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Science, Characterization and Technology of Joining and Welding
| Science, Characterization and Technology of Joining and Welding |
| Autore | Haghshenas Meysam |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 electronic resource (251 p.) |
| Soggetto non controllato |
microstructure
phased array ultrasonic thermophysical property FRP simulation eutectoid tint etching TAN alloy dissimilar material joining thermal compression bonding HAZ cracking welding thermal cycles IN738 superalloy carbide dissolution solder friction bit joining weld bonding interfacial microstructure adhesive thermos-mechanical property API 5L X80 steel scarf joint thermal spraying pores Cr-Mo steel welding hot pressing local brittle zone electrical properties Ti2AlNb alloy tool pin profiles adhesive bonding mechanical properties carbon fiber-reinforced polymer surface structuring m23c6 Zn-coated low carbon microalloyed steels flux-less soldering dissimilar joints energy-input medium thick plate model design of experiments oxide layer mechanical interlocking rotary friction-welding 22MnB5 ultrasonic bonding titanium anisotropy coupled arc heat-affected zone aluminum plasma-TIG joint mechanical properties hybrid joining microconstituent dual-phase steel high-crystalline content zirconia flex-on-board assembly active monomers butt joint copper clad filler foil SA213-T23 arc profile numerical simulation tailor welded blanks ceramics vacuum brazing coating longitudinal wave direct diffusion bonding metallurgy pressure distribution flow stress SnBi58 solder joint morphology adhesion dissimilar weldments laser welding distributed point heat sources model mechanical strength taguchi design bonding strength friction stir welding |
| ISBN | 3-03928-998-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910404080103321 |
Haghshenas Meysam
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| MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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