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ESTC : proceedings of the 5th Electronics System-integration Technology Conference : 16-18 September 2014, Helsinki, Finland / / Institute of Electrical and Electronics Engineers
| ESTC : proceedings of the 5th Electronics System-integration Technology Conference : 16-18 September 2014, Helsinki, Finland / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2014 |
| Descrizione fisica | 1 online resource (157 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Electronic packaging
Microelectronics Integrated circuits |
| ISBN | 1-4799-4026-7 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910135196803321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Finite width coplanar waveguide patch antenna with vertical fed through interconnect / / Rainee N. Simons [and six others]
| Finite width coplanar waveguide patch antenna with vertical fed through interconnect / / Rainee N. Simons [and six others] |
| Autore | Simons Rainee <1949-> |
| Pubbl/distr/stampa | Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , June 1996 |
| Descrizione fisica | 1 online resource (4 pages) : illustrations |
| Collana | NASA technical memorandum |
| Soggetto topico |
Waveguide antennas
Planar structures Microwave antennas Microwave transmission Electronic packaging |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910707034303321 |
Simons Rainee <1949->
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| Cleveland, Ohio : , : National Aeronautics and Space Administration, Lewis Research Center, , June 1996 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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HDP '04 : proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis : June 30-July 3, 2004, Bao Long Hotel, Shanghai, China / / organized by Institute of Electrical and Electronics Engineers [and fifteen others]
| HDP '04 : proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis : June 30-July 3, 2004, Bao Long Hotel, Shanghai, China / / organized by Institute of Electrical and Electronics Engineers [and fifteen others] |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2004 |
| Descrizione fisica | 1 online resource (395 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits - Design and construction
Electronic packaging Microelectromechanical systems |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996202159803316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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ICEP-IAAC : 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference : Hotel Hanamizuki, Kuwana, Mie, Japan : April 17-21 / / sponsored by Japan Institute of Electronics Packaging [and three others]
| ICEP-IAAC : 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference : Hotel Hanamizuki, Kuwana, Mie, Japan : April 17-21 / / sponsored by Japan Institute of Electronics Packaging [and three others] |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (584 pages) |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| ISBN | 4-9902188-5-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280711003316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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ICEP-IAAC : 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference : Hotel Hanamizuki, Kuwana, Mie, Japan : April 17-21 / / sponsored by Japan Institute of Electronics Packaging [and three others]
| ICEP-IAAC : 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference : Hotel Hanamizuki, Kuwana, Mie, Japan : April 17-21 / / sponsored by Japan Institute of Electronics Packaging [and three others] |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (584 pages) |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| ISBN | 4-9902188-5-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910280913003321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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ICEPT2003 : Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China
| ICEPT2003 : Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2003 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Electronic packaging
Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996202926103316 |
| [Place of publication not identified], : IEEE, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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ICET : 2018 International Conference on Electronics Technology : May 23-27, 2018, Chengdu, China / / Institute of Electrical and Electronics Engineers
| ICET : 2018 International Conference on Electronics Technology : May 23-27, 2018, Chengdu, China / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (xi, 445 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics
Electronic packaging |
| ISBN | 1-5386-5752-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280710703316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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ICET : 2018 International Conference on Electronics Technology : May 23-27, 2018, Chengdu, China / / Institute of Electrical and Electronics Engineers
| ICET : 2018 International Conference on Electronics Technology : May 23-27, 2018, Chengdu, China / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (xi, 445 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics
Electronic packaging |
| ISBN | 1-5386-5752-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910280912903321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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IEEE ... International Symposium for Design and Technology of Electronics Packages (SIITME)
| IEEE ... International Symposium for Design and Technology of Electronics Packages (SIITME) |
| Pubbl/distr/stampa | [Piscataway, NJ] : , : [IEEE] |
| Descrizione fisica | online resource |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| Soggetto genere / forma |
Periodicals.
Conference papers and proceedings. |
| ISSN | 2642-7036 |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
Design and Technology in Electronic Packaging (SIITME), ... IEEE ... International Symposium for
SIITME .. |
| Record Nr. | UNINA-9910626198303321 |
| [Piscataway, NJ] : , : [IEEE] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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IEEE ... International Symposium for Design and Technology of Electronics Packages (SIITME)
| IEEE ... International Symposium for Design and Technology of Electronics Packages (SIITME) |
| Pubbl/distr/stampa | [Piscataway, NJ] : , : [IEEE] |
| Descrizione fisica | online resource |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| Soggetto genere / forma |
Periodicals.
Conference papers and proceedings. |
| ISSN | 2642-7036 |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
Design and Technology in Electronic Packaging (SIITME), ... IEEE ... International Symposium for
SIITME .. |
| Record Nr. | UNISA-996581479003316 |
| [Piscataway, NJ] : , : [IEEE] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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