Introduction to microelectromechanical systems engineering / / Nadim Maluf, Kirt Williams |
Autore | Maluf Nadim |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Boston : , : Artech House, , ©2004 |
Descrizione fisica | 1 online resource (303 p.) |
Disciplina | 621.381 |
Altri autori (Persone) | WilliamsKirt |
Collana | Artech House microelectromechanical systems (MEMS) series |
Soggetto topico |
Microelectromechanical systems
Microtechnology |
Soggetto genere / forma | Electronic books. |
ISBN | 1-58053-591-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
An Introduction to Microelectromechanical Systems Engineering -- An Introduction to Microelectromechanical Systems Engineering -- Table of Contents -- Foreword xiii -- Preface xv -- Preface to First Edition xix -- CHAPTER 1 MEMS: A Technology from Lilliput 1 -- The Promise of Technology 1 -- What Are MEMS or MST? 2 -- What Is Micromachining? 3 -- Applications and Markets 4 -- To MEMS or Not To MEMS? 7 -- Standards 8 -- The Psychological Barrier 8 -- Journals, Conferences, and Web Sites 9 -- Summary 11 -- CHAPTER 2 Materials for MEMS 13 -- Silicon-Compatible Material System 13.
Other Materials and Substrates 21 -- Important Material Properties and Physical Effects 24 -- Summary 31 -- CHAPTER 3 Processes for Micromachining 33 -- Basic Process Tools 34 -- Advanced Process Tools 55 -- Nonlithographic Microfabrication Technologies 63 -- Combining the Tools Examples of Commercial Processes 68 -- Summary 74 -- CHAPTER 4 MEM Structures and Systems in Industrial and Automotive Applications 79 -- General Design Methodology 79 -- Techniques for Sensing and Actuation 81 -- Passive Micromachined Mechanical Structures 85 -- Sensors and Analysis Systems 89. Actuators and Actuated Microsystems 116 -- Summary 128 -- CHAPTER 5 MEM Structures and Systems in Photonic Applications 133 -- Imaging and Displays 133 -- Fiber-Optic Communication Devices 141 -- Summary 165 -- CHAPTER 6 MEMS Applications in Life Sciences 169 -- Microfluidics for Biological Applications 169 -- DNA Analysis 172 -- Microelectrode Arrays 182 -- Summary 185 -- CHAPTER 7 MEM Structures and Systems in RF Applications 189 -- Signal Integrity in RF MEMS 189 -- Passive Electrical Components: Capacitors and Inductors 190 -- Microelectromechanical Resonators 200. Microelectromechanical Switches 211 -- Summary 214 -- CHAPTER 8 Packaging and Reliability Considerations for MEMS 217 -- Key Design and Packaging Considerations 218 -- Die-Attach Processes 225 -- Wiring and Interconnects 227 -- Types of Packaging Solutions 233 -- Quality Control, Reliability, and Failure Analysis 243 -- Summary 256 -- Glossary 261 -- About the Authors 271 -- Index. |
Record Nr. | UNINA-9910449840903321 |
Maluf Nadim
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Boston : , : Artech House, , ©2004 | ||
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Lo trovi qui: Univ. Federico II | ||
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Introduction to microelectromechanical systems engineering / / Nadim Maluf, Kirt Williams |
Autore | Maluf Nadim |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Boston : , : Artech House, , ©2004 |
Descrizione fisica | 1 online resource (303 p.) |
Disciplina | 621.381 |
Altri autori (Persone) | WilliamsKirt |
Collana | Artech House microelectromechanical systems (MEMS) series |
Soggetto topico |
Microelectromechanical systems
Microtechnology |
ISBN | 1-58053-591-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
An Introduction to Microelectromechanical Systems Engineering -- An Introduction to Microelectromechanical Systems Engineering -- Table of Contents -- Foreword xiii -- Preface xv -- Preface to First Edition xix -- CHAPTER 1 MEMS: A Technology from Lilliput 1 -- The Promise of Technology 1 -- What Are MEMS or MST? 2 -- What Is Micromachining? 3 -- Applications and Markets 4 -- To MEMS or Not To MEMS? 7 -- Standards 8 -- The Psychological Barrier 8 -- Journals, Conferences, and Web Sites 9 -- Summary 11 -- CHAPTER 2 Materials for MEMS 13 -- Silicon-Compatible Material System 13.
Other Materials and Substrates 21 -- Important Material Properties and Physical Effects 24 -- Summary 31 -- CHAPTER 3 Processes for Micromachining 33 -- Basic Process Tools 34 -- Advanced Process Tools 55 -- Nonlithographic Microfabrication Technologies 63 -- Combining the Tools Examples of Commercial Processes 68 -- Summary 74 -- CHAPTER 4 MEM Structures and Systems in Industrial and Automotive Applications 79 -- General Design Methodology 79 -- Techniques for Sensing and Actuation 81 -- Passive Micromachined Mechanical Structures 85 -- Sensors and Analysis Systems 89. Actuators and Actuated Microsystems 116 -- Summary 128 -- CHAPTER 5 MEM Structures and Systems in Photonic Applications 133 -- Imaging and Displays 133 -- Fiber-Optic Communication Devices 141 -- Summary 165 -- CHAPTER 6 MEMS Applications in Life Sciences 169 -- Microfluidics for Biological Applications 169 -- DNA Analysis 172 -- Microelectrode Arrays 182 -- Summary 185 -- CHAPTER 7 MEM Structures and Systems in RF Applications 189 -- Signal Integrity in RF MEMS 189 -- Passive Electrical Components: Capacitors and Inductors 190 -- Microelectromechanical Resonators 200. Microelectromechanical Switches 211 -- Summary 214 -- CHAPTER 8 Packaging and Reliability Considerations for MEMS 217 -- Key Design and Packaging Considerations 218 -- Die-Attach Processes 225 -- Wiring and Interconnects 227 -- Types of Packaging Solutions 233 -- Quality Control, Reliability, and Failure Analysis 243 -- Summary 256 -- Glossary 261 -- About the Authors 271 -- Index. |
Record Nr. | UNINA-9910783448403321 |
Maluf Nadim
![]() |
||
Boston : , : Artech House, , ©2004 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Introduction to microelectromechanical systems engineering / / Nadim Maluf, Kirt Williams |
Autore | Maluf Nadim |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Boston : , : Artech House, , ©2004 |
Descrizione fisica | 1 online resource (303 p.) |
Disciplina | 621.381 |
Altri autori (Persone) | WilliamsKirt |
Collana | Artech House microelectromechanical systems (MEMS) series |
Soggetto topico |
Microelectromechanical systems
Microtechnology |
ISBN | 1-58053-591-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
An Introduction to Microelectromechanical Systems Engineering -- An Introduction to Microelectromechanical Systems Engineering -- Table of Contents -- Foreword xiii -- Preface xv -- Preface to First Edition xix -- CHAPTER 1 MEMS: A Technology from Lilliput 1 -- The Promise of Technology 1 -- What Are MEMS or MST? 2 -- What Is Micromachining? 3 -- Applications and Markets 4 -- To MEMS or Not To MEMS? 7 -- Standards 8 -- The Psychological Barrier 8 -- Journals, Conferences, and Web Sites 9 -- Summary 11 -- CHAPTER 2 Materials for MEMS 13 -- Silicon-Compatible Material System 13.
Other Materials and Substrates 21 -- Important Material Properties and Physical Effects 24 -- Summary 31 -- CHAPTER 3 Processes for Micromachining 33 -- Basic Process Tools 34 -- Advanced Process Tools 55 -- Nonlithographic Microfabrication Technologies 63 -- Combining the Tools Examples of Commercial Processes 68 -- Summary 74 -- CHAPTER 4 MEM Structures and Systems in Industrial and Automotive Applications 79 -- General Design Methodology 79 -- Techniques for Sensing and Actuation 81 -- Passive Micromachined Mechanical Structures 85 -- Sensors and Analysis Systems 89. Actuators and Actuated Microsystems 116 -- Summary 128 -- CHAPTER 5 MEM Structures and Systems in Photonic Applications 133 -- Imaging and Displays 133 -- Fiber-Optic Communication Devices 141 -- Summary 165 -- CHAPTER 6 MEMS Applications in Life Sciences 169 -- Microfluidics for Biological Applications 169 -- DNA Analysis 172 -- Microelectrode Arrays 182 -- Summary 185 -- CHAPTER 7 MEM Structures and Systems in RF Applications 189 -- Signal Integrity in RF MEMS 189 -- Passive Electrical Components: Capacitors and Inductors 190 -- Microelectromechanical Resonators 200. Microelectromechanical Switches 211 -- Summary 214 -- CHAPTER 8 Packaging and Reliability Considerations for MEMS 217 -- Key Design and Packaging Considerations 218 -- Die-Attach Processes 225 -- Wiring and Interconnects 227 -- Types of Packaging Solutions 233 -- Quality Control, Reliability, and Failure Analysis 243 -- Summary 256 -- Glossary 261 -- About the Authors 271 -- Index. |
Record Nr. | UNINA-9910812367503321 |
Maluf Nadim
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Boston : , : Artech House, , ©2004 | ||
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Lo trovi qui: Univ. Federico II | ||
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Introduction to Refrigeration and Air Conditioning Systems [[electronic resource] ] : Theory and Applications / / by Allan Kirkpatrick |
Autore | Kirkpatrick Allan |
Edizione | [1st ed. 2017.] |
Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
Descrizione fisica | 1 online resource (XI, 91 p.) |
Disciplina | 620 |
Collana | Synthesis Lectures on Mechanical Engineering |
Soggetto topico |
Engineering
Electrical engineering Engineering design Microtechnology Microelectromechanical systems Technology and Engineering Electrical and Electronic Engineering Engineering Design Microsystems and MEMS |
ISBN | 3-031-79579-2 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Preface -- Acknowledgments -- Introduction to Cooling Technologies -- Vapor Compression Cooling Cycles -- Evaporative, Absorption, and Gas Cooling Cycles -- Cooling Equipment -- Bibliography -- Author's Biography. |
Record Nr. | UNINA-9910795637703321 |
Kirkpatrick Allan
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Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
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Lo trovi qui: Univ. Federico II | ||
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Introduction to Refrigeration and Air Conditioning Systems [[electronic resource] ] : Theory and Applications / / by Allan Kirkpatrick |
Autore | Kirkpatrick Allan |
Edizione | [1st ed. 2017.] |
Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
Descrizione fisica | 1 online resource (XI, 91 p.) |
Disciplina | 620 |
Collana | Synthesis Lectures on Mechanical Engineering |
Soggetto topico |
Engineering
Electrical engineering Engineering design Microtechnology Microelectromechanical systems Technology and Engineering Electrical and Electronic Engineering Engineering Design Microsystems and MEMS |
ISBN | 3-031-79579-2 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Preface -- Acknowledgments -- Introduction to Cooling Technologies -- Vapor Compression Cooling Cycles -- Evaporative, Absorption, and Gas Cooling Cycles -- Cooling Equipment -- Bibliography -- Author's Biography. |
Record Nr. | UNINA-9910814056703321 |
Kirkpatrick Allan
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Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
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Lo trovi qui: Univ. Federico II | ||
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ISSS journal of micro and smart systems |
Pubbl/distr/stampa | [New Delhi] : , : Springer India, , 2017- |
Descrizione fisica | 1 online resource |
Disciplina | 620 |
Soggetto topico |
Smart materials
Microtechnology Smart structures |
Soggetto genere / forma |
Periodicals.
Zeitschrift |
ISSN | 2509-7997 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Altri titoli varianti | Institute for Smart Structures and Systems journal of micro and smart systems |
Record Nr. | UNINA-9910481972403321 |
[New Delhi] : , : Springer India, , 2017- | ||
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Lo trovi qui: Univ. Federico II | ||
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Journal of micro- and nano-manufacturing |
Pubbl/distr/stampa | New York, NY : , : ASME, , March 2013- |
Descrizione fisica | : illustrated |
Disciplina | 670 |
Soggetto topico |
Microfabrication
Nanomanufacturing Microelectromechanical systems Nanotechnology Microtechnology Nanostructured materials |
Soggetto genere / forma | Periodicals. |
ISSN | 2166-0476 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Altri titoli varianti |
Micro- and nano-manufacturing
Journal of micro and nano manufacturing ASME journal of micro and nano-manufacturing JMNM |
Record Nr. | UNINA-9910139729203321 |
New York, NY : , : ASME, , March 2013- | ||
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Lo trovi qui: Univ. Federico II | ||
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Label-Free Biosensing : Advanced Materials, Devices and Applications / / edited by Michael J. Schöning, Arshak Poghossian |
Edizione | [1st ed. 2018.] |
Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 |
Descrizione fisica | 1 online resource (XII, 480 p. 200 illus., 149 illus. in color.) |
Disciplina | 610.28 |
Collana | Springer Series on Chemical Sensors and Biosensors, Methods and Applications |
Soggetto topico |
Nanochemistry
Microtechnology Microelectromechanical systems Nanotechnology Biotechnology Biophysics Biology - Technique Microsystems and MEMS Biological Techniques |
ISBN | 3-319-75220-0 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Nanomaterial-modified Capacitive Field-effect Biosensors -- Silicon Nanowire Field-effect Biosensors -- Label-free Biosensors Based on III-Nitride Semiconductors -- (Bio-)chemical Sensing and Imaging by LAPS and SPIM -- Biosensorial Application of Impedance Spectroscopy with Focus on DNA Detection -- Label-free Impedimetric Biosensing Using 3D Interdigitated Electrodes -- Electrochemical Nanocavity Devices -- Computational Modeling of Biomolecule Sensing with a Solid-state Membrane -- Amperometric Sensors Based on Carbon Nanotubes in Layer-by-Layer Films -- Graphene-based Biosensors and their Applications in Biomedical and Environmental Monitoring -- Label-free MIP-Sensors for Protein Biomarkers -- Biomimetic Recognition for Acoustic Sensing in Liquids -- Enzyme Logic Systems - Biomedical and Forensic Biosensor Applications -- Heat Transfer as a New Sensing Technique for the Label-Fee Detection of Biomolecules -- Towards Ultrasensitive Surface Plasmon Resonance Sensors -- Biomagnetic Sensing. |
Record Nr. | UNINA-9910298581303321 |
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 | ||
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Lo trovi qui: Univ. Federico II | ||
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LIGA and its applications |
Pubbl/distr/stampa | [Place of publication not identified], : Wiley VCH, 2009 |
Disciplina | 621.381 |
Collana | Advanced micro & nanosystems LIGA and its applications |
Soggetto topico |
Microelectromechanical systems
Microtechnology Electrical Engineering Electrical & Computer Engineering Engineering & Applied Sciences |
ISBN |
3-527-62257-8
1-61583-473-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910139380703321 |
[Place of publication not identified], : Wiley VCH, 2009 | ||
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Lo trovi qui: Univ. Federico II | ||
|
LIGA and its applications |
Pubbl/distr/stampa | [Place of publication not identified], : Wiley VCH, 2009 |
Disciplina | 621.381 |
Collana | Advanced micro & nanosystems LIGA and its applications |
Soggetto topico |
Microelectromechanical systems
Microtechnology Electrical Engineering Electrical & Computer Engineering Engineering & Applied Sciences |
ISBN |
3-527-62257-8
1-61583-473-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910830672903321 |
[Place of publication not identified], : Wiley VCH, 2009 | ||
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Lo trovi qui: Univ. Federico II | ||
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