materials |
| ISBN |
1-282-34620-2
9786612346200 0-470-01794-5 0-470-06541-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition / A. Grill -- Spin-on dielectric materials / Geraud Dubois, Robert D. Miller, Willi Volksen -- Positron annihilation spectroscopy / David W. Gidley, Hua-Gen Peng, Richard Vallery -- Structure characterization of nanoporous interlevel dielectric thin films with x-ray and neutron radiation / Christopher L. Soles ... [et al.] -- Ellipsometric porosimetry / Mikhail R. Baklanov -- Mechanical and transport properties of low-k dielectrics / J. L. Plawsky ... [et al.] -- Integration of low-k dielectric films in damascene processes / R. J. O. M. Hoofman ... [et al.] -- ONO structures and oxynitrides in modern microelectronics : material science, characterization and application / Yakov Roizin, Vladimir Gritsenko -- Material engineering of high-k gate dielectrics / Akira Toriumi, Koji Kita -- Physical characterization of ultra-thin high-k dielectric / T. Conard, H. Bender, W. Vandervorst -- Electrical characterization of advanced gate dielectrics / Robin Degraeve ... [et al.] -- Integration issues of high-k gate dielectrics / Yasuo Nara -- Anisotropic conductive film (ACF) for advanced microelectronic interconnects / Yi Li, C. P. Wong. |
| Record Nr. | UNINA-9910831036703321 |
| Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Dielectric films for advanced microelectronics [[electronic resource] /] / edited by Mikhail Baklanov, Martin Green, and Karen Maex
| Dielectric films for advanced microelectronics [[electronic resource] /] / edited by Mikhail Baklanov, Martin Green, and Karen Maex |
| Pubbl/distr/stampa | Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2007 |
| Descrizione fisica | 1 online resource (510 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) |
BaklanovMikhail
GreenMartin MaexKaren |
| Collana | Wiley series in materials for electronic and optoelectronic applications |
| Soggetto topico |
Dielectric films
Microelectronics - Materials |
| ISBN |
1-282-34620-2
9786612346200 0-470-01794-5 0-470-06541-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition / A. Grill -- Spin-on dielectric materials / Geraud Dubois, Robert D. Miller, Willi Volksen -- Positron annihilation spectroscopy / David W. Gidley, Hua-Gen Peng, Richard Vallery -- Structure characterization of nanoporous interlevel dielectric thin films with x-ray and neutron radiation / Christopher L. Soles ... [et al.] -- Ellipsometric porosimetry / Mikhail R. Baklanov -- Mechanical and transport properties of low-k dielectrics / J. L. Plawsky ... [et al.] -- Integration of low-k dielectric films in damascene processes / R. J. O. M. Hoofman ... [et al.] -- ONO structures and oxynitrides in modern microelectronics : material science, characterization and application / Yakov Roizin, Vladimir Gritsenko -- Material engineering of high-k gate dielectrics / Akira Toriumi, Koji Kita -- Physical characterization of ultra-thin high-k dielectric / T. Conard, H. Bender, W. Vandervorst -- Electrical characterization of advanced gate dielectrics / Robin Degraeve ... [et al.] -- Integration issues of high-k gate dielectrics / Yasuo Nara -- Anisotropic conductive film (ACF) for advanced microelectronic interconnects / Yi Li, C. P. Wong. |
| Record Nr. | UNINA-9910841471603321 |
| Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2007 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||