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Integrated passive component technology / / edited by Richard K. Ulrich, Leonard W. Schaper
Integrated passive component technology / / edited by Richard K. Ulrich, Leonard W. Schaper
Pubbl/distr/stampa Piscataway, New Jersey : , : IEEE Press, , c2003
Descrizione fisica 1 PDF (xix, 379 pages) : illustrations
Disciplina 621.3815
Altri autori (Persone) SchaperLeonard W
UlrichRichard K <1955-> (Richard Kevin)
Soggetto topico Passive components
Integrated circuits - Design and construction
Printed circuits - Design and construction
Passive components - Design and construction
Printed circuits
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 0-471-72293-6
0-471-72292-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Characteristics and performance of planar resistors ; Integrated resistor materials and processes ; Dielectric materials for integrated capacitors ; Size and configuration of integrated capacitors ; Processing integrated capacitors ; Defects and yield issues / Richard K. Ulrich -- Electrical performance of integrated capacitors / Richard K. Ulrich, Leonard W. Schaper --
Record Nr. UNISA-996206412003316
Piscataway, New Jersey : , : IEEE Press, , c2003
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Integrated passive component technology / / edited by Richard K. Ulrich, Leonard W. Schaper
Integrated passive component technology / / edited by Richard K. Ulrich, Leonard W. Schaper
Pubbl/distr/stampa Piscataway, New Jersey : , : IEEE Press, , c2003
Descrizione fisica 1 PDF (xix, 379 pages) : illustrations
Disciplina 621.3815
Altri autori (Persone) SchaperLeonard W
UlrichRichard K <1955-> (Richard Kevin)
Soggetto topico Passive components
Integrated circuits - Design and construction
Printed circuits - Design and construction
Passive components - Design and construction
Printed circuits
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
ISBN 0-471-72293-6
0-471-72292-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Characteristics and performance of planar resistors ; Integrated resistor materials and processes ; Dielectric materials for integrated capacitors ; Size and configuration of integrated capacitors ; Processing integrated capacitors ; Defects and yield issues / Richard K. Ulrich -- Electrical performance of integrated capacitors / Richard K. Ulrich, Leonard W. Schaper --
Record Nr. UNINA-9910830915803321
Piscataway, New Jersey : , : IEEE Press, , c2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lumped elements for RF and microwave circuits / / Inder Bahl
Lumped elements for RF and microwave circuits / / Inder Bahl
Autore Bahl I. J.
Pubbl/distr/stampa Boston : , : Artech House, , ©2003
Descrizione fisica 1 online resource (508 p.)
Disciplina 621.381/32
Collana Artech House microwave library
Soggetto topico Lumped elements (Electronics)
Microwave integrated circuits
Radio frequency integrated circuits
Passive components
Soggetto genere / forma Electronic books.
ISBN 1-58053-661-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto V -- Preface xi -- Acknowledgments xv -- Part I: Cellular Networks xvii -- 1 Introduction 1 -- 1.1 Mobile Wireless Networks 5 -- 1.2 Cellular Networks 6 -- 1.3 Ad Hoc Wireless Networks 10 -- 1.4 Location Management 11 -- 1.5 Wireless Routing Techniques 13 -- 2 Mobility Issues 17 -- 2.1 Introduction 17 -- 2.2 Mobility Models 18 -- 2.3 Mobility in 3G Systems 26 -- 3 Radio Resource Management 31 -- 3.1 Radio Propagation 32 -- 3.2 Radio Resource (Spectrum Allocation) 37 -- 3.3 RRM 43 -- 3.4 Handoff Process 52 -- 3.5 Managing Resource Allocation 55 -- 3.6 Emerging RRM Techniques 60.
3.7 Integrated RRM 63 -- 3.8 Summary 65 -- 4 Location Management 69 -- 4.1 Location Update 71 -- 4.2 Paging 75 -- 4.3 Intelligent Paging Scheme 78 -- 4.4 More Paging Schemes 84 -- 4.5 Intersystem Paging 87 -- 4.6 IP Micromobility and Paging 88 -- 4.7 Location Management 89 -- 4.8 LA Planning 97 -- 4.9 Conclusion 109 -- Part II: Ad Hoc Wireless Networks 115 -- 5 Overview 117 -- 5.1 Characteristics of Ad Hoc Networks 117 -- 5.2 Three Fundamental Design Choices 118 -- 6 MAC Techniques in Ad Hoc Networks 125 -- 6.1 MAC Protocols with Omnidirectional Antennas 125.
6.2 MAC Protocols with Directional Antennas 128 -- 6.3 Discussions 132 -- 7 Routing Protocols in Ad Hoc Wireless Networks 135 -- 7.1 Introduction 135 -- 7.2 Unicast Routing Protocols in Ad Hoc Networks 138 -- 7.3 Multicast Routing Protocols in Ad Hoc Networks 165 -- 7.4 Performance Comparisons of Unicast and Multicast Routing Protocols 168 -- 7.5 Discussion 170 -- Part III: Future Issues 177 -- 8 Routing in Next-Generation Wireless Networks 179 -- 8.1 UMTS All-IP Networks 179 -- 8.2 Routing in Distributed Wireless Sensor Networks 182 -- 8.3 Pervasive Routing 186 -- 9 Conclusion 191.
List of Acronyms 195 -- About the Authors 203 -- Index 205.
Record Nr. UNINA-9910456242603321
Bahl I. J.  
Boston : , : Artech House, , ©2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lumped elements for RF and microwave circuits / / Inder Bahl
Lumped elements for RF and microwave circuits / / Inder Bahl
Autore Bahl I. J.
Pubbl/distr/stampa Boston : , : Artech House, , ©2003
Descrizione fisica 1 online resource (508 p.)
Disciplina 621.381/32
Collana Artech House microwave library
Soggetto topico Lumped elements (Electronics)
Microwave integrated circuits
Radio frequency integrated circuits
Passive components
ISBN 1-58053-661-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto V -- Preface xi -- Acknowledgments xv -- Part I: Cellular Networks xvii -- 1 Introduction 1 -- 1.1 Mobile Wireless Networks 5 -- 1.2 Cellular Networks 6 -- 1.3 Ad Hoc Wireless Networks 10 -- 1.4 Location Management 11 -- 1.5 Wireless Routing Techniques 13 -- 2 Mobility Issues 17 -- 2.1 Introduction 17 -- 2.2 Mobility Models 18 -- 2.3 Mobility in 3G Systems 26 -- 3 Radio Resource Management 31 -- 3.1 Radio Propagation 32 -- 3.2 Radio Resource (Spectrum Allocation) 37 -- 3.3 RRM 43 -- 3.4 Handoff Process 52 -- 3.5 Managing Resource Allocation 55 -- 3.6 Emerging RRM Techniques 60.
3.7 Integrated RRM 63 -- 3.8 Summary 65 -- 4 Location Management 69 -- 4.1 Location Update 71 -- 4.2 Paging 75 -- 4.3 Intelligent Paging Scheme 78 -- 4.4 More Paging Schemes 84 -- 4.5 Intersystem Paging 87 -- 4.6 IP Micromobility and Paging 88 -- 4.7 Location Management 89 -- 4.8 LA Planning 97 -- 4.9 Conclusion 109 -- Part II: Ad Hoc Wireless Networks 115 -- 5 Overview 117 -- 5.1 Characteristics of Ad Hoc Networks 117 -- 5.2 Three Fundamental Design Choices 118 -- 6 MAC Techniques in Ad Hoc Networks 125 -- 6.1 MAC Protocols with Omnidirectional Antennas 125.
6.2 MAC Protocols with Directional Antennas 128 -- 6.3 Discussions 132 -- 7 Routing Protocols in Ad Hoc Wireless Networks 135 -- 7.1 Introduction 135 -- 7.2 Unicast Routing Protocols in Ad Hoc Networks 138 -- 7.3 Multicast Routing Protocols in Ad Hoc Networks 165 -- 7.4 Performance Comparisons of Unicast and Multicast Routing Protocols 168 -- 7.5 Discussion 170 -- Part III: Future Issues 177 -- 8 Routing in Next-Generation Wireless Networks 179 -- 8.1 UMTS All-IP Networks 179 -- 8.2 Routing in Distributed Wireless Sensor Networks 182 -- 8.3 Pervasive Routing 186 -- 9 Conclusion 191.
List of Acronyms 195 -- About the Authors 203 -- Index 205.
Record Nr. UNINA-9910780483103321
Bahl I. J.  
Boston : , : Artech House, , ©2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Lumped elements for RF and microwave circuits / / Inder Bahl
Lumped elements for RF and microwave circuits / / Inder Bahl
Autore Bahl I. J.
Pubbl/distr/stampa Boston : , : Artech House, , ©2003
Descrizione fisica 1 online resource (508 p.)
Disciplina 621.381/32
Collana Artech House microwave library
Soggetto topico Lumped elements (Electronics)
Microwave integrated circuits
Radio frequency integrated circuits
Passive components
ISBN 1-58053-661-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto V -- Preface xi -- Acknowledgments xv -- Part I: Cellular Networks xvii -- 1 Introduction 1 -- 1.1 Mobile Wireless Networks 5 -- 1.2 Cellular Networks 6 -- 1.3 Ad Hoc Wireless Networks 10 -- 1.4 Location Management 11 -- 1.5 Wireless Routing Techniques 13 -- 2 Mobility Issues 17 -- 2.1 Introduction 17 -- 2.2 Mobility Models 18 -- 2.3 Mobility in 3G Systems 26 -- 3 Radio Resource Management 31 -- 3.1 Radio Propagation 32 -- 3.2 Radio Resource (Spectrum Allocation) 37 -- 3.3 RRM 43 -- 3.4 Handoff Process 52 -- 3.5 Managing Resource Allocation 55 -- 3.6 Emerging RRM Techniques 60.
3.7 Integrated RRM 63 -- 3.8 Summary 65 -- 4 Location Management 69 -- 4.1 Location Update 71 -- 4.2 Paging 75 -- 4.3 Intelligent Paging Scheme 78 -- 4.4 More Paging Schemes 84 -- 4.5 Intersystem Paging 87 -- 4.6 IP Micromobility and Paging 88 -- 4.7 Location Management 89 -- 4.8 LA Planning 97 -- 4.9 Conclusion 109 -- Part II: Ad Hoc Wireless Networks 115 -- 5 Overview 117 -- 5.1 Characteristics of Ad Hoc Networks 117 -- 5.2 Three Fundamental Design Choices 118 -- 6 MAC Techniques in Ad Hoc Networks 125 -- 6.1 MAC Protocols with Omnidirectional Antennas 125.
6.2 MAC Protocols with Directional Antennas 128 -- 6.3 Discussions 132 -- 7 Routing Protocols in Ad Hoc Wireless Networks 135 -- 7.1 Introduction 135 -- 7.2 Unicast Routing Protocols in Ad Hoc Networks 138 -- 7.3 Multicast Routing Protocols in Ad Hoc Networks 165 -- 7.4 Performance Comparisons of Unicast and Multicast Routing Protocols 168 -- 7.5 Discussion 170 -- Part III: Future Issues 177 -- 8 Routing in Next-Generation Wireless Networks 179 -- 8.1 UMTS All-IP Networks 179 -- 8.2 Routing in Distributed Wireless Sensor Networks 182 -- 8.3 Pervasive Routing 186 -- 9 Conclusion 191.
List of Acronyms 195 -- About the Authors 203 -- Index 205.
Record Nr. UNINA-9910810468603321
Bahl I. J.  
Boston : , : Artech House, , ©2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Passive RF Component Technology : Materials, Techniques, and Applications
Passive RF Component Technology : Materials, Techniques, and Applications
Autore Wang Guoan
Pubbl/distr/stampa Norwood : , : Artech House, , 2012
Descrizione fisica 1 online resource (305 p.)
Disciplina 621.3815
Altri autori (Persone) PanBo
Collana Artech House microwave library
Soggetto topico Passive components
Radio circuits
Wireless communication systems
Soggetto genere / forma Electronic books.
ISBN 1-60807-200-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Passive RF Component Technology Materials, Techniques, and Applications; List of Contributors; Contents; Chapter 1 Introduction; Chapter 2 Overview of RF Passives and Enabling Materials; 2.1 Passive Filters; 2.2 Combiners, Dividers, Hybrids, and Couplers; 2.3 Inductors, Transformers, and Baluns; 2.4 Antennas; 2.5 Summary; References; Chapter 3 Novel Flexible Material Liquid Crystal Polymer (LCP) Based Flexible Passives; 3.1 Introduction; 3.2 LCP Properties; 3.3 Multilayer LCP Process Development; 3.4 Design and Fabrication of LCP-based Tunable RF Passives; 3.4.1 Filters.
3.4.2 Monolithically Integrated RF MEMS3.4.3 Phase Shifters; 3.4.4 Antennas; 3.4.5 Antenna Arrays; 3.5 LCP for 3D Integration and Packaging; 3.6 Summary; References; Chapter 4 Ferroelectric-based Tunable RF Capacitor; 4.1 Introduction; 4.2 BST Materials for RF Capacitors; 4.2.1 Structure and Properties; 4.2.2 Thin-film Tunable Capacitors; 4.3 Ferroelectric Capacitor with Low Tuning Voltage and High Linearity; 4.3.1 Architecture for Reduced Intermodulation Distortion in Ferroelectric RF Tunable Capacitors; 4.3.2 Analysis of the Capacitor with Low Tuning Voltage and High Linearity.
4.3.3 Device Implementation4.3.4 Characterization; 4.4 Low Conductor Loss Capacitor; 4.4.1 Low-loss Microelectrodes Fabricated Using Reverse-side Exposure; 4.4.2 Characterization of Low Conductor Loss Capacitors; 4.5 Embedded Ferroelectric Capacitor; 4.5.1 Multi-interdigitated BST Gap Capacitor; 4.6 Summary; 4.7 Future Prospects; References; Chapter 5 High Aspect Ratio RF Passives Enabled by Smart RF Materials and Polymer-core Conductor Micromachining Technologies; 5.1 Introduction; 5.1.1 Importance of the High-performance Passives with High-quality Factors.
5.1.2 Existing Approaches to Improve Performances of Millimeter Passives5.2 Properties of SU-8 Polymer; 5.3 The Introduction of Polymer-core Conductor Micromachining Technology; 5.3.1 Fabrication Flow; 5.3.2 Advantages of the Polymer-core Conductor Technology; 5.4 High-Q RF Inductors by This Approach; 5.5 High-performance Millimeter-wave Antennas Using the Polymer-core Conductor Approach; 5.5.1 A Millimeter-wave Monopole Antenna; 5.5.2 An Elevated Patch Antenna; 5.5.3 A Surface Micromachined Horn Antenna Using a Polymer-core Conductor.
5.6 High-aspect-ratio Micromachined Filters, Duplexer, and Coupler5.6.1 Micromachined Cavity Resonator; 5.6.2 SU-8-based Cavity Filters for 60-GHz Applications; 5.6.3 SU-8-based Surface Micromachined Cavity Duplexer; 5.6.4 SU-8-based Surface Micromachined Microstrip Edge Coupler; 5.7 Summary; References; Chapter 6 CNT-based Passive Circuits and Detectable Components; 6.1 Introduction; 6.2 CNT-based Transmission Line and Interconnect; 6.2.1 CNT-based Transmission Line; 6.2.2 CNT-based Interconnects; 6.3 CNT-based Flexible and Pattern-agile Antennas; 6.3.1 CNT-based Flexible Antenna.
Record Nr. UNINA-9910462897303321
Wang Guoan  
Norwood : , : Artech House, , 2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Passive RF Component Technology : Materials, Techniques, and Applications
Passive RF Component Technology : Materials, Techniques, and Applications
Autore Wang Guoan
Pubbl/distr/stampa Norwood : , : Artech House, , 2012
Descrizione fisica 1 online resource (305 p.)
Disciplina 621.3815
Altri autori (Persone) PanBo
Collana Artech House microwave library
Soggetto topico Passive components
Radio circuits
Wireless communication systems
ISBN 1-60807-200-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Passive RF Component Technology Materials, Techniques, and Applications; List of Contributors; Contents; Chapter 1 Introduction; Chapter 2 Overview of RF Passives and Enabling Materials; 2.1 Passive Filters; 2.2 Combiners, Dividers, Hybrids, and Couplers; 2.3 Inductors, Transformers, and Baluns; 2.4 Antennas; 2.5 Summary; References; Chapter 3 Novel Flexible Material Liquid Crystal Polymer (LCP) Based Flexible Passives; 3.1 Introduction; 3.2 LCP Properties; 3.3 Multilayer LCP Process Development; 3.4 Design and Fabrication of LCP-based Tunable RF Passives; 3.4.1 Filters.
3.4.2 Monolithically Integrated RF MEMS3.4.3 Phase Shifters; 3.4.4 Antennas; 3.4.5 Antenna Arrays; 3.5 LCP for 3D Integration and Packaging; 3.6 Summary; References; Chapter 4 Ferroelectric-based Tunable RF Capacitor; 4.1 Introduction; 4.2 BST Materials for RF Capacitors; 4.2.1 Structure and Properties; 4.2.2 Thin-film Tunable Capacitors; 4.3 Ferroelectric Capacitor with Low Tuning Voltage and High Linearity; 4.3.1 Architecture for Reduced Intermodulation Distortion in Ferroelectric RF Tunable Capacitors; 4.3.2 Analysis of the Capacitor with Low Tuning Voltage and High Linearity.
4.3.3 Device Implementation4.3.4 Characterization; 4.4 Low Conductor Loss Capacitor; 4.4.1 Low-loss Microelectrodes Fabricated Using Reverse-side Exposure; 4.4.2 Characterization of Low Conductor Loss Capacitors; 4.5 Embedded Ferroelectric Capacitor; 4.5.1 Multi-interdigitated BST Gap Capacitor; 4.6 Summary; 4.7 Future Prospects; References; Chapter 5 High Aspect Ratio RF Passives Enabled by Smart RF Materials and Polymer-core Conductor Micromachining Technologies; 5.1 Introduction; 5.1.1 Importance of the High-performance Passives with High-quality Factors.
5.1.2 Existing Approaches to Improve Performances of Millimeter Passives5.2 Properties of SU-8 Polymer; 5.3 The Introduction of Polymer-core Conductor Micromachining Technology; 5.3.1 Fabrication Flow; 5.3.2 Advantages of the Polymer-core Conductor Technology; 5.4 High-Q RF Inductors by This Approach; 5.5 High-performance Millimeter-wave Antennas Using the Polymer-core Conductor Approach; 5.5.1 A Millimeter-wave Monopole Antenna; 5.5.2 An Elevated Patch Antenna; 5.5.3 A Surface Micromachined Horn Antenna Using a Polymer-core Conductor.
5.6 High-aspect-ratio Micromachined Filters, Duplexer, and Coupler5.6.1 Micromachined Cavity Resonator; 5.6.2 SU-8-based Cavity Filters for 60-GHz Applications; 5.6.3 SU-8-based Surface Micromachined Cavity Duplexer; 5.6.4 SU-8-based Surface Micromachined Microstrip Edge Coupler; 5.7 Summary; References; Chapter 6 CNT-based Passive Circuits and Detectable Components; 6.1 Introduction; 6.2 CNT-based Transmission Line and Interconnect; 6.2.1 CNT-based Transmission Line; 6.2.2 CNT-based Interconnects; 6.3 CNT-based Flexible and Pattern-agile Antennas; 6.3.1 CNT-based Flexible Antenna.
Record Nr. UNINA-9910786249903321
Wang Guoan  
Norwood : , : Artech House, , 2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Passive RF Component Technology : Materials, Techniques, and Applications
Passive RF Component Technology : Materials, Techniques, and Applications
Autore Wang Guoan
Pubbl/distr/stampa Norwood : , : Artech House, , 2012
Descrizione fisica 1 online resource (305 p.)
Disciplina 621.3815
Altri autori (Persone) PanBo
Collana Artech House microwave library
Soggetto topico Passive components
Radio circuits
Wireless communication systems
ISBN 1-60807-200-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Passive RF Component Technology Materials, Techniques, and Applications; List of Contributors; Contents; Chapter 1 Introduction; Chapter 2 Overview of RF Passives and Enabling Materials; 2.1 Passive Filters; 2.2 Combiners, Dividers, Hybrids, and Couplers; 2.3 Inductors, Transformers, and Baluns; 2.4 Antennas; 2.5 Summary; References; Chapter 3 Novel Flexible Material Liquid Crystal Polymer (LCP) Based Flexible Passives; 3.1 Introduction; 3.2 LCP Properties; 3.3 Multilayer LCP Process Development; 3.4 Design and Fabrication of LCP-based Tunable RF Passives; 3.4.1 Filters.
3.4.2 Monolithically Integrated RF MEMS3.4.3 Phase Shifters; 3.4.4 Antennas; 3.4.5 Antenna Arrays; 3.5 LCP for 3D Integration and Packaging; 3.6 Summary; References; Chapter 4 Ferroelectric-based Tunable RF Capacitor; 4.1 Introduction; 4.2 BST Materials for RF Capacitors; 4.2.1 Structure and Properties; 4.2.2 Thin-film Tunable Capacitors; 4.3 Ferroelectric Capacitor with Low Tuning Voltage and High Linearity; 4.3.1 Architecture for Reduced Intermodulation Distortion in Ferroelectric RF Tunable Capacitors; 4.3.2 Analysis of the Capacitor with Low Tuning Voltage and High Linearity.
4.3.3 Device Implementation4.3.4 Characterization; 4.4 Low Conductor Loss Capacitor; 4.4.1 Low-loss Microelectrodes Fabricated Using Reverse-side Exposure; 4.4.2 Characterization of Low Conductor Loss Capacitors; 4.5 Embedded Ferroelectric Capacitor; 4.5.1 Multi-interdigitated BST Gap Capacitor; 4.6 Summary; 4.7 Future Prospects; References; Chapter 5 High Aspect Ratio RF Passives Enabled by Smart RF Materials and Polymer-core Conductor Micromachining Technologies; 5.1 Introduction; 5.1.1 Importance of the High-performance Passives with High-quality Factors.
5.1.2 Existing Approaches to Improve Performances of Millimeter Passives5.2 Properties of SU-8 Polymer; 5.3 The Introduction of Polymer-core Conductor Micromachining Technology; 5.3.1 Fabrication Flow; 5.3.2 Advantages of the Polymer-core Conductor Technology; 5.4 High-Q RF Inductors by This Approach; 5.5 High-performance Millimeter-wave Antennas Using the Polymer-core Conductor Approach; 5.5.1 A Millimeter-wave Monopole Antenna; 5.5.2 An Elevated Patch Antenna; 5.5.3 A Surface Micromachined Horn Antenna Using a Polymer-core Conductor.
5.6 High-aspect-ratio Micromachined Filters, Duplexer, and Coupler5.6.1 Micromachined Cavity Resonator; 5.6.2 SU-8-based Cavity Filters for 60-GHz Applications; 5.6.3 SU-8-based Surface Micromachined Cavity Duplexer; 5.6.4 SU-8-based Surface Micromachined Microstrip Edge Coupler; 5.7 Summary; References; Chapter 6 CNT-based Passive Circuits and Detectable Components; 6.1 Introduction; 6.2 CNT-based Transmission Line and Interconnect; 6.2.1 CNT-based Transmission Line; 6.2.2 CNT-based Interconnects; 6.3 CNT-based Flexible and Pattern-agile Antennas; 6.3.1 CNT-based Flexible Antenna.
Record Nr. UNINA-9910814171003321
Wang Guoan  
Norwood : , : Artech House, , 2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Proceedings of the 4th annual Seminar on Passive RF and Microwave Components : 18 March 2013, IET Birmingham: Austin Court
Proceedings of the 4th annual Seminar on Passive RF and Microwave Components : 18 March 2013, IET Birmingham: Austin Court
Pubbl/distr/stampa Stevenage, England : , : IET, , 2014
Descrizione fisica 1 online resource (88 pages)
Soggetto topico Radio frequency integrated circuits
Microwave integrated circuits
Passive components
ISBN 1-84919-718-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910135175403321
Stevenage, England : , : IET, , 2014
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Proceedings of the 4th annual Seminar on Passive RF and Microwave Components : 18 March 2013, IET Birmingham: Austin Court
Proceedings of the 4th annual Seminar on Passive RF and Microwave Components : 18 March 2013, IET Birmingham: Austin Court
Pubbl/distr/stampa Stevenage, England : , : IET, , 2014
Descrizione fisica 1 online resource (88 pages)
Soggetto topico Radio frequency integrated circuits
Microwave integrated circuits
Passive components
ISBN 1-84919-718-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996279775203316
Stevenage, England : , : IET, , 2014
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui