Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on / / Institute of Electrical and Electronics Engineers |
Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2007 |
Descrizione fisica | 1 online resource |
Disciplina | 621.381046 |
Soggetto topico | Electronic packaging |
ISBN | 1-5090-8969-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Altri titoli varianti |
2007 8th International Conference on Electronic Packaging Technology
Micro-Nanoelectronics Technology and Applications |
Record Nr. | UNINA-9910144963503321 |
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2007 | ||
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Lo trovi qui: Univ. Federico II | ||
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Electronics packaging technology conference : proceedings of 6th Electronics Packaging Technology Conference : (EPTC 2004) : 8-10 December, 2004, Pan Pacific Hotel, Singapore |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2004 |
Disciplina | 621.381/046 |
Soggetto topico |
Electronic packaging
Microelectronics Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996204487303316 |
[Place of publication not identified], : IEEE, 2004 | ||
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Lo trovi qui: Univ. di Salerno | ||
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Electronics packaging technology conference : proceedings of 6th Electronics Packaging Technology Conference : (EPTC 2004) : 8-10 December, 2004, Pan Pacific Hotel, Singapore |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2004 |
Disciplina | 621.381/046 |
Soggetto topico |
Electronic packaging
Microelectronics Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910872512403321 |
[Place of publication not identified], : IEEE, 2004 | ||
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Lo trovi qui: Univ. Federico II | ||
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Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th / / Institute of Electrical and Electronics Engineers |
Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2007 |
Descrizione fisica | 1 online resource |
Disciplina | 621.381046 |
Soggetto topico |
Electronic packaging
Microelectronics |
ISBN | 1-5090-9014-2 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Altri titoli varianti |
2007 9th Electronics Packaging Technology Conference
Microoelectronics and Electron Devices |
Record Nr. | UNINA-9910144964703321 |
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2007 | ||
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Lo trovi qui: Univ. Federico II | ||
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Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th / / Institute of Electrical and Electronics Engineers |
Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2007 |
Descrizione fisica | 1 online resource |
Disciplina | 621.381046 |
Soggetto topico |
Electronic packaging
Microelectronics |
ISBN | 1-5090-9014-2 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Altri titoli varianti |
2007 9th Electronics Packaging Technology Conference
Microoelectronics and Electron Devices |
Record Nr. | UNISA-996215959403316 |
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2007 | ||
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Lo trovi qui: Univ. di Salerno | ||
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EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan : [proceedings |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2005 |
Descrizione fisica | 1 online resource (vi, 301 pages) |
Disciplina | 621.381046 |
Soggetto topico |
Electronic packaging
Electronic packaging - Materials |
ISBN | 1-5090-9955-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996207700303316 |
[Place of publication not identified], : IEEE, 2005 | ||
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Lo trovi qui: Univ. di Salerno | ||
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EMAP 2005 : 2005 International Symposium on Electronics Materials and Packaging : December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan : [proceedings |
Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2005 |
Descrizione fisica | 1 online resource (vi, 301 pages) |
Disciplina | 621.381046 |
Soggetto topico |
Electronic packaging
Electronic packaging - Materials |
ISBN | 1-5090-9955-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910145606203321 |
[Place of publication not identified], : IEEE, 2005 | ||
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Lo trovi qui: Univ. Federico II | ||
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EMPC 2017 : proceedings of the 21st European Microelectronics Packaging Conference :10-13 September 2017, Warsaw, Poland / / Institute of Electrical and Electronics Engineers |
Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
Descrizione fisica | 1 online resource (828 pages) |
Disciplina | 621.381046 |
Soggetto topico |
Electronic packaging
Microelectronics |
ISBN | 0-9568086-4-6 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996279503603316 |
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
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Lo trovi qui: Univ. di Salerno | ||
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EMPC 2017 : proceedings of the 21st European Microelectronics Packaging Conference :10-13 September 2017, Warsaw, Poland / / Institute of Electrical and Electronics Engineers |
Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
Descrizione fisica | 1 online resource (828 pages) |
Disciplina | 621.381046 |
Soggetto topico |
Electronic packaging
Microelectronics |
ISBN | 0-9568086-4-6 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910280935703321 |
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
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Lo trovi qui: Univ. Federico II | ||
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EPEPS : 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems : 15-18 October 2017, San Jose, CA, USA / / Institute of Electrical and Electronics Engineers |
Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2017 |
Descrizione fisica | 1 online resource (698 pages) |
Disciplina | 621.381046 |
Soggetto topico |
Electronic packaging
Materials - Electric properties |
ISBN | 1-5386-3631-X |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNISA-996279510703316 |
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2017 | ||
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Lo trovi qui: Univ. di Salerno | ||
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