IWIPP proceedings : IEEE International Workshop on Integrated Power Packaging : the Congress Plaza Hotel, Chicago, Illinois, USA, September 17-19, 1998 |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
Disciplina | 621.381/045 |
Soggetto topico |
Electronic packaging
Power electronics Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910872658803321 |
[Place of publication not identified], : IEEE, 1998 | ||
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Lo trovi qui: Univ. Federico II | ||
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Journal of electronic packaging |
Pubbl/distr/stampa | New York, NY, : ASME, 1989- |
Soggetto topico | Electronic packaging |
ISSN | 1528-9044 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910143393103321 |
New York, NY, : ASME, 1989- | ||
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Lo trovi qui: Univ. Federico II | ||
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Journal of electronics manufacturing |
Pubbl/distr/stampa | London, : Chapman & Hall, ©1991-2002 |
Descrizione fisica | 1 online resource |
Disciplina | 621.381 |
Soggetto topico |
Electronic industries
Electronic apparatus and appliances - Design and construction Electronic packaging |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996216575703316 |
London, : Chapman & Hall, ©1991-2002 | ||
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Lo trovi qui: Univ. di Salerno | ||
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Journal of electronics manufacturing |
Pubbl/distr/stampa | London, : Chapman & Hall, ©1991-2002 |
Descrizione fisica | 1 online resource |
Disciplina | 621.381 |
Soggetto topico |
Electronic industries
Electronic apparatus and appliances - Design and construction Electronic packaging |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910172131603321 |
London, : Chapman & Hall, ©1991-2002 | ||
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Lo trovi qui: Univ. Federico II | ||
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Journal of microelectronics and electronic packaging |
Pubbl/distr/stampa | Washington, DC, : International Microelectronics and Packaging Society, 2004- |
Descrizione fisica | 1 online resource |
Disciplina | 621.381/046/05 |
Soggetto topico |
Microelectronics
Electronic packaging Microelectronic packaging |
Soggetto genere / forma | Periodicals. |
ISSN | 1555-8037 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910338748403321 |
Washington, DC, : International Microelectronics and Packaging Society, 2004- | ||
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Lo trovi qui: Univ. Federico II | ||
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Lead-free soldering process development and reliability / / edited by Jasbir Bath |
Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , 2020 |
Descrizione fisica | 1 online resource (515 pages) |
Disciplina | 621.381/046 |
Collana | Wiley Series in Quality & Reliability Engineering |
Soggetto topico |
Electronic packaging
Solder and soldering |
ISBN |
1-119-48204-6
1-119-48209-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910554854203321 |
Hoboken, New Jersey : , : Wiley, , 2020 | ||
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Lo trovi qui: Univ. Federico II | ||
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Lead-free soldering process development and reliability / / edited by Jasbir Bath |
Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , 2020 |
Descrizione fisica | 1 online resource (515 pages) |
Disciplina | 621.381/046 |
Collana | Wiley Series in Quality & Reliability Engineering |
Soggetto topico |
Electronic packaging
Solder and soldering |
ISBN |
1-119-48204-6
1-119-48209-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910824582703321 |
Hoboken, New Jersey : , : Wiley, , 2020 | ||
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Lo trovi qui: Univ. Federico II | ||
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LED packaging for lighting applications [[electronic resource] ] : design, manufacturing, and testing / / Sheng Liu, Xiaobing Luo |
Autore | Liu S (Sheng), <1963-> |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2011 |
Descrizione fisica | 1 online resource (376 p.) |
Disciplina | 621.3815/22 |
Altri autori (Persone) | LuoXiaobing <1974-> |
Soggetto topico |
Light emitting diodes - Design and construction
Light emitting diodes - Computer simulation Electronic packaging Electric lighting - Equipment and supplies |
ISBN |
0-470-82840-4
1-283-20357-X 9786613203571 0-470-82785-8 0-470-82784-X |
Classificazione | TEC008010 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
LED Packaging for Lighting Applications: Design, Manufacturing and Testing; Contents; Foreword By Magnus George Craford; Foreword By C. P. Wong; Foreword By B. J. Lee; Preface; Acknowledgments; About the Authors; 1 Introduction; 1.1 Historical Evolution of Lighting Technology; 1.2 Development of LEDs; 1.3 Basic Physics of LEDs; 1.3.1 Materials; 1.3.2 Electrical and Optical Properties; 1.3.3 Mechanical and Thermal Properties; 1.4 Industrial Chain of LED; 1.4.1 LED Upstream Industry; 1.4.2 LED Midstream Industry; 1.4.3 LED Downstream Industry; 1.5 Summary; References
2 Fundamentals and Development Trends of High Power LED Packaging2.1 Brief Introduction to Electronic Packaging; 2.1.1 About Electronic Packaging and Its Evolution; 2.1.2 Wafer Level Packaging, More than Moore, and SiP; 2.2 LED Chips; 2.2.1 Current Spreading Efficiency; 2.2.2 Internal Quantum Efficiency; 2.2.3 High Light Extraction Efficiency; 2.3 Types and Functions of LED Packaging; 2.3.1 Low Power LED Packaging; 2.3.2 High Power LED Packaging; 2.4 Key Factors and System Design of High Power LED Packaging; 2.5 Development Trends and Roadmap; 2.5.1 Technology Needs; 2.5.2 Packaging Types 2.6 SummaryReferences; 3 Optical Design of High Power LED Packaging Module; 3.1 Properties of LED Light; 3.1.1 Light Frequency and Wavelength; 3.1.2 Spectral Distribution; 3.1.3 Flux of Light; 3.1.4 Lumen Efficiency; 3.1.5 Luminous Intensity, Illuminance and Luminance; 3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index; 3.1.7 White Light LED; 3.2 Key Components and Packaging Processes for Optical Design; 3.2.1 Chip Types and Bonding Process; 3.2.2 Phosphor Materials and Phosphor Coating Processes; 3.2.3 Lens and Molding Process; 3.3 Light Extraction 3.4 Optical Modeling and Simulation3.4.1 Chip Modeling; 3.4.2 Phosphor Modeling; 3.5 Phosphor for White LED Packaging; 3.5.1 Phosphor Location for White LED Packaging; 3.5.2 Phosphor Thickness and Concentration for White LED Packaging; 3.5.3 Phosphor for Spatial Color Distribution; 3.6 Collaborative Design; 3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages; 3.6.2 Application Specific LED Packages; 3.7 Summary; References; 4 Thermal Management of High Power LED Packaging Module; 4.1 Basic Concepts of Heat Transfer; 4.1.1 Conduction Heat Transfer 4.1.2 Convection Heat Transfer4.1.3 Thermal Radiation; 4.1.4 Thermal Resistance; 4.2 Thermal Resistance Analysis of Typical LED Packaging; 4.3 Various LED Packages for Decreasing Thermal Resistance; 4.3.1 Development of LED Packaging; 4.3.2 Thermal Resistance Decrease for LED Packaging; 4.3.3 SiP/COB LED Chip Packaging Process; 4.4 Summary; References; 5 Reliability Engineering of High Power LED Packaging; 5.1 Concept of Design for Reliability (DfR) and Reliability Engineering; 5.1.1 Fundamentals of Reliability; 5.1.2 Life Distribution; 5.1.3 Accelerated Models; 5.1.4 Applied Mechanics 5.2 High Power LED Packaging Reliability Test |
Record Nr. | UNINA-9910137855403321 |
Liu S (Sheng), <1963->
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Hoboken, N.J., : Wiley, 2011 | ||
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Lo trovi qui: Univ. Federico II | ||
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LED packaging for lighting applications [[electronic resource] ] : design, manufacturing, and testing / / Sheng Liu, Xiaobing Luo |
Autore | Liu S (Sheng), <1963-> |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2011 |
Descrizione fisica | 1 online resource (376 p.) |
Disciplina | 621.3815/22 |
Altri autori (Persone) | LuoXiaobing <1974-> |
Soggetto topico |
Light emitting diodes - Design and construction
Light emitting diodes - Computer simulation Electronic packaging Electric lighting - Equipment and supplies |
ISBN |
0-470-82840-4
1-283-20357-X 9786613203571 0-470-82785-8 0-470-82784-X |
Classificazione | TEC008010 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
LED Packaging for Lighting Applications: Design, Manufacturing and Testing; Contents; Foreword By Magnus George Craford; Foreword By C. P. Wong; Foreword By B. J. Lee; Preface; Acknowledgments; About the Authors; 1 Introduction; 1.1 Historical Evolution of Lighting Technology; 1.2 Development of LEDs; 1.3 Basic Physics of LEDs; 1.3.1 Materials; 1.3.2 Electrical and Optical Properties; 1.3.3 Mechanical and Thermal Properties; 1.4 Industrial Chain of LED; 1.4.1 LED Upstream Industry; 1.4.2 LED Midstream Industry; 1.4.3 LED Downstream Industry; 1.5 Summary; References
2 Fundamentals and Development Trends of High Power LED Packaging2.1 Brief Introduction to Electronic Packaging; 2.1.1 About Electronic Packaging and Its Evolution; 2.1.2 Wafer Level Packaging, More than Moore, and SiP; 2.2 LED Chips; 2.2.1 Current Spreading Efficiency; 2.2.2 Internal Quantum Efficiency; 2.2.3 High Light Extraction Efficiency; 2.3 Types and Functions of LED Packaging; 2.3.1 Low Power LED Packaging; 2.3.2 High Power LED Packaging; 2.4 Key Factors and System Design of High Power LED Packaging; 2.5 Development Trends and Roadmap; 2.5.1 Technology Needs; 2.5.2 Packaging Types 2.6 SummaryReferences; 3 Optical Design of High Power LED Packaging Module; 3.1 Properties of LED Light; 3.1.1 Light Frequency and Wavelength; 3.1.2 Spectral Distribution; 3.1.3 Flux of Light; 3.1.4 Lumen Efficiency; 3.1.5 Luminous Intensity, Illuminance and Luminance; 3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index; 3.1.7 White Light LED; 3.2 Key Components and Packaging Processes for Optical Design; 3.2.1 Chip Types and Bonding Process; 3.2.2 Phosphor Materials and Phosphor Coating Processes; 3.2.3 Lens and Molding Process; 3.3 Light Extraction 3.4 Optical Modeling and Simulation3.4.1 Chip Modeling; 3.4.2 Phosphor Modeling; 3.5 Phosphor for White LED Packaging; 3.5.1 Phosphor Location for White LED Packaging; 3.5.2 Phosphor Thickness and Concentration for White LED Packaging; 3.5.3 Phosphor for Spatial Color Distribution; 3.6 Collaborative Design; 3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages; 3.6.2 Application Specific LED Packages; 3.7 Summary; References; 4 Thermal Management of High Power LED Packaging Module; 4.1 Basic Concepts of Heat Transfer; 4.1.1 Conduction Heat Transfer 4.1.2 Convection Heat Transfer4.1.3 Thermal Radiation; 4.1.4 Thermal Resistance; 4.2 Thermal Resistance Analysis of Typical LED Packaging; 4.3 Various LED Packages for Decreasing Thermal Resistance; 4.3.1 Development of LED Packaging; 4.3.2 Thermal Resistance Decrease for LED Packaging; 4.3.3 SiP/COB LED Chip Packaging Process; 4.4 Summary; References; 5 Reliability Engineering of High Power LED Packaging; 5.1 Concept of Design for Reliability (DfR) and Reliability Engineering; 5.1.1 Fundamentals of Reliability; 5.1.2 Life Distribution; 5.1.3 Accelerated Models; 5.1.4 Applied Mechanics 5.2 High Power LED Packaging Reliability Test |
Record Nr. | UNINA-9910817220603321 |
Liu S (Sheng), <1963->
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Hoboken, N.J., : Wiley, 2011 | ||
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Lo trovi qui: Univ. Federico II | ||
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Microelectronics international : journal of ISHM--Europe, the Microelectronics Society--Europe |
Pubbl/distr/stampa | Isle of Man, : Wela Publications, ©1995- |
Descrizione fisica | 1 online resource |
Disciplina | 621.381 |
Soggetto topico |
Microelectronics
Hybrid integrated circuits Semiconductors Electronic packaging |
Soggetto genere / forma | Periodicals. |
ISSN | 1758-812X |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Periodico |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996398436203316 |
Isle of Man, : Wela Publications, ©1995- | ||
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Lo trovi qui: Univ. di Salerno | ||
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