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IEEE transactions on electronics packaging manufacturing : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society
IEEE transactions on electronics packaging manufacturing : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society
Pubbl/distr/stampa New York, NY, : Institute of Electrical and Electronics Engineers, ©1999-
Disciplina 621.3
Soggetto topico Electronic apparatus and appliances - Design and construction
Manufacturing processes
Electronic industries
Electronic packaging
Production engineering
Mise sous boîtier (Électronique)
Fabrication
Industries électroniques
Appareils électroniques - Conception et construction
Technique de la production
Soggetto genere / forma Periodicals.
ISSN 1558-0822
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Altri titoli varianti Transactions on electronics packaging manufacturing
Electronics packaging manufacturing
Institute of Electrical and Electronics Engineers transactions on electronics packaging manufacturing
Electronics packaging manufacturing, IEEE transactions on
Record Nr. UNINA-9910626117903321
New York, NY, : Institute of Electrical and Electronics Engineers, ©1999-
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
IEMT : 2018 IEEE 38th International Electronics Manufacturing Technology Conference : 4-6 September 2018, Melaka, Malaysia / / Institute of Electrical and Electronics Engineers
IEMT : 2018 IEEE 38th International Electronics Manufacturing Technology Conference : 4-6 September 2018, Melaka, Malaysia / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Descrizione fisica 1 online resource (686 pages)
Disciplina 621.381
Soggetto topico Electronic industries
Electronic packaging
ISBN 1-5386-6211-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996280105303316
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
IEMT : 2018 IEEE 38th International Electronics Manufacturing Technology Conference : 4-6 September 2018, Melaka, Malaysia / / Institute of Electrical and Electronics Engineers
IEMT : 2018 IEEE 38th International Electronics Manufacturing Technology Conference : 4-6 September 2018, Melaka, Malaysia / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Descrizione fisica 1 online resource (686 pages)
Disciplina 621.381
Soggetto topico Electronic industries
Electronic packaging
ISBN 1-5386-6211-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910291756803321
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
IEMT 2006 : 31st International Conference on Electronics Manufacturing and Technology : 8-10 November, 2006, Sunway Resort Hotel, Petaling Jaya, Malaysia / / editors, Azhar Aripin ... [et al.] ; [jointly organized by IEEE ... [et al.]]
IEMT 2006 : 31st International Conference on Electronics Manufacturing and Technology : 8-10 November, 2006, Sunway Resort Hotel, Petaling Jaya, Malaysia / / editors, Azhar Aripin ... [et al.] ; [jointly organized by IEEE ... [et al.]]
Pubbl/distr/stampa IEEE
Altri autori (Persone) AripinAzhar
Soggetto topico Electronic apparatus and appliances - Design and construction
Electronic packaging
Semiconductors - Design and construction
ISBN 1-5090-9152-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Autonomic Computing
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium
Record Nr. UNISA-996211562403316
IEEE
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
IEMT 2006 : 31st International Conference on Electronics Manufacturing and Technology : 8-10 November, 2006, Sunway Resort Hotel, Petaling Jaya, Malaysia / / editors, Azhar Aripin ... [et al.] ; [jointly organized by IEEE ... [et al.]]
IEMT 2006 : 31st International Conference on Electronics Manufacturing and Technology : 8-10 November, 2006, Sunway Resort Hotel, Petaling Jaya, Malaysia / / editors, Azhar Aripin ... [et al.] ; [jointly organized by IEEE ... [et al.]]
Pubbl/distr/stampa IEEE
Altri autori (Persone) AripinAzhar
Soggetto topico Electronic apparatus and appliances - Design and construction
Electronic packaging
Semiconductors - Design and construction
ISBN 1-5090-9152-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Autonomic Computing
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium
Record Nr. UNINA-9910138943203321
IEEE
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
International Symposium for Design and Technology of Electronics Packages : [proceedings]
International Symposium for Design and Technology of Electronics Packages : [proceedings]
Pubbl/distr/stampa Cluj-Napoca [Romania], : Mediamira
Descrizione fisica 1 online resource
Soggetto topico Electronic packaging
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Record Nr. UNISA-996279298103316
Cluj-Napoca [Romania], : Mediamira
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong
International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2000
Disciplina 621.381/046
Soggetto topico Electronic packaging
Electrical & Computer Engineering
Electrical Engineering
Engineering & Applied Sciences
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996215173303316
[Place of publication not identified], : IEEE, 2000
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
International Symposium on Electronic Materials and Packing 2002
International Symposium on Electronic Materials and Packing 2002
Pubbl/distr/stampa [Place of publication not identified], : I E E E, 2002
Descrizione fisica 1 online resource (xv, 498 pages) : illustrations
Disciplina 621.381/046
Soggetto topico Electronic packaging
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996202487903316
[Place of publication not identified], : I E E E, 2002
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
IWIPP : 2017 IEEE International Workshop On Integrated Power Packaging : 5-7 April 2017
IWIPP : 2017 IEEE International Workshop On Integrated Power Packaging : 5-7 April 2017
Pubbl/distr/stampa New York : , : IEEE, , 2017
Descrizione fisica 1 online resource (225 pages)
Soggetto topico Electronic packaging
Power electronics - Packaging
ISBN 1-5090-4278-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996280479103316
New York : , : IEEE, , 2017
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
IWIPP : 2017 IEEE International Workshop On Integrated Power Packaging : 5-7 April 2017
IWIPP : 2017 IEEE International Workshop On Integrated Power Packaging : 5-7 April 2017
Pubbl/distr/stampa New York : , : IEEE, , 2017
Descrizione fisica 1 online resource (225 pages)
Soggetto topico Electronic packaging
Power electronics - Packaging
ISBN 1-5090-4278-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910209342403321
New York : , : IEEE, , 2017
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui