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Flexible OLEDs : fundamental and novel practical technologies / / Mitsuhiro Koden
| Flexible OLEDs : fundamental and novel practical technologies / / Mitsuhiro Koden |
| Autore | Koden Mitsuhiro |
| Pubbl/distr/stampa | Singapore : , : Springer, , [2022] |
| Descrizione fisica | 1 online resource (108 pages) |
| Disciplina | 620.11295 |
| Collana | SpringerBriefs in applied sciences and technology |
| Soggetto topico |
Electroluminescent devices
Light emitting diodes |
| ISBN |
9789811935442
9789811935435 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910583508703321 |
Koden Mitsuhiro
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| Singapore : , : Springer, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Freeform optics for LED packages and applications / / Kai Wang [and three others]
| Freeform optics for LED packages and applications / / Kai Wang [and three others] |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , 2017 |
| Descrizione fisica | 1 online resource (372 pages) : illustrations, photographs |
| Disciplina | 621.381522 |
| Soggetto topico |
Light emitting diodes
LED lighting |
| ISBN |
1-118-75003-9
1-118-75002-0 1-118-75000-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Review of main algorithms of freeform optics for LED lighting -- Basic algorithms of freeform optics for LED lighting -- Application specific LED package integrated with freeform lens -- Freeform optics for LED indoor lighting -- Freeform optics for LED road lighting -- Freeform optics for direct-lit LED backlighting unit (BLU) -- Freeform optics for LED headlamp of automotive -- Freeform optics for emerging LED applications -- Freeform optics for LED lighting with high spatial color uniformity (SCU). |
| Record Nr. | UNINA-9910270872503321 |
| Hoboken, New Jersey : , : Wiley, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Freeform optics for LED packages and applications / / Kai Wang [and three others]
| Freeform optics for LED packages and applications / / Kai Wang [and three others] |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , 2017 |
| Descrizione fisica | 1 online resource (372 pages) : illustrations, photographs |
| Disciplina | 621.381522 |
| Soggetto topico |
Light emitting diodes
LED lighting |
| ISBN |
1-118-75003-9
1-118-75002-0 1-118-75000-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Review of main algorithms of freeform optics for LED lighting -- Basic algorithms of freeform optics for LED lighting -- Application specific LED package integrated with freeform lens -- Freeform optics for LED indoor lighting -- Freeform optics for LED road lighting -- Freeform optics for direct-lit LED backlighting unit (BLU) -- Freeform optics for LED headlamp of automotive -- Freeform optics for emerging LED applications -- Freeform optics for LED lighting with high spatial color uniformity (SCU). |
| Record Nr. | UNINA-9910824922503321 |
| Hoboken, New Jersey : , : Wiley, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
From LED to solid state lighting : principles, materials, packaging, characterization, and applications / / Shi-Wei Ricky Lee [et al.]
| From LED to solid state lighting : principles, materials, packaging, characterization, and applications / / Shi-Wei Ricky Lee [et al.] |
| Autore | Lee Shi-Wei Ricky |
| Pubbl/distr/stampa | Hoboken, NJ : , : John Wiley & Sons, Inc., , 2022 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381522 |
| Soggetto topico | Light emitting diodes |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-118-88155-9
1-118-88162-1 1-118-88158-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover -- Title Page -- Copyright -- Contents -- Preface -- About the Authors -- Chapter 1 LEDs for Solid‐State Lighting -- 1.1 Introduction -- 1.2 Evolution of Light Sources and Lighting Systems -- 1.3 Historical Development of LEDs -- 1.4 Implementation of White Light Illumination with an LED -- 1.5 LEDs for General Lighting -- References -- Chapter 2 Packaging of LED Chips -- 2.1 Introduction -- 2.2 Overall Packaging Process and LED Package Types -- 2.2.1 PTH LED Component -- 2.2.2 SMD LED Component -- 2.3 Chip Mounting and Interconnection -- 2.3.1 Die Attach Adhesive -- 2.3.2 Soldering and Eutectic Bonding -- 2.3.3 Wire Bonding -- 2.3.4 Flip‐Chips -- 2.4 Phosphor Coating and Dispensing Process -- 2.4.1 Dispersed Dispensing -- 2.4.2 Conformal Coating -- 2.4.3 Remote Phosphor -- 2.5 Encapsulation and Molding Process -- 2.5.1 Encapsulant Filling with Lens -- 2.5.2 Lens Molding -- 2.6 Secondary Optics and Lens Design -- References -- Chapter 3 Chip Scale and Wafer Level Packaging of LEDs -- 3.1 Introduction -- 3.2 Chip Scale Packaging -- 3.3 Enabling Technologies for Wafer Level Packaging -- 3.3.1 Photolithography -- 3.3.2 Wafer Etching -- 3.3.3 TSV Filling -- 3.3.4 Bond Pad Metallization -- 3.3.5 Wafer Level Phosphor Deposition Methods -- 3.3.5.1 Wafer Level Phosphor Stencil Printing -- 3.3.5.2 Waffle Pack Remote Phosphor Film -- 3.3.5.3 Remote Phosphor Dispensing on a Pre‐Encapsulated Silicone Lens -- 3.3.6 Moldless Encapsulation -- 3.4 Designs and Structures of LED Wafer Level Packaging -- 3.4.1 Reflective Layer Design -- 3.4.2 Cavity and Reflective Cup by Wet Etching -- 3.4.3 Copper‐Filled TSVs for Vertical Interconnection and Heat Dissipation -- 3.5 Processes of LED Wafer Level Packaging -- 3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots -- 3.5.2 Case 2: LED WLP with a Cavity -- 3.5.3 Case 3: Applications of an LED WLP Panel.
References -- Chapter 4 Board Level Assemblies and LED Modules -- 4.1 Introduction -- 4.2 Board Level Assembly Processes -- 4.2.1 Metal Core Printed Circuit Board -- 4.2.2 Printed Circuit Board with Thermal Vias -- 4.2.3 Wave Soldering -- 4.2.4 Surface Mount Reflow -- 4.3 Chip‐on‐Board Assemblies -- 4.4 LED Modules and Considerations -- References -- Chapter 5 Optical, Electrical, and Thermal Performance -- 5.1 Evaluation of Optical Performance -- 5.1.1 Basic Concepts of Radiometric and Photometric -- 5.1.2 Irradiance Measurement Calibration -- 5.1.3 Common Measurement Equipment -- 5.2 Power Supply and Efficiency -- 5.2.1 Electrical Characteristics of LED -- 5.2.2 Power Supply for LEDs -- 5.2.3 Power Efficiency -- 5.3 Consideration of LED Thermal Performance -- 5.3.1 Thermal Characterization Methods for LEDs -- 5.3.2 Thermal Management Methods -- References -- Chapter 6 Reliability Engineering for LED Packaging -- 6.1 Concept of Reliability and Test Methods -- 6.1.1 Reliability of Electronic Components or Systems -- 6.1.2 Common Failure Mechanisms and Reliability Tests -- 6.2 Failure Analysis and Life Assessment -- 6.2.1 Methodology for Failure Analysis -- 6.2.2 Weibull Analysis and Acceleration Model for Life Assessment -- 6.3 Design for Reliability -- References -- Chapter 7 Emerging Applications of LEDs -- 7.1 LEDs for Automotive Lighting -- 7.1.1 Development -- 7.1.2 Typical Structures -- 7.1.3 Challenges -- 7.1.3.1 Electric Driver -- 7.1.3.2 Optical Design -- 7.1.3.3 Thermal Optimization -- 7.1.4 Conclusion -- 7.2 Micro‐ and Mini‐LED Display -- 7.2.1 Development -- 7.2.1.1 Development of Mini‐LED Display -- 7.2.1.2 Development of Micro‐LED Displays -- 7.2.2 Typical Structures -- 7.2.3 Challenges -- 7.2.4 Conclusion -- 7.3 LED for Visible Light Communication -- 7.3.1 Development -- 7.3.2 Typical Applications -- 7.3.2.1 Li‐Fi. 7.3.2.2 Traffic Communication -- 7.3.2.3 Smart City -- 7.3.3 Challenges -- 7.3.3.1 Multiple Input and Multiple Output (MIMO) -- 7.3.3.2 Reliability and Network Coverage -- 7.3.3.3 Other Challenges -- 7.3.4 Conclusion -- References -- Chapter 8 LEDs Beyond Visible Light -- 8.1 Applications of UV‐LED -- 8.1.1 Structures -- 8.1.1.1 UV‐LED Chip -- 8.1.1.2 UV‐LED Package -- 8.1.2 Applications -- 8.1.2.1 Sterilization and Disinfection -- 8.1.2.2 Curing -- 8.1.2.3 UV Communications Technology -- 8.1.2.4 White Light Generation -- 8.1.2.5 Medical Treatment -- 8.1.3 Challenges -- 8.1.3.1 Heteroepitaxy of DUV‐LEDs -- 8.1.3.2 Doping of AlGaN UV‐LEDs and External Quantum Efficiency -- 8.1.3.3 Thermal Degradation -- 8.1.3.4 Structures of UV‐LED Packages -- 8.1.3.5 Materials of UV‐LED Packages -- 8.1.4 Conclusion -- 8.2 Applications of IR‐LEDs -- 8.2.1 Structures -- 8.2.2 Applications -- 8.2.2.1 Sensors and Detecting -- 8.2.2.2 Imaging Techniques -- 8.2.2.3 Biomedical Engineering -- 8.2.3 Challenges -- 8.2.3.1 Monolithic Integration -- 8.2.3.2 Driving Currents and Efficiency -- 8.2.3.3 Thermal Management -- 8.2.4 Conclusion -- 8.3 Future Outlook and Other Technology Trends -- 8.3.1 Better Light Sources -- 8.3.1.1 Display Technology -- 8.3.1.2 High‐Quality Light -- 8.3.1.3 Special Light Sources -- 8.3.2 Interconnection -- 8.3.3 Interaction with Humans -- 8.3.4 Light on Demand -- References -- Index -- EULA. |
| Record Nr. | UNINA-9910555188903321 |
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Lee Shi-Wei Ricky
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| Hoboken, NJ : , : John Wiley & Sons, Inc., , 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
From LED to solid state lighting : principles, materials, packaging, characterization, and applications / / Shi-Wei Ricky Lee [et al.]
| From LED to solid state lighting : principles, materials, packaging, characterization, and applications / / Shi-Wei Ricky Lee [et al.] |
| Autore | Lee Shi-Wei Ricky (HKUST.) |
| Pubbl/distr/stampa | Hoboken, NJ : , : John Wiley & Sons, Inc., , 2022 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381522 |
| Soggetto topico | Light emitting diodes |
| ISBN |
1-118-88155-9
1-118-88162-1 1-118-88158-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover -- Title Page -- Copyright -- Contents -- Preface -- About the Authors -- Chapter 1 LEDs for Solid‐State Lighting -- 1.1 Introduction -- 1.2 Evolution of Light Sources and Lighting Systems -- 1.3 Historical Development of LEDs -- 1.4 Implementation of White Light Illumination with an LED -- 1.5 LEDs for General Lighting -- References -- Chapter 2 Packaging of LED Chips -- 2.1 Introduction -- 2.2 Overall Packaging Process and LED Package Types -- 2.2.1 PTH LED Component -- 2.2.2 SMD LED Component -- 2.3 Chip Mounting and Interconnection -- 2.3.1 Die Attach Adhesive -- 2.3.2 Soldering and Eutectic Bonding -- 2.3.3 Wire Bonding -- 2.3.4 Flip‐Chips -- 2.4 Phosphor Coating and Dispensing Process -- 2.4.1 Dispersed Dispensing -- 2.4.2 Conformal Coating -- 2.4.3 Remote Phosphor -- 2.5 Encapsulation and Molding Process -- 2.5.1 Encapsulant Filling with Lens -- 2.5.2 Lens Molding -- 2.6 Secondary Optics and Lens Design -- References -- Chapter 3 Chip Scale and Wafer Level Packaging of LEDs -- 3.1 Introduction -- 3.2 Chip Scale Packaging -- 3.3 Enabling Technologies for Wafer Level Packaging -- 3.3.1 Photolithography -- 3.3.2 Wafer Etching -- 3.3.3 TSV Filling -- 3.3.4 Bond Pad Metallization -- 3.3.5 Wafer Level Phosphor Deposition Methods -- 3.3.5.1 Wafer Level Phosphor Stencil Printing -- 3.3.5.2 Waffle Pack Remote Phosphor Film -- 3.3.5.3 Remote Phosphor Dispensing on a Pre‐Encapsulated Silicone Lens -- 3.3.6 Moldless Encapsulation -- 3.4 Designs and Structures of LED Wafer Level Packaging -- 3.4.1 Reflective Layer Design -- 3.4.2 Cavity and Reflective Cup by Wet Etching -- 3.4.3 Copper‐Filled TSVs for Vertical Interconnection and Heat Dissipation -- 3.5 Processes of LED Wafer Level Packaging -- 3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots -- 3.5.2 Case 2: LED WLP with a Cavity -- 3.5.3 Case 3: Applications of an LED WLP Panel.
References -- Chapter 4 Board Level Assemblies and LED Modules -- 4.1 Introduction -- 4.2 Board Level Assembly Processes -- 4.2.1 Metal Core Printed Circuit Board -- 4.2.2 Printed Circuit Board with Thermal Vias -- 4.2.3 Wave Soldering -- 4.2.4 Surface Mount Reflow -- 4.3 Chip‐on‐Board Assemblies -- 4.4 LED Modules and Considerations -- References -- Chapter 5 Optical, Electrical, and Thermal Performance -- 5.1 Evaluation of Optical Performance -- 5.1.1 Basic Concepts of Radiometric and Photometric -- 5.1.2 Irradiance Measurement Calibration -- 5.1.3 Common Measurement Equipment -- 5.2 Power Supply and Efficiency -- 5.2.1 Electrical Characteristics of LED -- 5.2.2 Power Supply for LEDs -- 5.2.3 Power Efficiency -- 5.3 Consideration of LED Thermal Performance -- 5.3.1 Thermal Characterization Methods for LEDs -- 5.3.2 Thermal Management Methods -- References -- Chapter 6 Reliability Engineering for LED Packaging -- 6.1 Concept of Reliability and Test Methods -- 6.1.1 Reliability of Electronic Components or Systems -- 6.1.2 Common Failure Mechanisms and Reliability Tests -- 6.2 Failure Analysis and Life Assessment -- 6.2.1 Methodology for Failure Analysis -- 6.2.2 Weibull Analysis and Acceleration Model for Life Assessment -- 6.3 Design for Reliability -- References -- Chapter 7 Emerging Applications of LEDs -- 7.1 LEDs for Automotive Lighting -- 7.1.1 Development -- 7.1.2 Typical Structures -- 7.1.3 Challenges -- 7.1.3.1 Electric Driver -- 7.1.3.2 Optical Design -- 7.1.3.3 Thermal Optimization -- 7.1.4 Conclusion -- 7.2 Micro‐ and Mini‐LED Display -- 7.2.1 Development -- 7.2.1.1 Development of Mini‐LED Display -- 7.2.1.2 Development of Micro‐LED Displays -- 7.2.2 Typical Structures -- 7.2.3 Challenges -- 7.2.4 Conclusion -- 7.3 LED for Visible Light Communication -- 7.3.1 Development -- 7.3.2 Typical Applications -- 7.3.2.1 Li‐Fi. 7.3.2.2 Traffic Communication -- 7.3.2.3 Smart City -- 7.3.3 Challenges -- 7.3.3.1 Multiple Input and Multiple Output (MIMO) -- 7.3.3.2 Reliability and Network Coverage -- 7.3.3.3 Other Challenges -- 7.3.4 Conclusion -- References -- Chapter 8 LEDs Beyond Visible Light -- 8.1 Applications of UV‐LED -- 8.1.1 Structures -- 8.1.1.1 UV‐LED Chip -- 8.1.1.2 UV‐LED Package -- 8.1.2 Applications -- 8.1.2.1 Sterilization and Disinfection -- 8.1.2.2 Curing -- 8.1.2.3 UV Communications Technology -- 8.1.2.4 White Light Generation -- 8.1.2.5 Medical Treatment -- 8.1.3 Challenges -- 8.1.3.1 Heteroepitaxy of DUV‐LEDs -- 8.1.3.2 Doping of AlGaN UV‐LEDs and External Quantum Efficiency -- 8.1.3.3 Thermal Degradation -- 8.1.3.4 Structures of UV‐LED Packages -- 8.1.3.5 Materials of UV‐LED Packages -- 8.1.4 Conclusion -- 8.2 Applications of IR‐LEDs -- 8.2.1 Structures -- 8.2.2 Applications -- 8.2.2.1 Sensors and Detecting -- 8.2.2.2 Imaging Techniques -- 8.2.2.3 Biomedical Engineering -- 8.2.3 Challenges -- 8.2.3.1 Monolithic Integration -- 8.2.3.2 Driving Currents and Efficiency -- 8.2.3.3 Thermal Management -- 8.2.4 Conclusion -- 8.3 Future Outlook and Other Technology Trends -- 8.3.1 Better Light Sources -- 8.3.1.1 Display Technology -- 8.3.1.2 High‐Quality Light -- 8.3.1.3 Special Light Sources -- 8.3.2 Interconnection -- 8.3.3 Interaction with Humans -- 8.3.4 Light on Demand -- References -- Index -- EULA. |
| Record Nr. | UNINA-9910829919103321 |
|
Lee Shi-Wei Ricky (HKUST.)
|
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| Hoboken, NJ : , : John Wiley & Sons, Inc., , 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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A Green laser pointer hazard [[electronic resource] /] / Jemellie Galang ... [and others]
| A Green laser pointer hazard [[electronic resource] /] / Jemellie Galang ... [and others] |
| Pubbl/distr/stampa | [Gaithersburg, Md.] : , : U.S. Dept. of Commerce, National Institute of Standards and Technology, , [2010] |
| Descrizione fisica | 1 online resource (9 pages) : digital, PDF file |
| Altri autori (Persone) | GalangJemellie |
| Collana | NIST technical note |
| Soggetto topico |
Semiconductor lasers - Safety measures - Testing
Diodes, Semiconductor - Safety measures - Testing Infrared radiation - Safety measures - Testing Light emitting diodes |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910699683403321 |
| [Gaithersburg, Md.] : , : U.S. Dept. of Commerce, National Institute of Standards and Technology, , [2010] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Handbook of luminescence, display materials, and devices / edited by Hari Singh Nalwa, Lauren Shea Rohwer
| Handbook of luminescence, display materials, and devices / edited by Hari Singh Nalwa, Lauren Shea Rohwer |
| Pubbl/distr/stampa | Stevenson Ranch, Calif. : American Scientific Publishers, c2003 |
| Descrizione fisica | 3 v. : ill. ; 29 cm |
| Disciplina | 621.381522 |
| Altri autori (Persone) |
Nalwa, Hari Singh, 1954-
Rohwer, Lauren Shea |
| Soggetto topico |
Light emitting diodes
Luminescence Phosphors Information display systems |
| ISBN |
1588830101 (set)
1588830306 (v.1) 1588830314 (v.2) 1588830322 (v.3) |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
v.1: Organic light-emitting diodes
v.2: Inorganic display materials v.3: Display devices |
| Record Nr. | UNISALENTO-991000247689707536 |
| Stevenson Ranch, Calif. : American Scientific Publishers, c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. del Salento | ||
| ||
Highly efficient OLEDs with phosphorescent materials / / edited by Hartmut Yersin
| Highly efficient OLEDs with phosphorescent materials / / edited by Hartmut Yersin |
| Pubbl/distr/stampa | Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 |
| Descrizione fisica | 1 online resource (458 p.) |
| Disciplina | 621.381522 |
| Soggetto topico |
Light emitting diodes
Polymers - Electric properties |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-282-78424-2
9786612784248 3-527-62130-X 3-527-62131-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Highly Efficient OLEDs with Phosphorescent Materials; Contents; Preface; List of Contributors; 1 Triplet Emitters for Organic Light-Emitting Diodes: Basic Properties; 1.1 Introduction; 1.2 Electro-Luminescence and the Population of Excited States; 1.2.1 Multilayer Design of an OLED; 1.2.2 Electron-Hole Recombination, Relaxation Paths, and Light Emission; 1.3 Electronic Excitations and Excited States; 1.3.1 Ligand-Centered (LC) Transitions: States and Splittings; 1.3.2 Metal-Centered Transitions and States
1.3.3 Metal-to-Ligand Charge Transfer/Ligand-Centered Transitions: States in Organo-Transition Metal Triplet Emitters1.3.3.1 Introductory MO Model and Energy States; 1.3.3.2 Extended MO Model and Energy States; 1.3.3.3 Spin-Orbit Coupling, Triplet Substates, Zero-Field Splitting, and Radiative Decay Rates; 1.4 Zero-Field Splitting (ZFS) of the Emitting Triplet, Photophysical Trends, and Ordering Scheme for Organo-Transition Metal Compounds; 1.4.1 Ordering Scheme; 1.4.2 Photophysical Properties and ZFS; 1.4.2.1 Singlet-Triplet Splitting; 1.4.2.2 Intersystem Crossing Rates 1.4.2.3 Emission Decay Time and Photoluminescence Quantum Yield1.4.2.4 Zero-Field Splitting - Summarizing Remarks; 1.4.2.5 Emission Band Structures and Vibrational Satellites; 1.4.2.6 Localization/Delocalization and Geometry Changes in the Excited Triplet State; 1.5 Characterization of the Lowest Triplet State Based on High-Resolution Spectroscopy: Application to Pt(thpy)(2); 1.5.1 Highly Resolved Electronic Transitions; 1.5.2 Symmetry and Grouptheoretical Considerations; 1.6 Characterization of the Lowest Triplet State Based on Decay Time Measurements: Application to Ir(ppy)(3) 1.7 Phosphorescence Dynamics and Spin-Lattice Relaxation: Background and Case Study Applied to Pt(thpy)(2)1.7.1 Processes of Spin-Lattice Relaxation; 1.7.1.1 The Direct Process; 1.7.1.2 The Orbach Process; 1.7.1.3 The Raman Process; 1.7.2 Population and Decay Dynamics of the Triplet Substates of Pt(thpy)(2); 1.8 The Triplet State Under Application of High Magnetic Fields: Properties of Ir(btp)(2)(acac); 1.9 Vibrational Satellite Structures: Case Studies Applied to Pt(thpy)(2) and Ir(btp)(2)(acac); 1.9.1 Vibrational Satellites: Background; 1.9.1.1 Franck-Condon Activity 1.9.1.2 Herzberg-Teller Activity1.9.2 Pt(thpy)(2) Emission: Temperature- and Time-Dependence of the Vibrational Satellite Structure; 1.9.2.1 Herzberg-Teller-Induced Emission from Substate I: The 1.3 K Spectrum; 1.9.2.2 Franck-Condon Activity in the Emissions from Substates II and III: The 20 K Spectrum; 1.9.2.3 Time-Resolved Emission and Franck-Condon/Herzberg-Teller Activities; 1.9.3 Ir(btp)2(acac) Emission: Low-Temperature Vibrational Satellite Structure; 1.10 Environmental Effects on Triplet State Properties: Case Studies Applied to Ir(btp)(2)(acac); 1.10.1 Energy Distribution of Sites 1.10.2 Zero-Field Splittings at Different Sites |
| Record Nr. | UNINA-9910144260003321 |
| Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Highly efficient OLEDs with phosphorescent materials / / edited by Hartmut Yersin
| Highly efficient OLEDs with phosphorescent materials / / edited by Hartmut Yersin |
| Pubbl/distr/stampa | Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 |
| Descrizione fisica | 1 online resource (458 p.) |
| Disciplina | 621.381522 |
| Soggetto topico |
Light emitting diodes
Polymers - Electric properties |
| ISBN |
1-282-78424-2
9786612784248 3-527-62130-X 3-527-62131-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Highly Efficient OLEDs with Phosphorescent Materials; Contents; Preface; List of Contributors; 1 Triplet Emitters for Organic Light-Emitting Diodes: Basic Properties; 1.1 Introduction; 1.2 Electro-Luminescence and the Population of Excited States; 1.2.1 Multilayer Design of an OLED; 1.2.2 Electron-Hole Recombination, Relaxation Paths, and Light Emission; 1.3 Electronic Excitations and Excited States; 1.3.1 Ligand-Centered (LC) Transitions: States and Splittings; 1.3.2 Metal-Centered Transitions and States
1.3.3 Metal-to-Ligand Charge Transfer/Ligand-Centered Transitions: States in Organo-Transition Metal Triplet Emitters1.3.3.1 Introductory MO Model and Energy States; 1.3.3.2 Extended MO Model and Energy States; 1.3.3.3 Spin-Orbit Coupling, Triplet Substates, Zero-Field Splitting, and Radiative Decay Rates; 1.4 Zero-Field Splitting (ZFS) of the Emitting Triplet, Photophysical Trends, and Ordering Scheme for Organo-Transition Metal Compounds; 1.4.1 Ordering Scheme; 1.4.2 Photophysical Properties and ZFS; 1.4.2.1 Singlet-Triplet Splitting; 1.4.2.2 Intersystem Crossing Rates 1.4.2.3 Emission Decay Time and Photoluminescence Quantum Yield1.4.2.4 Zero-Field Splitting - Summarizing Remarks; 1.4.2.5 Emission Band Structures and Vibrational Satellites; 1.4.2.6 Localization/Delocalization and Geometry Changes in the Excited Triplet State; 1.5 Characterization of the Lowest Triplet State Based on High-Resolution Spectroscopy: Application to Pt(thpy)(2); 1.5.1 Highly Resolved Electronic Transitions; 1.5.2 Symmetry and Grouptheoretical Considerations; 1.6 Characterization of the Lowest Triplet State Based on Decay Time Measurements: Application to Ir(ppy)(3) 1.7 Phosphorescence Dynamics and Spin-Lattice Relaxation: Background and Case Study Applied to Pt(thpy)(2)1.7.1 Processes of Spin-Lattice Relaxation; 1.7.1.1 The Direct Process; 1.7.1.2 The Orbach Process; 1.7.1.3 The Raman Process; 1.7.2 Population and Decay Dynamics of the Triplet Substates of Pt(thpy)(2); 1.8 The Triplet State Under Application of High Magnetic Fields: Properties of Ir(btp)(2)(acac); 1.9 Vibrational Satellite Structures: Case Studies Applied to Pt(thpy)(2) and Ir(btp)(2)(acac); 1.9.1 Vibrational Satellites: Background; 1.9.1.1 Franck-Condon Activity 1.9.1.2 Herzberg-Teller Activity1.9.2 Pt(thpy)(2) Emission: Temperature- and Time-Dependence of the Vibrational Satellite Structure; 1.9.2.1 Herzberg-Teller-Induced Emission from Substate I: The 1.3 K Spectrum; 1.9.2.2 Franck-Condon Activity in the Emissions from Substates II and III: The 20 K Spectrum; 1.9.2.3 Time-Resolved Emission and Franck-Condon/Herzberg-Teller Activities; 1.9.3 Ir(btp)2(acac) Emission: Low-Temperature Vibrational Satellite Structure; 1.10 Environmental Effects on Triplet State Properties: Case Studies Applied to Ir(btp)(2)(acac); 1.10.1 Energy Distribution of Sites 1.10.2 Zero-Field Splittings at Different Sites |
| Record Nr. | UNINA-9910830955503321 |
| Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
III-Nitride LEDs : from UV to green / / Shengjun Zhou and Sheng Liu
| III-Nitride LEDs : from UV to green / / Shengjun Zhou and Sheng Liu |
| Autore | Zhou Shengjun <1958-> |
| Pubbl/distr/stampa | Gateway East, Singapore : , : Springer, , [2022] |
| Descrizione fisica | 1 online resource (244 pages) |
| Disciplina | 621.381522 |
| Collana | Advances in Optics and Optoelectronics. |
| Soggetto topico |
Nitrides
Light emitting diodes |
| ISBN | 981-19-0436-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Intro -- Preface -- Contents -- 1 Physics of III-Nitride Light-Emitting Diodes -- 1.1 History of III-Nitride LEDs -- 1.2 Mechanisms of III-Nitride LEDs -- 1.3 Radiative Recombination and Non-radiative Recombination -- 1.4 Internal Quantum Efficiency -- 1.5 Light Extraction Efficiency and External Quantum Efficiency -- References -- 2 Epitaxial Growth of III-Nitride LEDs -- 2.1 III-Nitride Blue LEDs -- 2.2 III-Nitride Green LEDs -- 2.2.1 InGaN/GaN Superlattice -- 2.2.2 Stacked GaN/AlN Last Quantum Barrier -- 2.3 III-Nitride Ultraviolet LEDs -- 2.3.1 Sputtered AlN Nucleation Layer -- 2.3.2 Effect of PSS on UV LED -- 2.3.3 Patterned Sapphire with Silica Array -- 2.3.4 Isoelectronic Doping -- 2.3.5 InAlGaN/AlGaN Electron Blocking Layer -- 2.3.6 Graded Al-Content AlGaN Insertion Layer -- References -- 3 High-Efficiency Top-Emitting III-Nitride LEDs -- 3.1 Light Extraction Microstructure -- 3.1.1 PSS and Patterned ITO -- 3.1.2 Double Layer ITO -- 3.1.3 3D Patterned ITO and Wavy Sidewalls -- 3.1.4 Roughened Sidewalls -- 3.1.5 Air Voids Structure -- 3.2 Current Blocking Layer -- 3.2.1 SiO2 Current Blocking Layer -- 3.2.2 Patterned Current Blocking Layer -- 3.2.3 Reflective Current Blocking Layer -- 3.3 Back Reflector -- 3.4 Low Optical Loss Electrode Structure -- 3.5 Ni/Au Wire Grid Transparent Conductive Electrodes -- References -- 4 Flip-Chip III-Nitride LEDs -- 4.1 Via-Hole-Based Two-Level Metallization Electrodes -- 4.2 Dielectric DBR -- 4.3 Comparison of Flip-Chip LEDs and Top-Emitting LEDs -- 4.4 Ag/TiW, Ni/Ag and ITO/DBR Ohmic Contacts -- 4.5 High-Power Flip-Chip LEDs -- 4.6 Double-Layer Electrode and Hybrid Reflector -- 4.7 Mini/Micro-LED -- 4.7.1 Prism-Structured Sidewall of Mini-LED -- 4.7.2 Light Extraction Analysis of Micro-LED -- References -- 5 High Voltage and Vertical LEDs -- 5.1 Direct Current High Voltage LED.
5.2 Alternating Current High Voltage LED -- 5.3 Comparison of DC-HV LED and AC-HV LED -- 5.4 Vertical LEDs -- References -- 6 Device Reliability and Measurement -- 6.1 Influence of Dislocation Density on Device Reliability -- 6.2 Forward Leakage Current -- 6.3 Reverse Leakage Current -- 6.4 Pad Luster Consistency -- 6.5 Transient Measurement of LED Characteristic Parameters -- References. |
| Record Nr. | UNISA-996475870103316 |
|
Zhou Shengjun <1958->
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| Gateway East, Singapore : , : Springer, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Soggetto topico
-
Light emitting diodes
(104)
- Solid state electronics (11)
- LED lighting (8)
- Diodes, Semiconductor (7)
- Nitrides (7)