| Nota di contenuto |
Front Cover -- Electronic Enclosures, Housings and Packages -- Related Titles -- Forthcoming -- Electronic Enclosures, Housings and Packages -- Copyright -- Contents -- 1 - Ubiquitous products -- 1 - An overview of enclosures, housings, and packages -- 1.1 A scenario from the world of enclosures -- 1.2 Definition -- 1.3 Introduction -- 1.4 The public facade -- 1.5 Labels -- 1.6 Discipline -- 1.7 The opportunity -- 1.8 Tech triangle -- 1.8.1 Fasteners -- 1.8.2 Connector problems -- 1.8.3 Heat management introduction -- 1.9 Review -- 1.10 Hot tips -- References -- 2 - Technological innovation -- 2.1 Significance -- 2.2 Innovation periods -- 2.2.1 Prehistoric -- 2.2.2 Antiquity -- 2.2.3 Middle Ages -- 2.2.4 First wave-mechanization -- 2.2.5 Second wave-steam -- 2.2.6 Third wave-electricity -- 2.2.7 Fourth wave-computer -- 2.2.8 Fifth wave-Internet -- 2.2.9 Sixth wave-Nanotech -- 2.3 Integration and reinterpretation -- 2.4 Review method -- 2.5 Disruptive technologies -- 2.5.1 Nonlinear optics -- 2.5.2 Spintronics -- 2.5.3 Memristors -- 2.5.4 2-D electronics -- 2.5.5 Organic electronics -- 2.5.6 Molecular electronics -- 2.6 Microelectromechanical systems -- 2.6.1 Developments -- 2.6.2 Definitions -- 2.6.3 Applications -- 2.6.3.1 Automotive airbag sensor -- 2.6.3.2 BioMEMS -- 2.6.3.3 Inkjet printer head -- 2.6.3.4 Medical pressure sensor -- 2.6.3.5 Microoptical-electromechanical systems -- 2.6.3.6 Overhead projection display -- 2.6.3.7 Radio frequency microelectromechanical system -- 2.6.4 Miniaturization issues -- 2.6.5 Industry challenges -- 2.6.5.1 Education and training -- 2.6.5.2 Design, simulation, and modeling -- 2.6.5.3 Packaging and testing -- 2.6.5.4 Standardization -- 2.6.5.5 Manufacturing -- 2.6.6 The future -- 2.7 Technology review -- 2.8 Hot tips -- References -- 3 - Market segments -- 3.1 Introduction -- 3.2 Aerospace and defense.
3.2.1 Avionics -- 3.2.2 Unmanned aerial vehicles -- 3.2.3 Defense applications -- 3.2.4 Space applications -- 3.3 Automotive -- 3.3.1 In-vehicle systems -- 3.3.2 Automated vehicle technologies -- 3.3.3 Connected vehicle technologies -- 3.4 Built environment (HVAC and vertical transport) -- 3.4.1 Light-emitting diodes -- 3.4.2 Heating, ventilation, and air conditioning -- 3.4.3 Elevators -- 3.4.4 Smart home -- 3.5 Chemicals and explosive environments -- 3.6 Consumer electronics -- 3.6.1 Displays -- 3.6.2 Head-mounted displays -- 3.6.3 Augmented reality -- 3.7 Electrical -- 3.8 Energy offshore (oil and gas) -- 3.9 Food, beverage, and tobacco -- 3.10 Instruments -- 3.11 Material handling -- 3.12 Medical device -- 3.13 Off-road, tracked, and other transport applications -- 3.14 Pharmaceuticals -- 3.15 Robotics -- 3.16 Review -- 3.17 Hot tips -- References -- 4 - Enclosure requirements -- 4.1 Introduction -- 4.2 Creating a functional requirement specification -- 4.3 Introduction of the functional requirement specification -- 4.4 ZZ introduction example -- 4.4.1 Engineering procedures and administration -- 4.5 Functional requirement specification overview -- 4.6 Product overview example -- 4.6.1 Frame and enclosure sizes -- 4.6.2 Levels of functionality -- 4.6.3 Cost -- 4.6.4 Multisourcing -- 4.6.5 Target dimensions -- 4.6.6 Projected annual volumes -- 4.7 Operating conditions -- 4.8 Operating conditions example -- 4.8.1 Operating ambient temperature range -- 4.8.2 Storage ambient temperature range -- 4.8.3 Rated altitude -- 4.8.4 Humidity -- 4.8.5 Audible noise -- 4.8.6 Vibration and robustness -- 4.9 Customization -- 4.10 Customization example -- 4.10.1 General description -- 4.10.2 Enclosure definition (drive standard IEC61800-5-1) -- 4.10.3 Customer options and kits -- 4.10.4 Factory-fit module -- 4.11 Aesthetics -- 4.12 Industrial design example.
4.13 Product safety -- 4.14 Product safety example -- 4.14.1 Conformance to standards -- 4.14.2 Ingress protection rating -- 4.14.3 Pollution degree -- 4.14.4 Protection from contact with live parts -- 4.14.5 Creepage and clearance -- 4.14.6 Polymeric flammability requirement -- 4.14.7 Safety labels and markings -- 4.14.8 Earth requirements -- 4.15 Construction -- 4.15.1 Design -- 4.15.2 Welding -- 4.15.3 Self-assembly and bolted construction -- 4.15.4 Casting -- 4.15.5 Vacuum forming -- 4.15.6 Extruding -- 4.15.7 Glass fiber molding -- 4.15.8 Injection molding -- 4.16 Construction example -- 4.16.1 General construction overview -- 4.16.2 Material topology -- 4.16.3 Reuse of parts -- 4.16.4 Mounting arrangements -- 4.16.4.1 Panel mount -- 4.16.4.2 DIN rail mount -- 4.16.4.3 Standard cabinets -- 4.16.4.4 Maintenance, addition, or removal of devices -- 4.16.5 Connectors -- 4.16.5.1 Printed circuit board interconnects -- 4.16.5.2 Factory-fit module connectors -- 4.16.5.3 User option modules interface -- 4.16.5.4 Power connectors -- 4.16.5.5 Power cable sizes -- 4.16.5.6 Terminal marking -- 4.16.6 User options -- 4.16.6.1 Connector kit -- 4.16.6.2 Bracket and mounting kits -- 4.16.6.3 Electromagnetic compatibility filters -- 4.16.6.4 User option modules -- 4.16.6.5 Brake resistor -- 4.16.6.6 Earth screening bracket -- 4.16.6.7 Additional busbar parts -- 4.16.6.8 User memory card -- 4.16.6.9 Ducting kit -- 4.16.6.10 Competitor adaptor brackets -- 4.16.6.11 Retrofit kit -- 4.16.7 Multiaxis systems -- 4.16.7.1 General notes -- 4.16.7.2 Safety -- 4.16.7.3 DC multiaxis connections -- 4.16.7.4 24V multiaxis connections -- 4.16.7.5 Communications -- 4.16.7.6 Earth busbar -- 4.16.8 Safety circuits (safe torque off) -- 4.16.9 User interface and display -- 4.16.9.1 Light-emitting diodes -- 4.16.9.2 Display -- 4.16.9.3 Remote keypad connection.
4.16.9.4 Reset button -- 4.17 Internal fittings -- 4.17.1 Plates -- 4.17.2 Studs and inserts -- 4.17.3 Rails -- 4.17.4 Racking -- 4.17.5 Brackets -- 4.17.6 Accessories -- 4.18 Locks and hinges -- 4.19 Lifting arrangements -- 4.19.1 Eyebolts -- 4.19.2 Practical advice -- 4.19.3 Thermal management -- 4.19.4 Thermal management example -- 4.19.4.1 Thermal analysis -- 4.19.5 System integration -- 4.19.6 Fan requirements -- 4.19.6.1 Electrical -- 4.19.6.2 Mechanical -- 4.19.6.3 Speed -- 4.19.6.4 Cost -- 4.19.6.5 Dimensions -- 4.19.6.6 Coating -- 4.19.6.7 Connector -- 4.19.6.8 Leads -- 4.19.6.9 Heat shrink tubing -- 4.19.7 Heat sinks -- 4.19.7.1 Material -- 4.19.7.2 Heat transfer surfaces -- 4.19.7.3 Non-heat transfer surfaces -- 4.19.7.4 Heat sink holes -- 4.19.7.5 Heat sink anodizing -- 4.19.7.6 Heat sink sizing -- 4.19.8 Printed circuit board cooling -- 4.20 Structural robustness -- 4.21 Structural robustness example -- 4.21.1 Polymeric enclosure -- 4.21.2 Impact resistance -- 4.21.3 Shock and vibration -- 4.21.4 Calculations and analysis -- 4.21.4.1 Static simulation -- 4.21.4.2 Dynamic simulation -- 4.21.5 Packaging -- 4.22 Materials -- 4.23 Materials example -- 4.23.1 Material selection -- 4.23.2 Polymeric material requirements -- 4.23.3 Polymeric enclosures and external parts -- 4.23.4 Polymeric internal parts -- 4.23.5 Other parts -- 4.23.6 Ultraviolet requirements of polymers -- 4.23.7 Gasket material requirements -- 4.23.8 Molding methods -- 4.23.9 Metallic material requirements -- 4.23.10 Copper conductors (bus bar and earth links) -- 4.23.11 Sheet steel requirements -- 4.23.12 Fasteners -- 4.23.12.1 Snap fit fasteners -- 4.23.12.2 Mechanical fasteners -- 4.23.12.3 Resistance to corrosion and degradation of materials -- 4.24 Design for maintenance -- 4.24.1 Installation -- 4.24.2 Site installation -- 4.24.3 Mounting -- 4.24.4 Cabling.
4.24.5 Inspection -- 4.25 Design for maintenance example -- 4.25.1 Design for dismantling -- 4.26 Harmful substance compliance -- 4.27 RoHS and REACH example -- 4.28 Design compliance -- 4.29 Design compliance example -- 4.30 Review -- 4.31 Hot tips -- References -- 5 - Types -- 5.1 Introduction -- 5.2 Levels -- 5.2.1 Level 0 semiconductor -- 5.2.2 Level 1 package -- 5.2.3 Level 2 printed circuit board -- 5.2.4 Level 3 subassemblies -- 5.2.5 Level 4 assembly -- 5.2.6 Level 5 system -- 5.2.7 Level 6 environment -- 5.2.8 Simplification -- 5.3 Packages -- 5.3.1 Timeline -- 5.3.2 Development drivers -- 5.3.3 Design considerations -- 5.3.3.1 Cost -- 5.3.3.2 Electrical functions -- 5.3.3.3 Mechanical and thermal -- 5.3.4 Through-hole packages -- 5.3.4.1 Pin grid arrays -- 5.3.5 Surface mount -- 5.3.5.1 Flat packages -- 5.3.5.2 Small outline packages -- 5.3.5.3 Chip Carrier -- 5.3.5.4 Ball grid array -- 5.3.6 Bare die -- 5.3.7 Chip-scale packages -- 5.3.8 Module assemblies -- 5.3.9 Advanced package substrates -- 5.3.10 System-in-Packages -- 5.3.11 Through-silicon-vias -- 5.4 Housings -- 5.4.1 Circuit board mounting -- 5.4.2 Backplane connections -- 5.4.3 Cabinets and racks as enclosures -- 5.4.4 Basic layout -- 5.4.5 Quick cooling guide -- 5.5 Enclosures -- 5.5.1 Small cabinets -- 5.5.2 Portable cabinets -- 5.5.3 Wall-mount cabinets -- 5.5.4 Chassis -- 5.5.5 Card racks -- 5.5.6 Rack-mount chassis -- 5.5.7 Open racks -- 5.5.8 Cabinet racks -- 5.5.9 Server racks and colocation racks -- 5.5.10 Seismic racks -- 5.6 Review -- 5.7 Hot tips -- References -- 6 - New product development -- 6.1 Introduction -- 6.2 What determines success? -- 6.3 Best current practice -- 6.4 Search for opportunities -- 6.4.1 End users -- 6.4.2 Intermediaries -- 6.4.3 Corporate capabilities -- 6.4.4 Technology -- 6.4.5 Intellectual property -- 6.4.6 Regulatory compliance.
6.5 Idea generation.
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Info
Conference on Electrical Performance of Electronic Packaging and Systems : [proceedings]
