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RF and microwave circuit design : theory and applications / / Charles E. Free, Colin S. Aitchison
| RF and microwave circuit design : theory and applications / / Charles E. Free, Colin S. Aitchison |
| Autore | Free Charles E. |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2022] |
| Descrizione fisica | 1 online resource (531 pages) |
| Disciplina | 621.38412 |
| Collana | Microwave and Wireless Technologies Series |
| Soggetto topico |
Radio circuits - Design and construction
Microwave circuits - Design and construction |
| ISBN |
1-119-11467-5
1-119-11466-7 1-119-33223-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover -- Title Page -- Copyright -- Contents -- Preface -- About the Companion Website -- Chapter 1 RF Transmission Lines -- 1.1 Introduction -- 1.2 Voltage, Current, and Impedance Relationships on a Transmission Line -- 1.3 Propagation Constant -- 1.3.1 Dispersion -- 1.3.2 Amplitude Distortion -- 1.4 Lossless Transmission Lines -- 1.5 Matched and Mismatched Transmission Lines -- 1.6 Waves on a Transmission Line -- 1.7 The Smith Chart -- 1.7.1 Derivation of the Smith Chart -- 1.7.2 Properties of the Smith Chart -- 1.8 Stubs -- 1.9 Distributed Matching Circuits -- 1.10 Manipulation of Lumped Impedances Using the Smith Chart -- 1.11 Lumped Impedance Matching -- 1.11.1 Matching a Complex Load Impedance to a Real Source Impedance -- 1.11.2 Matching a Complex Load Impedance to a Complex Source Impedance -- 1.12 Equivalent Lumped Circuit of a Lossless Transmission Line -- 1.13 Supplementary Problems -- Appendix 1.A Coaxial Cable -- 1.A.1 Electromagnetic Field Patterns in Coaxial Cable -- 1.A.2 Essential Properties of Coaxial Cables -- Appendix 1.B Coplanar Waveguide -- 1.B.1 Structure of Coplanar Waveguide (CPW) -- 1.B.2 Electromagnetic Field Distribution on a CPW Line -- 1.B.3 Essential Properties of Coplanar (CPW) Lines -- 1.B.4 Summary of Key Points Relating to CPW Lines -- Appendix 1.C Metal Waveguide -- 1.C.1 Waveguide Principles -- 1.C.2 Waveguide Propagation -- 1.C.3 Rectangular Waveguide Modes -- 1.C.4 The Waveguide Equation -- 1.C.5 Phase and Group Velocities -- 1.C.6 Field Theory Analysis of Rectangular Waveguides -- 1.C.7 Waveguide Impedance -- 1.C.8 Higher‐Order Rectangular Waveguide Modes -- 1.C.9 Waveguide Attenuation -- 1.C.10 Sizes of Rectangular Waveguide and Waveguide Designation -- 1.C.11 Circular Waveguide -- References -- Chapter 2 Planar Circuit Design I -- 2.1 Introduction.
2.2 Electromagnetic Field Distribution Across a Microstrip Line -- 2.3 Effective Relative Permittivity, εr,eff MSTRIP -- 2.4 Microstrip Design Graphs and CAD Software -- 2.5 Operating Frequency Limitations -- 2.6 Skin Depth -- 2.7 Examples of Microstrip Components -- 2.7.1 Branch‐Line Coupler -- 2.7.2 Quarter‐Wave Transformer -- 2.7.3 Wilkinson Power Divider -- 2.8 Microstrip Coupled‐Line Structures -- 2.8.1 Analysis of Microstrip Coupled Lines -- 2.8.2 Microstrip Directional Couplers -- 2.8.2.1 Design of Microstrip Directional Couplers -- 2.8.2.2 Directivity of Microstrip Directional Couplers -- 2.8.2.3 Improvements to Microstrip Directional Couplers -- 2.8.3 Examples of Other Common Microstrip Coupled‐Line Structures -- 2.8.3.1 Microstrip DC Break -- 2.8.3.2 Edge‐Coupled Microstrip Band‐Pass Filter -- 2.8.3.3 Lange Coupler -- 2.9 Summary -- 2.10 Supplementary Problems -- References -- Chapter 3 Fabrication Processes for RF and Microwave Circuits -- 3.1 Introduction -- 3.2 Review of Essential Material Parameters -- 3.2.1 Dielectrics -- 3.2.2 Conductors -- 3.3 Requirements for RF Circuit Materials -- 3.4 Fabrication of Planar High‐Frequency Circuits -- 3.4.1 Etched Circuits -- 3.4.2 Thick‐Film Circuits (Direct Screen Printed) -- 3.4.3 Thick Film Circuits (Using Photoimageable Materials) -- 3.4.4 Low‐Temperature Co‐Fired Ceramic Circuits -- 3.5 Use of Ink Jet Technology -- 3.6 Characterization of Materials for RF and Microwave Circuits -- 3.6.1 Measurement of Dielectric Loss and Dielectric Constant -- 3.6.1.1 Cavity Resonators -- 3.6.1.2 Dielectric Characterization by Cavity Perturbation -- 3.6.1.3 Use of the Split Post Dielectric Resonator (SPDR) -- 3.6.1.4 Open Resonator -- 3.6.1.5 Free‐Space Transmission Measurements -- 3.6.2 Measurement of Planar Line Properties -- 3.6.2.1 The Microstrip Resonant Ring -- 3.6.2.2 Non‐resonant Lines. 3.6.3 Physical Properties of Microstrip Lines -- 3.7 Supplementary Problems -- References -- Chapter 4 Planar Circuit Design II -- 4.1 Introduction -- 4.2 Discontinuities in Microstrip -- 4.2.1 Open‐End Effect -- 4.2.2 Step‐Width -- 4.2.3 Corners -- 4.2.4 Gaps -- 4.2.5 T‐Junctions -- 4.3 Microstrip Enclosures -- 4.4 Packaged Lumped‐Element Passive Components -- 4.4.1 Typical Packages for RF Passive Components -- 4.4.2 Lumped‐Element Resistors -- 4.4.3 Lumped‐Element Capacitors -- 4.4.4 Lumped‐Element Inductors -- 4.5 Miniature Planar Components -- 4.5.1 Spiral Inductors -- 4.5.2 Loop Inductors -- 4.5.3 Interdigitated Capacitors -- 4.5.4 Metal-Insulator-Metal Capacitor -- References -- Chapter 5 S‐Parameters -- 5.1 Introduction -- 5.2 S‐Parameter Definitions -- 5.3 Signal Flow Graphs -- 5.4 Mason's Non‐touching Loop Rule -- 5.5 Reflection Coefficient of a Two‐Port Network -- 5.6 Power Gains of Two‐Port Networks -- 5.7 Stability -- 5.8 Supplementary Problems -- {5.A.1} Transmission Parameters (ABCD Parameters) -- {5.A.2} Admittance Parameters (Y‐Parameters) -- {5.A.3} Impedance Parameters (Z‐Parameters) -- References -- Chapter 6 Microwave Ferrites -- 6.1 Introduction -- 6.2 Basic Properties of Ferrite Materials -- 6.2.1 Ferrite Materials -- 6.2.2 Precession in Ferrite Materials -- 6.2.3 Permeability Tensor -- 6.2.4 Faraday Rotation -- 6.3 Ferrites in Metallic Waveguide -- 6.3.1 Resonance Isolator -- 6.3.2 Field Displacement Isolator -- 6.3.3 Waveguide Circulator -- 6.4 Ferrites in Planar Circuits -- 6.4.1 Planar Circulators -- 6.4.2 Edge‐Guided‐Mode Propagation -- 6.4.3 Edge‐Guided‐Mode Isolator -- 6.4.4 Phase Shifters -- 6.5 Self‐Biased Ferrites -- 6.6 Supplementary Problems -- References -- Chapter 7 Measurements -- 7.1 Introduction -- 7.2 RF and Microwave Connectors -- 7.2.1 Maintenance of Connectors -- 7.2.2 Connecting to Planar Circuits. 7.3 Microwave Vector Network Analyzers -- 7.3.1 Description and Configuration -- 7.3.2 Error Models Representing a VNA -- 7.3.3 Calibration of a VNA -- 7.4 On‐Wafer Measurements -- 7.5 Summary -- References -- Chapter 8 RF Filters -- 8.1 Introduction -- 8.2 Review of Filter Responses -- 8.3 Filter Parameters -- 8.4 Design Strategy for RF and Microwave Filters -- 8.5 Multi‐Element Low‐Pass Filter -- 8.6 Practical Filter Responses -- 8.7 Butterworth (or Maximally Flat) Response -- 8.7.1 Butterworth Low‐Pass Filter -- 8.7.2 Butterworth High‐Pass Filter -- 8.7.3 Butterworth Band‐Pass Filter -- 8.8 Chebyshev (Equal Ripple) Response -- 8.9 Microstrip Low‐Pass Filter, Using Stepped Impedances -- 8.10 Microstrip Low‐Pass Filter, Using Stubs -- 8.11 Microstrip Edge‐Coupled Band‐Pass Filters -- 8.12 Microstrip End‐Coupled Band‐Pass Filters -- 8.13 Practical Points Associated with Filter Design -- 8.14 Summary -- 8.15 Supplementary Problems -- References -- Chapter 9 Microwave Small‐Signal Amplifiers -- 9.1 Introduction -- 9.2 Conditions for Matching -- 9.3 Distributed (Microstrip) Matching Networks -- 9.4 DC Biasing Circuits -- 9.5 Microwave Transistor Packages -- 9.6 Typical Hybrid Amplifier -- 9.7 DC Finger Breaks -- 9.8 Constant Gain Circles -- 9.9 Stability Circles -- 9.10 Noise Circles -- 9.11 Low‐Noise Amplifier Design -- 9.12 Simultaneous Conjugate Match -- 9.13 Broadband Matching -- 9.14 Summary -- 9.15 Supplementary Problems -- References -- Chapter 10 Switches and Phase Shifters -- 10.1 Introduction -- 10.2 Switches -- 10.2.1 PIN Diodes -- 10.2.2 Field Effect Transistors -- 10.2.3 Microelectromechanical Systems -- 10.2.4 Inline Phase Change Switch Devices -- 10.3 Digital Phase Shifters -- 10.3.1 Switched‐Path Phase Shifter -- 10.3.2 Loaded‐Line Phase Shifter -- 10.3.3 Reflection‐Type Phase Shifter -- 10.3.4 Schiffman 90° Phase Shifter. 10.3.5 Single‐Switch Phase Shifter -- 10.4 Supplementary Problems -- References -- Chapter 11 Oscillators -- 11.1 Introduction -- 11.2 Criteria for Oscillation in a Feedback Circuit -- 11.3 RF (Transistor) Oscillators -- 11.3.1 Colpitts Oscillator -- 11.3.2 Hartley Oscillator -- 11.3.3 Clapp-Gouriet Oscillator -- 11.4 Voltage‐Controlled Oscillator -- 11.5 Crystal‐Controlled Oscillators -- 11.5.1 Crystals -- 11.5.2 Crystal‐Controlled Oscillators -- 11.6 Frequency Synthesizers -- 11.6.1 The Phase‐Locked Loop -- 11.6.1.1 Principle of a Phase‐Locked Loop -- 11.6.1.2 Main Components of a Phase‐Locked Loop -- 11.6.1.3 Gain of Phase‐Locked Loop -- 11.6.1.4 Transient Analysis of a Phase‐Locked Loop -- 11.6.2 Indirect Frequency Synthesizer Circuits -- 11.7 Microwave Oscillators -- 11.7.1 Dielectric Resonator Oscillator -- 11.7.2 Delay‐Line Stabilized Microwave Oscillators -- 11.7.3 Diode Oscillators -- 11.7.3.1 Gunn Diode Oscillator -- 11.7.3.2 IMPATT Diode Oscillator -- 11.8 Oscillator Noise -- 11.9 Measurement of Oscillator Noise -- 11.10 Supplementary Problems -- References -- Chapter 12 RF and Microwave Antennas -- 12.1 Introduction -- 12.2 Antenna Parameters -- 12.3 Spherical Polar Coordinates -- 12.4 Radiation from a Hertzian Dipole -- 12.4.1 Basic Principles -- 12.4.2 Gain of a Hertzian Dipole -- 12.5 Radiation from a Half‐Wave Dipole -- 12.5.1 Basic Principles -- 12.5.2 Gain of a Half‐Wave Dipole -- 12.5.3 Summary of the Properties of a Half‐Wave Dipole -- 12.6 Antenna Arrays -- 12.7 Mutual Impedance -- 12.8 Arrays Containing Parasitic Elements -- 12.9 Yagi-Uda Antenna -- 12.10 Log‐Periodic Array -- 12.11 Loop Antenna -- 12.12 Planar Antennas -- 12.12.1 Linearly Polarized A linearly polarized antenna is one where the direction of the radiated electric field remains fixed as the wave propagates. Patch Antennas. 12.12.2 Circularly Polarized Planar Antennas. |
| Record Nr. | UNINA-9910829851603321 |
Free Charles E.
|
||
| Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Chris Bowick
| RF circuit design [[electronic resource] /] / Chris Bowick |
| Autore | Bowick Chris |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Amsterdam ; ; London, : Newnes, 2008 |
| Descrizione fisica | 1 online resource (256 p.) |
| Disciplina | 621.38412 |
| Soggetto topico |
Radio circuits - Design and construction
Radio frequency |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-281-06011-9
9786611060114 0-08-055342-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FRONT COVER; RF CIRCUIT DESIGN; COPYRIGHT PAGE; CONTENTS; PREFACE; ACKNOWLEDGMENTS; CHAPTER 1 Components and Systems; Wire; Resistors; Capacitors; Inductors; Toroids; Toroidal Inductor Design; Practical Winding Hints; CHAPTER 2 Resonant Circuits; Some Definitions; Resonance (Lossless Components); Loaded Q; Insertion Loss; Impedance Transformation; Coupling of Resonant Circuits; Summary; CHAPTER 3 Filter Design; Background; Modern Filter Design; Normalization and the Low-Pass Prototype; Filter Types; Frequency and Impedance Scaling; High-Pass Filter Design; The Dual Network
Bandpass Filter DesignSummary of the Bandpass Filter Design Procedure; Band-Rejection Filter Design; The Effects of Finite Q; CHAPTER 4 Impedance Matching; Background; The L Network; Dealing With Complex Loads; Three-Element Matching; Low-Q or Wideband Matching Networks; The Smith Chart; Impedance Matching on the Smith Chart; Software Design Tools; Summary; CHAPTER 5 The Transistor at Radio Frequencies; RF Transistor Materials; The Transistor Equivalent Circuit; Y Parameters; S Parameters; Understanding RF Transistor Data Sheets; Summary; CHAPTER 6 Small-Signal RF Amplifier Design Some DefinitionsTransistor Biasing; Design Using Y Parameters; Design Using S Parameters; CHAPTER 7 RF (Large Signal) Power Amplifiers; RF Power Transistor Characteristics; Transistor Biasing; RF Semiconductor Devices; Power Amplifier Design; Matching to Coaxial Feedlines; Automatic Shutdown Circuitry; Broadband Transformers; Practical Winding Hints; Summary; CHAPTER 8 RF Front-End Design; Higher Levels of Integration; Basic Receiver Architectures; ADC'S Effect on Front-End Design; Software Defined Radios; Case Study-Modern Communication Receiver; CHAPTER 9 RF Design Tools; Design Tool Basics Design LanguagesRFIC Design Flow; RFIC Design Flow Example; Simulation Example 1; Simulation Example 2; Modeling; PCB Design; Packaging; Case Study; Summary; APPENDIX A; APPENDIX B; BIBLIOGRAPHY; INDEX; A; B; C; D; E; F; G; H; I; K; L; M; N; O; P; Q; R; S; T; U; V; W; Y |
| Record Nr. | UNINA-9910458633503321 |
|
Bowick Chris
|
||
| Amsterdam ; ; London, : Newnes, 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Chris Bowick
| RF circuit design [[electronic resource] /] / Chris Bowick |
| Autore | Bowick Chris |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Amsterdam ; ; London, : Newnes, 2008 |
| Descrizione fisica | 1 online resource (256 p.) |
| Disciplina | 621.38412 |
| Altri autori (Persone) |
BlylerJohn
AjluniCheryl J |
| Soggetto topico |
Radio circuits - Design and construction
Radio frequency |
| ISBN |
1-281-06011-9
9786611060114 0-08-055342-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FRONT COVER; RF CIRCUIT DESIGN; COPYRIGHT PAGE; CONTENTS; PREFACE; ACKNOWLEDGMENTS; CHAPTER 1 Components and Systems; Wire; Resistors; Capacitors; Inductors; Toroids; Toroidal Inductor Design; Practical Winding Hints; CHAPTER 2 Resonant Circuits; Some Definitions; Resonance (Lossless Components); Loaded Q; Insertion Loss; Impedance Transformation; Coupling of Resonant Circuits; Summary; CHAPTER 3 Filter Design; Background; Modern Filter Design; Normalization and the Low-Pass Prototype; Filter Types; Frequency and Impedance Scaling; High-Pass Filter Design; The Dual Network
Bandpass Filter DesignSummary of the Bandpass Filter Design Procedure; Band-Rejection Filter Design; The Effects of Finite Q; CHAPTER 4 Impedance Matching; Background; The L Network; Dealing With Complex Loads; Three-Element Matching; Low-Q or Wideband Matching Networks; The Smith Chart; Impedance Matching on the Smith Chart; Software Design Tools; Summary; CHAPTER 5 The Transistor at Radio Frequencies; RF Transistor Materials; The Transistor Equivalent Circuit; Y Parameters; S Parameters; Understanding RF Transistor Data Sheets; Summary; CHAPTER 6 Small-Signal RF Amplifier Design Some DefinitionsTransistor Biasing; Design Using Y Parameters; Design Using S Parameters; CHAPTER 7 RF (Large Signal) Power Amplifiers; RF Power Transistor Characteristics; Transistor Biasing; RF Semiconductor Devices; Power Amplifier Design; Matching to Coaxial Feedlines; Automatic Shutdown Circuitry; Broadband Transformers; Practical Winding Hints; Summary; CHAPTER 8 RF Front-End Design; Higher Levels of Integration; Basic Receiver Architectures; ADC'S Effect on Front-End Design; Software Defined Radios; Case Study-Modern Communication Receiver; CHAPTER 9 RF Design Tools; Design Tool Basics Design LanguagesRFIC Design Flow; RFIC Design Flow Example; Simulation Example 1; Simulation Example 2; Modeling; PCB Design; Packaging; Case Study; Summary; APPENDIX A; APPENDIX B; BIBLIOGRAPHY; INDEX; A; B; C; D; E; F; G; H; I; K; L; M; N; O; P; Q; R; S; T; U; V; W; Y |
| Record Nr. | UNINA-9910784741703321 |
|
Bowick Chris
|
||
| Amsterdam ; ; London, : Newnes, 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Chris Bowick
| RF circuit design [[electronic resource] /] / Chris Bowick |
| Autore | Bowick Chris |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Amsterdam ; ; London, : Newnes, 2008 |
| Descrizione fisica | 1 online resource (256 p.) |
| Disciplina | 621.38412 |
| Altri autori (Persone) |
BlylerJohn
AjluniCheryl J |
| Soggetto topico |
Radio circuits - Design and construction
Radio frequency |
| ISBN |
1-281-06011-9
9786611060114 0-08-055342-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FRONT COVER; RF CIRCUIT DESIGN; COPYRIGHT PAGE; CONTENTS; PREFACE; ACKNOWLEDGMENTS; CHAPTER 1 Components and Systems; Wire; Resistors; Capacitors; Inductors; Toroids; Toroidal Inductor Design; Practical Winding Hints; CHAPTER 2 Resonant Circuits; Some Definitions; Resonance (Lossless Components); Loaded Q; Insertion Loss; Impedance Transformation; Coupling of Resonant Circuits; Summary; CHAPTER 3 Filter Design; Background; Modern Filter Design; Normalization and the Low-Pass Prototype; Filter Types; Frequency and Impedance Scaling; High-Pass Filter Design; The Dual Network
Bandpass Filter DesignSummary of the Bandpass Filter Design Procedure; Band-Rejection Filter Design; The Effects of Finite Q; CHAPTER 4 Impedance Matching; Background; The L Network; Dealing With Complex Loads; Three-Element Matching; Low-Q or Wideband Matching Networks; The Smith Chart; Impedance Matching on the Smith Chart; Software Design Tools; Summary; CHAPTER 5 The Transistor at Radio Frequencies; RF Transistor Materials; The Transistor Equivalent Circuit; Y Parameters; S Parameters; Understanding RF Transistor Data Sheets; Summary; CHAPTER 6 Small-Signal RF Amplifier Design Some DefinitionsTransistor Biasing; Design Using Y Parameters; Design Using S Parameters; CHAPTER 7 RF (Large Signal) Power Amplifiers; RF Power Transistor Characteristics; Transistor Biasing; RF Semiconductor Devices; Power Amplifier Design; Matching to Coaxial Feedlines; Automatic Shutdown Circuitry; Broadband Transformers; Practical Winding Hints; Summary; CHAPTER 8 RF Front-End Design; Higher Levels of Integration; Basic Receiver Architectures; ADC'S Effect on Front-End Design; Software Defined Radios; Case Study-Modern Communication Receiver; CHAPTER 9 RF Design Tools; Design Tool Basics Design LanguagesRFIC Design Flow; RFIC Design Flow Example; Simulation Example 1; Simulation Example 2; Modeling; PCB Design; Packaging; Case Study; Summary; APPENDIX A; APPENDIX B; BIBLIOGRAPHY; INDEX; A; B; C; D; E; F; G; H; I; K; L; M; N; O; P; Q; R; S; T; U; V; W; Y |
| Record Nr. | UNINA-9910808704003321 |
|
Bowick Chris
|
||
| Amsterdam ; ; London, : Newnes, 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
| RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li |
| Autore | Li Richard Chi-Hsi <1938-> |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012 |
| Descrizione fisica | 1 online resource (862 p.) |
| Disciplina | 621.384/12 |
| Collana | Wiley series on information and communication technology series |
| Soggetto topico |
Electronic circuit design
Radio circuits - Design and construction Radio frequency |
| ISBN |
1-283-59887-6
9786613911322 1-118-30990-1 1-118-30991-X 1-118-30994-4 |
| Classificazione | TEC007000 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RF CIRCUIT DESIGN; CONTENTS; PREFACE TO THE SECOND EDITION; PART 1 DESIGN TECHNOLOGIES AND SKILLS; 1 DIFFERENCE BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 1.1 Controversy; 1.1.1 Impedance Matching; 1.1.2 Key Parameter; 1.1.3 Circuit Testing and Main Test Equipment; 1.2 Difference of RF and Digital Block in a Communication System; 1.2.1 Impedance; 1.2.2 Current Drain; 1.2.3 Location; 1.3 Conclusions; 1.4 Notes for High-Speed Digital Circuit Design; Further Reading; Exercises; Answers; 2 REFLECTION AND SELF-INTERFERENCE; 2.1 Introduction; 2.2 Voltage Delivered from a Source to a Load
2.2.1 General Expression of Voltage Delivered from a Source to a Load when << y/4 so that Td 02.2.2 Additional Jitter or Distortion in a Digital Circuit Block; 2.3 Power Delivered from a Source to a Load; 2.3.1 General Expression of Power Delivered from a Source to a Load when << y/4 so that Td 0; 2.3.2 Power Instability; 2.3.3 Additional Power Loss; 2.3.4 Additional Distortion; 2.3.5 Additional Interference; 2.4 Impedance Conjugate Matching; 2.4.1 Maximizing Power Transport; 2.4.2 Power Transport without Phase Shift; 2.4.3 Impedance Matching Network; 2.4.4 Necessity of Impedance Matching 2.5 Additional Effect of Impedance Matching2.5.1 Voltage Pumped up by Means of Impedance Matching; 2.5.2 Power Measurement; Appendices; 2.A.1 VSWR and Other Reflection and Transmission Coefficients; 2.A.2 Relationships between Power (dBm), Voltage (V), and Power (W); Reference; Further Reading; Exercises; Answers; 3 IMPEDANCE MATCHING IN THE NARROW-BAND CASE; 3.1 Introduction; 3.2 Impedance Matching by Means of Return Loss Adjustment; 3.2.1 Return Loss Circles on the Smith Chart; 3.2.2 Relationship between Return Loss and Impedance Matching 3.2.3 Implementation of an Impedance Matching Network3.3 Impedance Matching Network Built by One Part; 3.3.1 One Part Inserted into Impedance Matching Network in Series; 3.3.2 One Part Inserted into the Impedance Matching Network in Parallel; 3.4 Impedance Matching Network Built by Two Parts; 3.4.1 Regions in a Smith Chart; 3.4.2 Values of Parts; 3.4.3 Selection of Topology; 3.5 Impedance Matching Network Built By Three Parts; 3.5.1 """" Type and ""T"" Type Topologies; 3.5.2 Recommended Topology; 3.6 Impedance Matching When ZS Or ZL Is Not 50 _; 3.7 Parts In An Impedance Matching Network Appendices3.A.1 Fundamentals of the Smith Chart; 3.A.2 Formula for Two-Part Impedance Matching Network; 3.A.3 Topology Limitations of the Two-Part Impedance Matching Network; 3.A.4 Topology Limitation of Three Parts Impedance Matching Network; 3.A.5 Conversion between _ and T Type Matching Network; 3.A.6 Possible _ and T Impedance Matching Networks; Reference; Further Reading; Exercises; Answers; 4 IMPEDANCE MATCHING IN THE WIDEBAND CASE; 4.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart; 4.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch 4.2.1 An Inductor Inserted into Impedance Matching Network in Series |
| Record Nr. | UNINA-9910137610603321 |
|
Li Richard Chi-Hsi <1938->
|
||
| Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
| RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li |
| Autore | Li Richard Chi-Hsi <1938-> |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012 |
| Descrizione fisica | 1 online resource (862 p.) |
| Disciplina | 621.384/12 |
| Collana | Wiley series on information and communication technology series |
| Soggetto topico |
Electronic circuit design
Radio circuits - Design and construction Radio frequency |
| ISBN |
1-283-59887-6
9786613911322 1-118-30990-1 1-118-30991-X 1-118-30994-4 |
| Classificazione | TEC007000 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RF CIRCUIT DESIGN; CONTENTS; PREFACE TO THE SECOND EDITION; PART 1 DESIGN TECHNOLOGIES AND SKILLS; 1 DIFFERENCE BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 1.1 Controversy; 1.1.1 Impedance Matching; 1.1.2 Key Parameter; 1.1.3 Circuit Testing and Main Test Equipment; 1.2 Difference of RF and Digital Block in a Communication System; 1.2.1 Impedance; 1.2.2 Current Drain; 1.2.3 Location; 1.3 Conclusions; 1.4 Notes for High-Speed Digital Circuit Design; Further Reading; Exercises; Answers; 2 REFLECTION AND SELF-INTERFERENCE; 2.1 Introduction; 2.2 Voltage Delivered from a Source to a Load
2.2.1 General Expression of Voltage Delivered from a Source to a Load when << y/4 so that Td 02.2.2 Additional Jitter or Distortion in a Digital Circuit Block; 2.3 Power Delivered from a Source to a Load; 2.3.1 General Expression of Power Delivered from a Source to a Load when << y/4 so that Td 0; 2.3.2 Power Instability; 2.3.3 Additional Power Loss; 2.3.4 Additional Distortion; 2.3.5 Additional Interference; 2.4 Impedance Conjugate Matching; 2.4.1 Maximizing Power Transport; 2.4.2 Power Transport without Phase Shift; 2.4.3 Impedance Matching Network; 2.4.4 Necessity of Impedance Matching 2.5 Additional Effect of Impedance Matching2.5.1 Voltage Pumped up by Means of Impedance Matching; 2.5.2 Power Measurement; Appendices; 2.A.1 VSWR and Other Reflection and Transmission Coefficients; 2.A.2 Relationships between Power (dBm), Voltage (V), and Power (W); Reference; Further Reading; Exercises; Answers; 3 IMPEDANCE MATCHING IN THE NARROW-BAND CASE; 3.1 Introduction; 3.2 Impedance Matching by Means of Return Loss Adjustment; 3.2.1 Return Loss Circles on the Smith Chart; 3.2.2 Relationship between Return Loss and Impedance Matching 3.2.3 Implementation of an Impedance Matching Network3.3 Impedance Matching Network Built by One Part; 3.3.1 One Part Inserted into Impedance Matching Network in Series; 3.3.2 One Part Inserted into the Impedance Matching Network in Parallel; 3.4 Impedance Matching Network Built by Two Parts; 3.4.1 Regions in a Smith Chart; 3.4.2 Values of Parts; 3.4.3 Selection of Topology; 3.5 Impedance Matching Network Built By Three Parts; 3.5.1 """" Type and ""T"" Type Topologies; 3.5.2 Recommended Topology; 3.6 Impedance Matching When ZS Or ZL Is Not 50 _; 3.7 Parts In An Impedance Matching Network Appendices3.A.1 Fundamentals of the Smith Chart; 3.A.2 Formula for Two-Part Impedance Matching Network; 3.A.3 Topology Limitations of the Two-Part Impedance Matching Network; 3.A.4 Topology Limitation of Three Parts Impedance Matching Network; 3.A.5 Conversion between _ and T Type Matching Network; 3.A.6 Possible _ and T Impedance Matching Networks; Reference; Further Reading; Exercises; Answers; 4 IMPEDANCE MATCHING IN THE WIDEBAND CASE; 4.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart; 4.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch 4.2.1 An Inductor Inserted into Impedance Matching Network in Series |
| Record Nr. | UNINA-9910812926803321 |
|
Li Richard Chi-Hsi <1938->
|
||
| Hoboken, New Jersey, : John Wiley & Sons, Inc., c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
| RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li |
| Autore | Li Richard Chi-Hsi <1938-> |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, c2009 |
| Descrizione fisica | 1 online resource (843 p.) |
| Disciplina |
621.384/12
621.38412 |
| Collana | Wiley series on information and communication technologies |
| Soggetto topico |
Radio circuits - Design and construction
Electronic circuit design Radio frequency |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-281-93857-2
9786611938574 0-470-40575-9 0-470-40572-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RF CIRCUIT DESIGN; CONTENTS; PREFACE; PART I INDIVIDUAL RF BLOCKS; 1 LNA (LOW NOISE AMPLIFIER); 1.1 Introduction; 1.2 Single-Ended Single Device LNA; 1.3 Single-Ended Cascode LNA; 1.4 LNA with AGC (Automatic Gain Control); References; 2 MIXERS; 2.1 Introduction; 2.2 Passive Mixers; 2.3 Active Mixers; 2.4 Design Schemes; Appendices; References; 3 DIFFERENTIAL PAIRS; 3.1 Why Differential Pairs?; 3.2 Can DC Offset be Blocked by a Capacitor?; 3.3 Fundamentals of Differential Pairs; 3.4 CMRR (Common Mode Rejection Ratio); Appendices; References; 4 RF BALUN; 4.1 Introduction; 4.2 Transformer Baluns
4.3 LC Baluns4.4 Micro Strip Line Baluns; 4.5 Mixed Types of Baluns; Appendices; References; 5 TUNABLE FILTERS; 5.1 Tunable Filters in Communication Systems; 5.2 Coupling Between Two Tank Circuits; 5.3 Circuit Description; 5.4 Effect of Second Coupling; 5.5 Performance; References; 6 VCO (VOLTAGE-CONTROLLED OSCILLATOR); 6.1 "Three-Point" Type Oscillators; 6.2 Other Single-Ended Oscillators; 6.3 VCO and PLL; 6.4 Design Example of a Single-Ended VCO; 6.5 Differential VCO and Quad Phases VCO; References; 7 POWER AMPLIFIERS (PA); 7.1 Classifications of Power Amplifiers; 7.2 Single-Ended PA Design 7.3 Single-Ended PA-IC Design7.4 Push-Pull PA Design; 7.5 PA with Temperature Compensation; 7.6 PA with Output Power Control; 7.7 Linear PA; References; PART II DESIGN TECHNOLOGIES AND SCHEMES; 8 DIFFERENT METHODOLOGY BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 8.1 Controversy; 8.2 Differences between RF and Digital Blocks in a Communication System; 8.3 Conclusion; 8.4 Notes for High-Speed Digital Circuit Design; References; 9 VOLTAGE AND POWER TRANSPORTATION; 9.1 Voltage Delivered from a Source to a Load; 9.2 Power Delivered from a Source to a Load; 9.3 Impedance Conjugate Matching 9.4 Additional Effects of Impedance MatchingAppendices; References; 10 IMPEDANCE MATCHING IN NARROW-BAND CASE; 10.1 Introduction; 10.2 Impedance Matching by Means of Return Loss Adjustment; 10.3 Impedance Matching Network Built of One Part; 10.4 Impedance Matching Network Built of Two Parts; 10.5 Impedance Matching Network Built of Three Parts; 10.6 Impedance Matching When Z(S) or Z(L) Is Not 50 Ω; 10.7 Parts in an Impedance Matching Network; Appendices; References; 11 IMPEDANCE MATCHING IN A WIDE-BAND CASE; 11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart 11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch; 11.4 Impedance Matching in IQ Modulator Design for a UWB System; 11.5 Discussion of Wide-band Impedance Matching Networks; References; 12 IMPEDANCE AND GAIN OF A RAW DEVICE; 12.1 Introduction; 12.2 Miller Effect; 12.3 Small Signal Model of a Bipolar Transistor; 12.4 Bipolar Transistor with CE (Common Emitter) Configuration; 12.5 Bipolar Transistor with CB (Common Base) Configuration 12.6 Bipolar Transistor with CC (Common Collector) Configuration |
| Record Nr. | UNINA-9910144094003321 |
|
Li Richard Chi-Hsi <1938->
|
||
| Hoboken, N.J., : Wiley, c2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
| RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li |
| Autore | Li Richard Chi-Hsi <1938-> |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, c2009 |
| Descrizione fisica | 1 online resource (843 p.) |
| Disciplina |
621.384/12
621.38412 |
| Collana | Wiley series on information and communication technologies |
| Soggetto topico |
Radio circuits - Design and construction
Electronic circuit design Radio frequency |
| ISBN |
1-281-93857-2
9786611938574 0-470-40575-9 0-470-40572-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RF CIRCUIT DESIGN; CONTENTS; PREFACE; PART I INDIVIDUAL RF BLOCKS; 1 LNA (LOW NOISE AMPLIFIER); 1.1 Introduction; 1.2 Single-Ended Single Device LNA; 1.3 Single-Ended Cascode LNA; 1.4 LNA with AGC (Automatic Gain Control); References; 2 MIXERS; 2.1 Introduction; 2.2 Passive Mixers; 2.3 Active Mixers; 2.4 Design Schemes; Appendices; References; 3 DIFFERENTIAL PAIRS; 3.1 Why Differential Pairs?; 3.2 Can DC Offset be Blocked by a Capacitor?; 3.3 Fundamentals of Differential Pairs; 3.4 CMRR (Common Mode Rejection Ratio); Appendices; References; 4 RF BALUN; 4.1 Introduction; 4.2 Transformer Baluns
4.3 LC Baluns4.4 Micro Strip Line Baluns; 4.5 Mixed Types of Baluns; Appendices; References; 5 TUNABLE FILTERS; 5.1 Tunable Filters in Communication Systems; 5.2 Coupling Between Two Tank Circuits; 5.3 Circuit Description; 5.4 Effect of Second Coupling; 5.5 Performance; References; 6 VCO (VOLTAGE-CONTROLLED OSCILLATOR); 6.1 "Three-Point" Type Oscillators; 6.2 Other Single-Ended Oscillators; 6.3 VCO and PLL; 6.4 Design Example of a Single-Ended VCO; 6.5 Differential VCO and Quad Phases VCO; References; 7 POWER AMPLIFIERS (PA); 7.1 Classifications of Power Amplifiers; 7.2 Single-Ended PA Design 7.3 Single-Ended PA-IC Design7.4 Push-Pull PA Design; 7.5 PA with Temperature Compensation; 7.6 PA with Output Power Control; 7.7 Linear PA; References; PART II DESIGN TECHNOLOGIES AND SCHEMES; 8 DIFFERENT METHODOLOGY BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 8.1 Controversy; 8.2 Differences between RF and Digital Blocks in a Communication System; 8.3 Conclusion; 8.4 Notes for High-Speed Digital Circuit Design; References; 9 VOLTAGE AND POWER TRANSPORTATION; 9.1 Voltage Delivered from a Source to a Load; 9.2 Power Delivered from a Source to a Load; 9.3 Impedance Conjugate Matching 9.4 Additional Effects of Impedance MatchingAppendices; References; 10 IMPEDANCE MATCHING IN NARROW-BAND CASE; 10.1 Introduction; 10.2 Impedance Matching by Means of Return Loss Adjustment; 10.3 Impedance Matching Network Built of One Part; 10.4 Impedance Matching Network Built of Two Parts; 10.5 Impedance Matching Network Built of Three Parts; 10.6 Impedance Matching When Z(S) or Z(L) Is Not 50 Ω; 10.7 Parts in an Impedance Matching Network; Appendices; References; 11 IMPEDANCE MATCHING IN A WIDE-BAND CASE; 11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart 11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch; 11.4 Impedance Matching in IQ Modulator Design for a UWB System; 11.5 Discussion of Wide-band Impedance Matching Networks; References; 12 IMPEDANCE AND GAIN OF A RAW DEVICE; 12.1 Introduction; 12.2 Miller Effect; 12.3 Small Signal Model of a Bipolar Transistor; 12.4 Bipolar Transistor with CE (Common Emitter) Configuration; 12.5 Bipolar Transistor with CB (Common Base) Configuration 12.6 Bipolar Transistor with CC (Common Collector) Configuration |
| Record Nr. | UNINA-9910829931703321 |
|
Li Richard Chi-Hsi <1938->
|
||
| Hoboken, N.J., : Wiley, c2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li
| RF circuit design [[electronic resource] /] / Richard Chi-Hsi Li |
| Autore | Li Richard Chi-Hsi <1938-> |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, c2009 |
| Descrizione fisica | 1 online resource (843 p.) |
| Disciplina |
621.384/12
621.38412 |
| Collana | Wiley series on information and communication technologies |
| Soggetto topico |
Radio circuits - Design and construction
Electronic circuit design Radio frequency |
| ISBN |
1-281-93857-2
9786611938574 0-470-40575-9 0-470-40572-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
RF CIRCUIT DESIGN; CONTENTS; PREFACE; PART I INDIVIDUAL RF BLOCKS; 1 LNA (LOW NOISE AMPLIFIER); 1.1 Introduction; 1.2 Single-Ended Single Device LNA; 1.3 Single-Ended Cascode LNA; 1.4 LNA with AGC (Automatic Gain Control); References; 2 MIXERS; 2.1 Introduction; 2.2 Passive Mixers; 2.3 Active Mixers; 2.4 Design Schemes; Appendices; References; 3 DIFFERENTIAL PAIRS; 3.1 Why Differential Pairs?; 3.2 Can DC Offset be Blocked by a Capacitor?; 3.3 Fundamentals of Differential Pairs; 3.4 CMRR (Common Mode Rejection Ratio); Appendices; References; 4 RF BALUN; 4.1 Introduction; 4.2 Transformer Baluns
4.3 LC Baluns4.4 Micro Strip Line Baluns; 4.5 Mixed Types of Baluns; Appendices; References; 5 TUNABLE FILTERS; 5.1 Tunable Filters in Communication Systems; 5.2 Coupling Between Two Tank Circuits; 5.3 Circuit Description; 5.4 Effect of Second Coupling; 5.5 Performance; References; 6 VCO (VOLTAGE-CONTROLLED OSCILLATOR); 6.1 "Three-Point" Type Oscillators; 6.2 Other Single-Ended Oscillators; 6.3 VCO and PLL; 6.4 Design Example of a Single-Ended VCO; 6.5 Differential VCO and Quad Phases VCO; References; 7 POWER AMPLIFIERS (PA); 7.1 Classifications of Power Amplifiers; 7.2 Single-Ended PA Design 7.3 Single-Ended PA-IC Design7.4 Push-Pull PA Design; 7.5 PA with Temperature Compensation; 7.6 PA with Output Power Control; 7.7 Linear PA; References; PART II DESIGN TECHNOLOGIES AND SCHEMES; 8 DIFFERENT METHODOLOGY BETWEEN RF AND DIGITAL CIRCUIT DESIGN; 8.1 Controversy; 8.2 Differences between RF and Digital Blocks in a Communication System; 8.3 Conclusion; 8.4 Notes for High-Speed Digital Circuit Design; References; 9 VOLTAGE AND POWER TRANSPORTATION; 9.1 Voltage Delivered from a Source to a Load; 9.2 Power Delivered from a Source to a Load; 9.3 Impedance Conjugate Matching 9.4 Additional Effects of Impedance MatchingAppendices; References; 10 IMPEDANCE MATCHING IN NARROW-BAND CASE; 10.1 Introduction; 10.2 Impedance Matching by Means of Return Loss Adjustment; 10.3 Impedance Matching Network Built of One Part; 10.4 Impedance Matching Network Built of Two Parts; 10.5 Impedance Matching Network Built of Three Parts; 10.6 Impedance Matching When Z(S) or Z(L) Is Not 50 Ω; 10.7 Parts in an Impedance Matching Network; Appendices; References; 11 IMPEDANCE MATCHING IN A WIDE-BAND CASE; 11.1 Appearance of Narrow- and Wide-Band Return Loss on a Smith Chart 11.2 Impedance Variation Due to Insertion of One Part per Arm or per Branch11.3 Impedance Variation Due to the Insertion of Two Parts per Arm or per Branch; 11.4 Impedance Matching in IQ Modulator Design for a UWB System; 11.5 Discussion of Wide-band Impedance Matching Networks; References; 12 IMPEDANCE AND GAIN OF A RAW DEVICE; 12.1 Introduction; 12.2 Miller Effect; 12.3 Small Signal Model of a Bipolar Transistor; 12.4 Bipolar Transistor with CE (Common Emitter) Configuration; 12.5 Bipolar Transistor with CB (Common Base) Configuration 12.6 Bipolar Transistor with CC (Common Collector) Configuration |
| Record Nr. | UNINA-9910841720803321 |
|
Li Richard Chi-Hsi <1938->
|
||
| Hoboken, N.J., : Wiley, c2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
SiRF : 2019 IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems : 20-23 January 2019, Orlando, FL, USA / / Institute of Electrical and Electronics Engineers
| SiRF : 2019 IEEE 19th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems : 20-23 January 2019, Orlando, FL, USA / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica | 1 online resource (88 pages) |
| Disciplina | 621.38412 |
| Soggetto topico |
Very high speed integrated circuits
Radio circuits - Design and construction |
| ISBN | 1-5386-5950-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910324055303321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
