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2022 International Conference on Electronics Packaging (ICEP) / / Institute of Electrical and Electronics Engineers
| 2022 International Conference on Electronics Packaging (ICEP) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2022 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| ISBN | 4-9911911-3-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2022 International Conference on Electronics Packaging |
| Record Nr. | UNISA-996575006203316 |
| Piscataway, New Jersey : , : IEEE, , 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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36th International Electronics Manufacturing Technology Conference : 11-13 November 2014
| 36th International Electronics Manufacturing Technology Conference : 11-13 November 2014 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2015 |
| Descrizione fisica | 1 online resource (428 pages) |
| Soggetto topico |
Electronic industries
Electronic packaging Electronic apparatus and appliances - Design and construction |
| ISBN | 1-4799-8209-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280275203316 |
| New York : , : IEEE, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
36th International Electronics Manufacturing Technology Conference : 11-13 November 2014
| 36th International Electronics Manufacturing Technology Conference : 11-13 November 2014 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2015 |
| Descrizione fisica | 1 online resource (428 pages) |
| Soggetto topico |
Electronic industries
Electronic packaging Electronic apparatus and appliances - Design and construction |
| ISBN | 1-4799-8209-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910135213203321 |
| New York : , : IEEE, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced flip chip packaging / / Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, editors
| Advanced flip chip packaging / / Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, editors |
| Edizione | [1st ed. 2013.] |
| Pubbl/distr/stampa | New York : , : Springer, , 2013 |
| Descrizione fisica | 1 online resource (vii, 560 pages) : illustrations (some color) |
| Disciplina |
621
621.381046 |
| Collana | Gale eBooks |
| Soggetto topico |
Flip chip technology
Electronic packaging |
| ISBN | 1-4419-5768-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages -- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints. |
| Record Nr. | UNINA-9910437892003321 |
| New York : , : Springer, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
| Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
| Descrizione fisica | 1 online resource (72 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) |
BaileyChristopher
LiuJohan |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Manufacturing processes
Electronic packaging |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
| Record Nr. | UNINA-9910450385003321 |
| Bradford, England, : Emerald Group Publishing, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
| Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
| Descrizione fisica | 1 online resource (72 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) |
BaileyChristopher
LiuJohan |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Manufacturing processes
Electronic packaging |
| ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
| Record Nr. | UNINA-9910783539503321 |
| Bradford, England, : Emerald Group Publishing, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
| Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
| Descrizione fisica | 1 online resource (72 p.) |
| Disciplina | 621.381/046 |
| Altri autori (Persone) |
BaileyChristopher
LiuJohan |
| Collana | Soldering & surface mount technology |
| Soggetto topico |
Manufacturing processes
Electronic packaging |
| ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
| Record Nr. | UNINA-9910825844003321 |
| Bradford, England, : Emerald Group Publishing, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / / edited by Andy Wu
| Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / / edited by Andy Wu |
| Pubbl/distr/stampa | Zurich, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (245 p.) |
| Disciplina | 621.381 |
| Collana | Applied Mechanics and Materials |
| Soggetto topico |
Electronic apparatus and appliances
Electronic packaging Microelectronic packaging Manufacturing processes |
| Soggetto genere / forma | Electronic books. |
| ISBN | 3-03826-394-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Components, Packaging and Manufacturing Technology II; Preface and Organizing Committee; Table of Contents; Chapter 1: Materials Science and Materials Processing Technology; Precise Determination of Band Gap Naturally via Absorption/Reflectance/Transmission Spectra; Preparation and Rheological Characterization of Cross-Linked Dialdehyde Carboxymethyl Cellulose; The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging; The Status and Development of ECAP; Chapter 2: Mechanics; Dynamic Torsional Response of a Pile Partially Embedded in Saturated Soil
Research on Internal Flow Field Simulation of Hydropower Station Pressure Steel Pipe Based on FLUENTA Discrimination Method of Saturated Sand Liquefaction Possibility Based on Support Vector Machine; Dragon Boat Straight Road Racing Rowing Technique Mechanical Movement Analysis; Dragon Boat Technology on the Influence of Fluid Mechanics Research; Vortex Stability Analysis Based on Coupling the Rubbing with BTA Boring Bar; Development and Application on Ultrahigh Speed Grinding Processing Technology; Chapter 3: Modelling, Design and Manufacturing Multi-Objective Optimization of Vehicle Air Suspension Based on Simulink-Mfile Mixed ProgrammingImpacts of Solder Voids on Power Devices' Thermal Characteristics; Research on Five-Axis NC Machining Simulation for Four-Blade Propeller Based on UG&VERICUT; Investigation on Aerodynamic Configuration of Monitoring Long Endurance UAV; Passenger Vehicle Clutch Reliability Optimization Based on the Stress-Strength Interference Model; Modularization Technology Development Prospects; Design and Manufacture of a Forehand Attack Exercising Device for Teaching and Training of Table Tennis Development and Manufacture on the New Yoga Exercising DeviceResearch on Compensation Correction of Leak Impact Factor of Kent Index Method; Application of MATLAB in Mechanical Optimal Design; Analysis of Performance of Automotive Exhaust Muffler Based on ANSYS Finite Element; Theoretical Research on a New Type Tube-in-Tube Evaporative Condenser; Study on 3D Modeling and Flow Field Simulation of Urea-SCR Catalytic Converter; Numerical Simulation for Perforation-Caused Leakage Diffusion of Buried Gas Pipeline Numerical Study on Heat Exchange Characteristics of Runways with Snow-Melting System Using Geothermal SourcesResearch of the Assembly Model Based on Parts Attribute Semantic; Chapter 4: Automation, Control, Information Technology and MEMS; Slant-Face Fiber Side Coupling of Vertical Cavity Surface Emitting Laser; The Relationships of Prior Information and Interval Partition on the Forecasting Effect of Fuzzy Time Series Two-Factor Model; Research on the Behavior of Intelligent Role in Computer Games Based on Behavior Tree; Building the Audit Information System in Cloud Computing Environment Study of Map-Reduce over Hadoop Based Cloud Computing Environment |
| Record Nr. | UNINA-9910464402103321 |
| Zurich, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / / edited by Andy Wu
| Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / / edited by Andy Wu |
| Pubbl/distr/stampa | Zurich, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (245 p.) |
| Disciplina | 621.381 |
| Collana | Applied Mechanics and Materials |
| Soggetto topico |
Electronic apparatus and appliances
Electronic packaging Microelectronic packaging Manufacturing processes |
| ISBN | 3-03826-394-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Components, Packaging and Manufacturing Technology II; Preface and Organizing Committee; Table of Contents; Chapter 1: Materials Science and Materials Processing Technology; Precise Determination of Band Gap Naturally via Absorption/Reflectance/Transmission Spectra; Preparation and Rheological Characterization of Cross-Linked Dialdehyde Carboxymethyl Cellulose; The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging; The Status and Development of ECAP; Chapter 2: Mechanics; Dynamic Torsional Response of a Pile Partially Embedded in Saturated Soil
Research on Internal Flow Field Simulation of Hydropower Station Pressure Steel Pipe Based on FLUENTA Discrimination Method of Saturated Sand Liquefaction Possibility Based on Support Vector Machine; Dragon Boat Straight Road Racing Rowing Technique Mechanical Movement Analysis; Dragon Boat Technology on the Influence of Fluid Mechanics Research; Vortex Stability Analysis Based on Coupling the Rubbing with BTA Boring Bar; Development and Application on Ultrahigh Speed Grinding Processing Technology; Chapter 3: Modelling, Design and Manufacturing Multi-Objective Optimization of Vehicle Air Suspension Based on Simulink-Mfile Mixed ProgrammingImpacts of Solder Voids on Power Devices' Thermal Characteristics; Research on Five-Axis NC Machining Simulation for Four-Blade Propeller Based on UG&VERICUT; Investigation on Aerodynamic Configuration of Monitoring Long Endurance UAV; Passenger Vehicle Clutch Reliability Optimization Based on the Stress-Strength Interference Model; Modularization Technology Development Prospects; Design and Manufacture of a Forehand Attack Exercising Device for Teaching and Training of Table Tennis Development and Manufacture on the New Yoga Exercising DeviceResearch on Compensation Correction of Leak Impact Factor of Kent Index Method; Application of MATLAB in Mechanical Optimal Design; Analysis of Performance of Automotive Exhaust Muffler Based on ANSYS Finite Element; Theoretical Research on a New Type Tube-in-Tube Evaporative Condenser; Study on 3D Modeling and Flow Field Simulation of Urea-SCR Catalytic Converter; Numerical Simulation for Perforation-Caused Leakage Diffusion of Buried Gas Pipeline Numerical Study on Heat Exchange Characteristics of Runways with Snow-Melting System Using Geothermal SourcesResearch of the Assembly Model Based on Parts Attribute Semantic; Chapter 4: Automation, Control, Information Technology and MEMS; Slant-Face Fiber Side Coupling of Vertical Cavity Surface Emitting Laser; The Relationships of Prior Information and Interval Partition on the Forecasting Effect of Fuzzy Time Series Two-Factor Model; Research on the Behavior of Intelligent Role in Computer Games Based on Behavior Tree; Building the Audit Information System in Cloud Computing Environment Study of Map-Reduce over Hadoop Based Cloud Computing Environment |
| Record Nr. | UNINA-9910789105903321 |
| Zurich, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / / edited by Andy Wu
| Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia / / edited by Andy Wu |
| Pubbl/distr/stampa | Zurich, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (245 p.) |
| Disciplina | 621.381 |
| Collana | Applied Mechanics and Materials |
| Soggetto topico |
Electronic apparatus and appliances
Electronic packaging Microelectronic packaging Manufacturing processes |
| ISBN | 3-03826-394-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Components, Packaging and Manufacturing Technology II; Preface and Organizing Committee; Table of Contents; Chapter 1: Materials Science and Materials Processing Technology; Precise Determination of Band Gap Naturally via Absorption/Reflectance/Transmission Spectra; Preparation and Rheological Characterization of Cross-Linked Dialdehyde Carboxymethyl Cellulose; The Curing Behavior of Organosilicone Materials for Large-Power LED Packaging; The Status and Development of ECAP; Chapter 2: Mechanics; Dynamic Torsional Response of a Pile Partially Embedded in Saturated Soil
Research on Internal Flow Field Simulation of Hydropower Station Pressure Steel Pipe Based on FLUENTA Discrimination Method of Saturated Sand Liquefaction Possibility Based on Support Vector Machine; Dragon Boat Straight Road Racing Rowing Technique Mechanical Movement Analysis; Dragon Boat Technology on the Influence of Fluid Mechanics Research; Vortex Stability Analysis Based on Coupling the Rubbing with BTA Boring Bar; Development and Application on Ultrahigh Speed Grinding Processing Technology; Chapter 3: Modelling, Design and Manufacturing Multi-Objective Optimization of Vehicle Air Suspension Based on Simulink-Mfile Mixed ProgrammingImpacts of Solder Voids on Power Devices' Thermal Characteristics; Research on Five-Axis NC Machining Simulation for Four-Blade Propeller Based on UG&VERICUT; Investigation on Aerodynamic Configuration of Monitoring Long Endurance UAV; Passenger Vehicle Clutch Reliability Optimization Based on the Stress-Strength Interference Model; Modularization Technology Development Prospects; Design and Manufacture of a Forehand Attack Exercising Device for Teaching and Training of Table Tennis Development and Manufacture on the New Yoga Exercising DeviceResearch on Compensation Correction of Leak Impact Factor of Kent Index Method; Application of MATLAB in Mechanical Optimal Design; Analysis of Performance of Automotive Exhaust Muffler Based on ANSYS Finite Element; Theoretical Research on a New Type Tube-in-Tube Evaporative Condenser; Study on 3D Modeling and Flow Field Simulation of Urea-SCR Catalytic Converter; Numerical Simulation for Perforation-Caused Leakage Diffusion of Buried Gas Pipeline Numerical Study on Heat Exchange Characteristics of Runways with Snow-Melting System Using Geothermal SourcesResearch of the Assembly Model Based on Parts Attribute Semantic; Chapter 4: Automation, Control, Information Technology and MEMS; Slant-Face Fiber Side Coupling of Vertical Cavity Surface Emitting Laser; The Relationships of Prior Information and Interval Partition on the Forecasting Effect of Fuzzy Time Series Two-Factor Model; Research on the Behavior of Intelligent Role in Computer Games Based on Behavior Tree; Building the Audit Information System in Cloud Computing Environment Study of Map-Reduce over Hadoop Based Cloud Computing Environment |
| Record Nr. | UNINA-9910820211603321 |
| Zurich, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
