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Proceedings / / IEEE/Cornell Conference on High Performance Devices
| Proceedings / / IEEE/Cornell Conference on High Performance Devices |
| Pubbl/distr/stampa | New York, NY, : IEEE, c2000 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621 |
| Soggetto topico |
Very high speed integrated circuits
Semiconductors Transistors Integrated circuits - Very large scale integration |
| Soggetto genere / forma |
Conference papers and proceedings.
Congresses. |
| Formato | Materiale a stampa  |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | High performance devices |
| Record Nr. | UNISA-996279288103316 |
| New York, NY, : IEEE, c2000 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings / / IEEE/Cornell Conference on High Performance Devices
| Proceedings / / IEEE/Cornell Conference on High Performance Devices |
| Pubbl/distr/stampa | New York, NY, : IEEE, c2000 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621 |
| Soggetto topico |
Very high speed integrated circuits
Semiconductors Transistors Integrated circuits - Very large scale integration |
| Soggetto genere / forma |
Conference papers and proceedings.
Congresses. |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | High performance devices |
| Record Nr. | UNINA-9910626157703321 |
| New York, NY, : IEEE, c2000 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Proceedings / / IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits
| Proceedings / / IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits |
| Pubbl/distr/stampa | New York, N.Y., : IEEE, ©1984-©1997 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.3815 |
| Soggetto topico |
Very high speed integrated circuits
Semiconductors Transistors Integrated circuits - Very large scale integration |
| Soggetto genere / forma | Conference papers and proceedings. |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
Advanced concepts in high speed semiconductor devices and circuits
High speed semiconductor devices and circuits |
| Record Nr. | UNISA-996279339603316 |
| New York, N.Y., : IEEE, ©1984-©1997 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings / / IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits
| Proceedings / / IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits |
| Pubbl/distr/stampa | New York, N.Y., : IEEE, ©1984-©1997 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.3815 |
| Soggetto topico |
Very high speed integrated circuits
Semiconductors Transistors Integrated circuits - Very large scale integration |
| Soggetto genere / forma | Conference papers and proceedings. |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
Advanced concepts in high speed semiconductor devices and circuits
High speed semiconductor devices and circuits |
| Record Nr. | UNINA-9910626197703321 |
| New York, N.Y., : IEEE, ©1984-©1997 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers
| Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (71 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits
Very high speed integrated circuits |
| ISBN | 1-5386-6103-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280707103316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers
| Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (71 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits
Very high speed integrated circuits |
| ISBN | 1-5386-6103-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910280915703321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Proceedings for 2019 IEEE COOL Chips 22 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 / / Institute of Electrical and Electronics Engineers
| Proceedings for 2019 IEEE COOL Chips 22 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (349 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits
Very high speed integrated circuits |
| ISBN | 1-7281-1749-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910325655903321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Proceedings for 2019 IEEE COOL Chips 22 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 / / Institute of Electrical and Electronics Engineers
| Proceedings for 2019 IEEE COOL Chips 22 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (349 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits
Very high speed integrated circuits |
| ISBN | 1-7281-1749-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996580867403316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings of the 25th Biennial Lester Eastman Conference on High Performance Devices (LEC) : 2-4 August 2016, Lehigh University, Bethlehem, PA, USA / / sponsored by the IEEE Electron Devices Society
| Proceedings of the 25th Biennial Lester Eastman Conference on High Performance Devices (LEC) : 2-4 August 2016, Lehigh University, Bethlehem, PA, USA / / sponsored by the IEEE Electron Devices Society |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2016 |
| Descrizione fisica | 1 online resource (xiv, 58 pages) |
| Disciplina | 621 |
| Soggetto topico |
Very high speed integrated circuits
Semiconductors |
| ISBN | 1-4673-8628-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910332535303321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Proceedings of the 25th Biennial Lester Eastman Conference on High Performance Devices (LEC) : 2-4 August 2016, Lehigh University, Bethlehem, PA, USA / / sponsored by the IEEE Electron Devices Society
| Proceedings of the 25th Biennial Lester Eastman Conference on High Performance Devices (LEC) : 2-4 August 2016, Lehigh University, Bethlehem, PA, USA / / sponsored by the IEEE Electron Devices Society |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2016 |
| Descrizione fisica | 1 online resource (xiv, 58 pages) |
| Disciplina | 621 |
| Soggetto topico |
Very high speed integrated circuits
Semiconductors |
| ISBN | 1-4673-8628-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996580865403316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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