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Computational modelling [[electronic resource] /] / guest editor, Chris Bailey
| Computational modelling [[electronic resource] /] / guest editor, Chris Bailey |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2002 |
| Descrizione fisica | 1 online resource (69 p.) |
| Disciplina | 621.381531 |
| Altri autori (Persone) | BaileyChris |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Solder and soldering - Mathematical models
Surface mount technology - Mathematical models |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-47971-X
9786610479719 1-84544-723-9 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; Abstracts & keywords; Editorial; Correlation of solder paste rheology with computational simulations of the stencil printing process; Solder paste reflow modeling; Numerical modelling of scanned beam laser soldering of fine pitch packages; A simplified model of the reflow soldering process; CFD modelling of the flow field inside a reflow oven; Analysis on solder ball shear testing conditions with a simple computational model; Optimisation modelling for flip-chip solder joint reliability; Internet commentary; Book review; Industry news; Appointments; International diary
Note from the publisher |
| Record Nr. | UNINA-9910449844603321 |
| Bradford, England, : Emerald Group Publishing, c2002 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Computational modelling [[electronic resource] /] / guest editor, Chris Bailey
| Computational modelling [[electronic resource] /] / guest editor, Chris Bailey |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2002 |
| Descrizione fisica | 1 online resource (69 p.) |
| Disciplina | 621.381531 |
| Altri autori (Persone) | BaileyChris |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Solder and soldering - Mathematical models
Surface mount technology - Mathematical models |
| ISBN |
1-280-47971-X
9786610479719 1-84544-723-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; Abstracts & keywords; Editorial; Correlation of solder paste rheology with computational simulations of the stencil printing process; Solder paste reflow modeling; Numerical modelling of scanned beam laser soldering of fine pitch packages; A simplified model of the reflow soldering process; CFD modelling of the flow field inside a reflow oven; Analysis on solder ball shear testing conditions with a simple computational model; Optimisation modelling for flip-chip solder joint reliability; Internet commentary; Book review; Industry news; Appointments; International diary
Note from the publisher |
| Record Nr. | UNINA-9910777063803321 |
| Bradford, England, : Emerald Group Publishing, c2002 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||