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Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic
| Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic |
| Edizione | [5th ed.] |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2010 |
| Descrizione fisica | 1 online resource (749 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) |
PaunovicMilan
SchlesingerMordechay |
| Collana | The ECS series of texts and monographs |
| Soggetto topico |
Electroplating
Metals - Finishing |
| ISBN |
1-118-06314-7
1-283-37153-7 9786613371539 0-470-60262-7 0-470-60263-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL 26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX |
| Record Nr. | UNINA-9910133458303321 |
| Hoboken, NJ, : Wiley, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic
| Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic |
| Edizione | [5th ed.] |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2010 |
| Descrizione fisica | 1 online resource (749 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) |
PaunovicMilan
SchlesingerMordechay |
| Collana | The ECS series of texts and monographs |
| Soggetto topico |
Electroplating
Metals - Finishing |
| ISBN |
1-118-06314-7
1-283-37153-7 9786613371539 0-470-60262-7 0-470-60263-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL 26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX |
| Record Nr. | UNINA-9910826412903321 |
| Hoboken, NJ, : Wiley, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
The performance of three alternative coatings to electroplated cadmium for corrosion protection in fastener applications [[electronic resource] /] / Sean Peterson, Gary Wechsler, Marc Pepi
| The performance of three alternative coatings to electroplated cadmium for corrosion protection in fastener applications [[electronic resource] /] / Sean Peterson, Gary Wechsler, Marc Pepi |
| Autore | Peterson Sean |
| Pubbl/distr/stampa | Aberdeen Proving Ground, MD : , : Army Research Laboratory, , [1999] |
| Descrizione fisica | xiv, 82 pages : digital, PDF file |
| Altri autori (Persone) |
WechslerGary
PepiMarc |
| Collana | ARL-TR |
| Soggetto topico |
Coatings
Electroplating Weapons systems Cadmium |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910698065103321 |
Peterson Sean
|
||
| Aberdeen Proving Ground, MD : , : Army Research Laboratory, , [1999] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Symposium on Electroforming-Applications, Uses, and Properties of Electroformed Metals
| Symposium on Electroforming-Applications, Uses, and Properties of Electroformed Metals |
| Pubbl/distr/stampa | [Place of publication not identified], : American Society for Testing & Materials, 1962 |
| Descrizione fisica | 1 online resource (vii, 202 pages) |
| Disciplina | 671.732 |
| Soggetto topico |
Electroplating
Electroforming |
| ISBN | 0-8031-6748-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910164752703321 |
| [Place of publication not identified], : American Society for Testing & Materials, 1962 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Symposium on Properties, Tests, and Performance of Electrodeposited Metallic Coatings
| Symposium on Properties, Tests, and Performance of Electrodeposited Metallic Coatings |
| Autore | Pinner W |
| Pubbl/distr/stampa | [Place of publication not identified], : American Society for Testing & Materials, 1957 |
| Descrizione fisica | 1 online resource |
| Disciplina | 671.732 |
| Soggetto topico |
Electroplating
Steel |
| ISBN | 0-8031-6970-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910164749503321 |
|
Pinner W
|
||
| [Place of publication not identified], : American Society for Testing & Materials, 1957 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Thermodynamics and electrified interfaces / volume edited by E. Gileadi and M. Urbakh
| Thermodynamics and electrified interfaces / volume edited by E. Gileadi and M. Urbakh |
| Pubbl/distr/stampa | Weinheim : Wiley-VCH, c2002 |
| Descrizione fisica | x, 610 p. : ill. ; 25 cm |
| Disciplina | 541.37 |
| Altri autori (Persone) |
Gileadi, Eliezer
Urbakh, Michael, 1951- |
| Collana | Encyclopedia of electrochemistry ; v. 1 |
| Soggetto topico |
Electric double layer
Adsorption Electroplating |
| ISBN | 3527303936 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISALENTO-991001138159707536 |
| Weinheim : Wiley-VCH, c2002 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. del Salento | ||
| ||
Soggetto topico
-
Electroplating
(26)
- Crystal growth (4)
- Metals - Surfaces (4)
- Alloy plating (3)
- Nanowires (3)