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2019 12th Global Symposium on Millimeter Waves (GSMM) / / Tōhoku Daigaku Denki Tsūshin Kenkyūjo
| 2019 12th Global Symposium on Millimeter Waves (GSMM) / / Tōhoku Daigaku Denki Tsūshin Kenkyūjo |
| Autore | Kenkyūjo Tōhoku Daigaku Denki Tsūshin |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2019 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.3813 |
| Soggetto topico |
Millimeter wave devices
Millimeter waves |
| ISBN | 1-7281-2635-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2019 12th Global Symposium on Millimeter Waves |
| Record Nr. | UNISA-996575406803316 |
Kenkyūjo Tōhoku Daigaku Denki Tsūshin
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| Piscataway, New Jersey : , : IEEE, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT) / / Institute of Electrical and Electronics Engineers
| 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2022 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.3824 |
| Soggetto topico |
Antennas (Electronics)
Microwave devices Millimeter wave devices |
| ISBN | 1-66546-752-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2022 International Conference on Microwave and Millimeter Wave Technology |
| Record Nr. | UNISA-996575115103316 |
| Piscataway, New Jersey : , : IEEE, , 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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The 2nd Conference on Millimeter Wave & Terahertz Technologies : 24-26 December, 2012, University of Tehran, Tehran, Iran
| The 2nd Conference on Millimeter Wave & Terahertz Technologies : 24-26 December, 2012, University of Tehran, Tehran, Iran |
| Pubbl/distr/stampa | New York : , : IEEE, , 2013 |
| Descrizione fisica | 1 online resource (155 pages) |
| Soggetto topico |
Millimeter wave devices
Terahertz technology |
| ISBN | 1-4673-4956-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996279810103316 |
| New York : , : IEEE, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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The 2nd Conference on Millimeter Wave & Terahertz Technologies : 24-26 December, 2012, University of Tehran, Tehran, Iran
| The 2nd Conference on Millimeter Wave & Terahertz Technologies : 24-26 December, 2012, University of Tehran, Tehran, Iran |
| Pubbl/distr/stampa | New York : , : IEEE, , 2013 |
| Descrizione fisica | 1 online resource (155 pages) |
| Soggetto topico |
Millimeter wave devices
Terahertz technology |
| ISBN | 1-4673-4956-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910133568003321 |
| New York : , : IEEE, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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The 3rd Conference on Millimeter Wave & Terahertz Technologies : 30 December 2014-1 January 2015, Amirkabir University of Technology, Tehran, Iran
| The 3rd Conference on Millimeter Wave & Terahertz Technologies : 30 December 2014-1 January 2015, Amirkabir University of Technology, Tehran, Iran |
| Pubbl/distr/stampa | New York : , : IEEE, , 2015 |
| Descrizione fisica | 1 online resource (170 pages) |
| Soggetto topico |
Millimeter wave devices
Terahertz technology |
| ISBN | 1-4799-6591-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996279806703316 |
| New York : , : IEEE, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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The 3rd Conference on Millimeter Wave & Terahertz Technologies : 30 December 2014-1 January 2015, Amirkabir University of Technology, Tehran, Iran
| The 3rd Conference on Millimeter Wave & Terahertz Technologies : 30 December 2014-1 January 2015, Amirkabir University of Technology, Tehran, Iran |
| Pubbl/distr/stampa | New York : , : IEEE, , 2015 |
| Descrizione fisica | 1 online resource (170 pages) |
| Soggetto topico |
Millimeter wave devices
Terahertz technology |
| ISBN | 1-4799-6591-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910131349703321 |
| New York : , : IEEE, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Microwave and Millimeter Wave Technologies : Semiconductor Devices Circuits and Systems / / Moumita Mukherjee, editor
| Advanced Microwave and Millimeter Wave Technologies : Semiconductor Devices Circuits and Systems / / Moumita Mukherjee, editor |
| Autore | Mukherjee Moumita |
| Pubbl/distr/stampa | IntechOpen, 2010 |
| Descrizione fisica | 1 online resource (x, 642 pages) : illustrations |
| Disciplina | 621.3813 |
| Soggetto topico |
Microwave devices
Millimeter wave devices |
| Soggetto non controllato | Microwave technology |
| ISBN | 953-51-5885-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Advanced Microwave and Millimeter Wave Technologies |
| Record Nr. | UNINA-9910138284203321 |
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Mukherjee Moumita
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| IntechOpen, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.]
| Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.] |
| Pubbl/distr/stampa | Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 |
| Descrizione fisica | 1 online resource (851 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | LiuDuixian |
| Soggetto topico |
Millimeter wave devices
Millimeter waves |
| Soggetto genere / forma | Electronic books. |
| ISBN |
0-470-74296-8
9781282031388 1-282-03138-4 9786612031380 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
1 Introduction ; 1.1 Challenges ; 1.2 Discussion Framework ; 1.3 Circuits ; 1.4 Antenna ; 1.5 RF Electronics ; .5.1 Receiver ; 1.5.2 Transmitter ; 1.6 Packaging ; 1.7 Organization and Flow of this Book ; References ; 2 Millimeter-wave Packaging ; 2.1 Introduction ; 2.1.1 Definition of Packaging ; 2.1.2 Packaging Challenges and Future Directions ; 2.2 Review of Microwave Packaging Technologies ; 2.2.1 MMICs ; .4.7 Wafer-level Packaging and Assembly of mmWave Devices ; 2.5 Package Codesign at mmWaves ; 2.5.1 Electromagnetic Modeling of mmWave Packages and Interconnects ; 2.5.2 Integrated Antennas ; References ; 3 Dielectric Properties at Millimeter-wave and THz Bands ; 3.1 Introduction ; 3.2 Dielectric Characterization""; 3.3 Outside the THz Gap �Material Characterization Techniques ; 3.3.1 Parallel Plate (~DC�30 MHz) ; 3.3.2 Resonant Cavity (~0.5�50 GHz) ; 3.3.3 Transmission Line Methods (~0.01�300 GHz) ; 3.3.4 THz TDS (~0.1�10 THz) ;
3.4 THz TDS (~0.1�10 THz) ; 3.4.1 Transmission ; 3.4.2 Error Analysis ; 3.5 Dielectric Properties ; 3.5.1 Semiconductors ; 3.5.2 Ceramic Materials ; 3.5.3 Thin Films ; 3.5.4 Metamaterials ; 3.5.5 Biomaterials ; 3.5.6 Material Needs ; References ; 4 Millimeter-wave Interconnects ; 4.1 Introduction ; 4.2 Interconnects at Millimeter-wave Frequencies 4.2.1 Printed Planar Transmission Lines ; 4.2.2 Metal Rectangular Waveguides ; 4.3 Interconnect Technology Options for Millimeter-wave Applications ; 4.3.1 Basic Technological Requirements ; 4.3.2 MCM-L ; 4.3.3 LTCC ; 4.3.4 MCM-D ; 4.3.5 Flexible Substrates ; 4.3.6 Silicon Micromachining ; 4.3.7 Plastic Injection Molding ; 4.4 Performance-oriented Interconnect Technology Optimization ; 4.4.1 Performance-oriented BCB Dielectric Thickness Optimization ; 4.4.2 Transmission Line Discontinuities and Distributed Passives ; 4.4.3 Bends ; 4.5 Chip-to-package Interconnects at Millimeter-wave Frequencies ; 4.5.1 Wirebonding ; 4.5.2 Flip-chip Bonding ; 4.5.3 Alternative Chip Interconnection Methods ; References ; 5 Printed Millimeter Antennas � Multilayer Technologies |
| Record Nr. | UNINA-9910146114003321 |
| Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.]
| Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.] |
| Pubbl/distr/stampa | Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 |
| Descrizione fisica | 1 online resource (851 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | LiuDuixian |
| Soggetto topico |
Millimeter wave devices
Millimeter waves |
| ISBN |
0-470-74296-8
1-282-03138-4 9786612031380 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
1 Introduction ; 1.1 Challenges ; 1.2 Discussion Framework ; 1.3 Circuits ; 1.4 Antenna ; 1.5 RF Electronics ; .5.1 Receiver ; 1.5.2 Transmitter ; 1.6 Packaging ; 1.7 Organization and Flow of this Book ; References ; 2 Millimeter-wave Packaging ; 2.1 Introduction ; 2.1.1 Definition of Packaging ; 2.1.2 Packaging Challenges and Future Directions ; 2.2 Review of Microwave Packaging Technologies ; 2.2.1 MMICs ; .4.7 Wafer-level Packaging and Assembly of mmWave Devices ; 2.5 Package Codesign at mmWaves ; 2.5.1 Electromagnetic Modeling of mmWave Packages and Interconnects ; 2.5.2 Integrated Antennas ; References ; 3 Dielectric Properties at Millimeter-wave and THz Bands ; 3.1 Introduction ; 3.2 Dielectric Characterization""; 3.3 Outside the THz Gap �Material Characterization Techniques ; 3.3.1 Parallel Plate (~DC�30 MHz) ; 3.3.2 Resonant Cavity (~0.5�50 GHz) ; 3.3.3 Transmission Line Methods (~0.01�300 GHz) ; 3.3.4 THz TDS (~0.1�10 THz) ;
3.4 THz TDS (~0.1�10 THz) ; 3.4.1 Transmission ; 3.4.2 Error Analysis ; 3.5 Dielectric Properties ; 3.5.1 Semiconductors ; 3.5.2 Ceramic Materials ; 3.5.3 Thin Films ; 3.5.4 Metamaterials ; 3.5.5 Biomaterials ; 3.5.6 Material Needs ; References ; 4 Millimeter-wave Interconnects ; 4.1 Introduction ; 4.2 Interconnects at Millimeter-wave Frequencies 4.2.1 Printed Planar Transmission Lines ; 4.2.2 Metal Rectangular Waveguides ; 4.3 Interconnect Technology Options for Millimeter-wave Applications ; 4.3.1 Basic Technological Requirements ; 4.3.2 MCM-L ; 4.3.3 LTCC ; 4.3.4 MCM-D ; 4.3.5 Flexible Substrates ; 4.3.6 Silicon Micromachining ; 4.3.7 Plastic Injection Molding ; 4.4 Performance-oriented Interconnect Technology Optimization ; 4.4.1 Performance-oriented BCB Dielectric Thickness Optimization ; 4.4.2 Transmission Line Discontinuities and Distributed Passives ; 4.4.3 Bends ; 4.5 Chip-to-package Interconnects at Millimeter-wave Frequencies ; 4.5.1 Wirebonding ; 4.5.2 Flip-chip Bonding ; 4.5.3 Alternative Chip Interconnection Methods ; References ; 5 Printed Millimeter Antennas � Multilayer Technologies |
| Record Nr. | UNINA-9910831030403321 |
| Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.]
| Advanced millimeter-wave technologies [[electronic resource] ] : antennas, packaging and circuits / / Duixian Liu ... [et al.] |
| Pubbl/distr/stampa | Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 |
| Descrizione fisica | 1 online resource (851 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | LiuDuixian |
| Soggetto topico |
Millimeter wave devices
Millimeter waves |
| ISBN |
0-470-74296-8
1-282-03138-4 9786612031380 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
1 Introduction ; 1.1 Challenges ; 1.2 Discussion Framework ; 1.3 Circuits ; 1.4 Antenna ; 1.5 RF Electronics ; .5.1 Receiver ; 1.5.2 Transmitter ; 1.6 Packaging ; 1.7 Organization and Flow of this Book ; References ; 2 Millimeter-wave Packaging ; 2.1 Introduction ; 2.1.1 Definition of Packaging ; 2.1.2 Packaging Challenges and Future Directions ; 2.2 Review of Microwave Packaging Technologies ; 2.2.1 MMICs ; .4.7 Wafer-level Packaging and Assembly of mmWave Devices ; 2.5 Package Codesign at mmWaves ; 2.5.1 Electromagnetic Modeling of mmWave Packages and Interconnects ; 2.5.2 Integrated Antennas ; References ; 3 Dielectric Properties at Millimeter-wave and THz Bands ; 3.1 Introduction ; 3.2 Dielectric Characterization""; 3.3 Outside the THz Gap �Material Characterization Techniques ; 3.3.1 Parallel Plate (~DC�30 MHz) ; 3.3.2 Resonant Cavity (~0.5�50 GHz) ; 3.3.3 Transmission Line Methods (~0.01�300 GHz) ; 3.3.4 THz TDS (~0.1�10 THz) ;
3.4 THz TDS (~0.1�10 THz) ; 3.4.1 Transmission ; 3.4.2 Error Analysis ; 3.5 Dielectric Properties ; 3.5.1 Semiconductors ; 3.5.2 Ceramic Materials ; 3.5.3 Thin Films ; 3.5.4 Metamaterials ; 3.5.5 Biomaterials ; 3.5.6 Material Needs ; References ; 4 Millimeter-wave Interconnects ; 4.1 Introduction ; 4.2 Interconnects at Millimeter-wave Frequencies 4.2.1 Printed Planar Transmission Lines ; 4.2.2 Metal Rectangular Waveguides ; 4.3 Interconnect Technology Options for Millimeter-wave Applications ; 4.3.1 Basic Technological Requirements ; 4.3.2 MCM-L ; 4.3.3 LTCC ; 4.3.4 MCM-D ; 4.3.5 Flexible Substrates ; 4.3.6 Silicon Micromachining ; 4.3.7 Plastic Injection Molding ; 4.4 Performance-oriented Interconnect Technology Optimization ; 4.4.1 Performance-oriented BCB Dielectric Thickness Optimization ; 4.4.2 Transmission Line Discontinuities and Distributed Passives ; 4.4.3 Bends ; 4.5 Chip-to-package Interconnects at Millimeter-wave Frequencies ; 4.5.1 Wirebonding ; 4.5.2 Flip-chip Bonding ; 4.5.3 Alternative Chip Interconnection Methods ; References ; 5 Printed Millimeter Antennas � Multilayer Technologies |
| Record Nr. | UNINA-9910841445903321 |
| Chichester, U.K. ; ; Hoboken, NJ, : J. Wiley & Sons, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
