Stressed oxidation of C/SiC composites / / Michael C. Halbig [and three others] |
Autore | Halbig Michael C. <1969-> |
Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center : , : U.S. Army Research Laboratory, , April 1997 |
Descrizione fisica | 1 online resource (8 pages) : illustrations |
Collana |
NASA technical memorandum
Army research laboratory technical report |
Soggetto topico |
Oxidation
Ceramics High temperature tests Microstructure Fiber-matrix interfaces Debonding (materials) Ceramic matrix composites Residual strength Microcracks |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Altri titoli varianti | Stressed oxidation of carbon fiber-reinforced silicon carbide composites |
Record Nr. | UNINA-9910707607503321 |
Halbig Michael C. <1969-> | ||
Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center : , : U.S. Army Research Laboratory, , April 1997 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
Descrizione fisica | 1 online resource (610 p.) |
Disciplina | 621.382 |
Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
Record Nr. | UNINA-9910139456003321 |
Hoboken, N.J., : Wiley, 2010 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
Descrizione fisica | 1 online resource (610 p.) |
Disciplina | 621.382 |
Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
Record Nr. | UNINA-9910830683803321 |
Hoboken, N.J., : Wiley, 2010 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Sulfur impurities and the microstructure of alumina scales / / James L. Smialek |
Autore | Smialek James L. |
Edizione | [Revised copy.] |
Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , April 1997 |
Descrizione fisica | 1 online resource (11 pages) : illustrations |
Collana | NASA technical memorandum |
Soggetto topico |
Microstructure
Aluminum oxides Annealing Sulfur Adhesion Desulfurizing Grain boundaries Heat resistant alloys Metal bonding |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910707308903321 |
Smialek James L. | ||
Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , April 1997 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Superlattices and microstructures [[e-journal]] |
Pubbl/distr/stampa | [London], : Academic Press |
Disciplina | 530 |
Soggetto topico |
Superlattices as materials
Microstructure Semiconductors |
Soggetto genere / forma | Periodicals. |
ISSN | 1096-3677 |
Formato | Materiale a stampa |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996205856803316 |
[London], : Academic Press | ||
Materiale a stampa | ||
Lo trovi qui: Univ. di Salerno | ||
|
Superlattices and microstructures [[e-journal]] |
Pubbl/distr/stampa | [London], : Academic Press |
Disciplina | 530 |
Soggetto topico |
Superlattices as materials
Microstructure Semiconductors |
Soggetto genere / forma | Periodicals. |
ISSN | 1096-3677 |
Formato | Materiale a stampa |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910333251703321 |
[London], : Academic Press | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Surface chemistry, microstructure, and tribological properties of cubic boron nitride films / / Shuichi Watanabe [and six others] |
Autore | Watanabe Shuichi |
Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , January 1998 |
Descrizione fisica | 1 online resource (15 pages) : illustrations |
Collana | NASA/TM |
Soggetto topico |
Boron nitrides
Microstructure Thin films Boron nitride |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910717125603321 |
Watanabe Shuichi | ||
Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , January 1998 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Tensile properties and microstructural characterization of Hi-Nicalon SiC/RBSN composites / / Ramakrishna T. Bhatt |
Autore | Bhatt Ramakrishna T. |
Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center and U.S. Army Research Laboratory, , October 1998 |
Descrizione fisica | 1 online resource (9 pages) : illustrations |
Collana | NASA/TM |
Soggetto topico |
Fiber composites
Fracture strength Microstructure Silicon carbides Silicon nitrides Vapor deposition |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910705818103321 |
Bhatt Ramakrishna T. | ||
Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center and U.S. Army Research Laboratory, , October 1998 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Tensile strength and microstructural characterization of uncoated and coated HPZ ceramic fibers / / Narottam P. Bansal and Donald R. Wheeler, Robert M. Dickerson |
Autore | Bansal Narottam P. |
Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , July 1996 |
Descrizione fisica | 1 online resource (17 pages) : illustrations |
Collana | NASA technical memorandum |
Soggetto topico |
Tensile strength
Microstructure Ceramic fibers Weibull density functions Vapor deposition Fiber strength |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910707372703321 |
Bansal Narottam P. | ||
Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , July 1996 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Thermal stability of the microstructure of an aged Nb-Zr-C alloy / / Mehmet Uz and Robert H. Titran |
Autore | Uz Mehmet |
Pubbl/distr/stampa | Washington, D.C. : , : National Aeronautics and Space Administration, , October 1990 |
Descrizione fisica | 1 online resource (14 pages) : illustrations |
Collana | NASA/TM |
Soggetto topico |
Microstructure
Chromium Carbides Thermal stability Niobium |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910714029703321 |
Uz Mehmet | ||
Washington, D.C. : , : National Aeronautics and Space Administration, , October 1990 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|