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Biblioteca

MARC Lista (tabellare)
Materials and man's needs [[electronic resource] ] : materials science and engineering; summary report
Materials and man's needs [[electronic resource] ] : materials science and engineering; summary report
Pubbl/distr/stampa Washington, : National Academy of Sciences, 1974
Descrizione fisica 1 online resource (247 p.)
Disciplina 620.1/1
Collana Publication
Soggetto topico Materials
Materials - Research
ISBN 1-280-24620-0
9786610246205
0-309-57403-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910826053703321
Washington, : National Academy of Sciences, 1974
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials and structures
Materials and structures
Pubbl/distr/stampa London : , : E. & F.N. Spon, , 1992-
Descrizione fisica 1 online resource
Disciplina 620.1/1
Soggetto topico Dwellings - Remodeling
Materials - Testing
Concrete - Testing
Testing laboratories
Soggetto genere / forma Handbooks and manuals.
Periodicals.
Soggetto non controllato materialen
materials
beton
concrete
fractals
reologische eigenschappen
rheological properties
treksterkte
tensile strength
fysische eigenschappen
physical properties
engineering
Physics (General)
Mechanical and Electronic Engineering
Fysica (algemeen)
Werktuigbouwkunde en elektrotechniek
ISSN 1871-6873
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Record Nr. UNINA-9910135464403321
London : , : E. & F.N. Spon, , 1992-
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials and structures
Materials and structures
Pubbl/distr/stampa London : , : E. & F.N. Spon, , 1992-
Descrizione fisica 1 online resource
Disciplina 620.1/1
Soggetto topico Dwellings - Remodeling
Materials - Testing
Concrete - Testing
Testing laboratories
Soggetto genere / forma Handbooks and manuals.
Periodicals.
Soggetto non controllato materialen
materials
beton
concrete
fractals
reologische eigenschappen
rheological properties
treksterkte
tensile strength
fysische eigenschappen
physical properties
engineering
Physics (General)
Mechanical and Electronic Engineering
Fysica (algemeen)
Werktuigbouwkunde en elektrotechniek
ISSN 1871-6873
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Record Nr. UNISA-996204168203316
London : , : E. & F.N. Spon, , 1992-
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Autore Leng Y (Yang)
Edizione [2nd ed.]
Pubbl/distr/stampa Weinheim, : J. Wiley, c2013
Descrizione fisica xiv, 376 p. : ill
Disciplina 620.1/1
Soggetto topico Materials - Analysis
Materials
ISBN 9783527670802
3527670807
9783527670772
Classificazione 501.4
620.11
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910796092403321
Leng Y (Yang)  
Weinheim, : J. Wiley, c2013
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials characterization : introduction to microscopic and spectroscopic methods / / Yang Leng
Materials characterization : introduction to microscopic and spectroscopic methods / / Yang Leng
Autore Leng Y (Yang)
Edizione [2nd ed.]
Pubbl/distr/stampa Weinheim, : J. Wiley, c2013
Descrizione fisica xiv, 376 p. : ill
Disciplina 620.1/1
Soggetto topico Materials - Analysis
Materials
ISBN 9783527670802
3527670807
9783527670772
Classificazione 501.4
620.11
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Intro -- Materials Characterization -- Contents -- 1 Light Microscopy -- 1.1 Optical Principles -- 1.1.1 Image Formation -- 1.1.2 Resolution -- 1.1.2.1 Effective Magnification -- 1.1.2.2 Brightness and Contrast -- 1.1.3 Depth of Field -- 1.1.4 Aberrations -- 1.2 Instrumentation -- 1.2.1 Illumination System -- 1.2.2 Objective Lens and Eyepiece -- 1.2.2.1 Steps for Optimum Resolution -- 1.2.2.2 Steps to Improve Depth of Field -- 1.3 Specimen Preparation -- 1.3.1 Sectioning -- 1.3.1.1 Cutting -- 1.3.1.2 Microtomy -- 1.3.2 Mounting -- 1.3.3 Grinding and Polishing -- 1.3.3.1 Grinding -- 1.3.3.2 Polishing -- 1.3.4 Etching -- 1.4 Imaging Modes -- 1.4.1 Bright-Field and Dark-Field Imaging -- 1.4.2 Phase-Contrast Microscopy -- 1.4.3 Polarized-Light Microscopy -- 1.4.4 Nomarski Microscopy -- 1.4.5 Fluorescence Microscopy -- 1.5 Confocal Microscopy -- 1.5.1 Working Principles -- 1.5.2 Three-Dimensional Images -- References -- Further Reading -- 2 X-Ray Diffraction Methods -- 2.1 X-Ray Radiation -- 2.1.1 Generation of X-Rays -- 2.1.2 X-Ray Absorption -- 2.2 Theoretical Background of Diffraction -- 2.2.1 Diffraction Geometry -- 2.2.1.1 Bragg's Law -- 2.2.1.2 Reciprocal Lattice -- 2.2.1.3 Ewald Sphere -- 2.2.2 Diffraction Intensity -- 2.2.2.1 Structure Extinction -- 2.3 X-Ray Diffractometry -- 2.3.1 Instrumentation -- 2.3.1.1 System Aberrations -- 2.3.2 Samples and Data Acquisition -- 2.3.2.1 Sample Preparation -- 2.3.2.2 Acquisition and Treatment of Diffraction Data -- 2.3.3 Distortions of Diffraction Spectra -- 2.3.3.1 Preferential Orientation -- 2.3.3.2 Crystallite Size -- 2.3.3.3 Residual Stress -- 2.3.4 Applications -- 2.3.4.1 Crystal-Phase Identification -- 2.3.4.2 Quantitative Measurement -- 2.4 Wide-Angle X-Ray Diffraction and Scattering -- 2.4.1 Wide-Angle Diffraction -- 2.4.2 Wide-Angle Scattering -- References -- Further Reading.
3 Transmission Electron Microscopy -- 3.1 Instrumentation -- 3.1.1 Electron Sources -- 3.1.1.1 Thermionic Emission Gun -- 3.1.1.2 Field Emission Gun -- 3.1.2 Electromagnetic Lenses -- 3.1.3 Specimen Stage -- 3.2 Specimen Preparation -- 3.2.1 Prethinning -- 3.2.2 Final Thinning -- 3.2.2.1 Electrolytic Thinning -- 3.2.2.2 Ion Milling -- 3.2.2.3 Ultramicrotomy -- 3.3 Image Modes -- 3.3.1 Mass-Density Contrast -- 3.3.2 Diffraction Contrast -- 3.3.3 Phase Contrast -- 3.3.3.1 Theoretical Aspects -- 3.3.3.2 Two-Beam and Multiple-Beam Imaging -- 3.4 Selected-Area Diffraction (SAD) -- 3.4.1 Selected-Area Diffraction Characteristics -- 3.4.2 Single-Crystal Diffraction -- 3.4.2.1 Indexing a Cubic Crystal Pattern -- 3.4.2.2 Identification of Crystal Phases -- 3.4.3 Multicrystal Diffraction -- 3.4.4 Kikuchi Lines -- 3.5 Images of Crystal Defects -- 3.5.1 Wedge Fringe -- 3.5.2 Bending Contours -- 3.5.3 Dislocations -- References -- Further Reading -- 4 Scanning Electron Microscopy -- 4.1 Instrumentation -- 4.1.1 Optical Arrangement -- 4.1.2 Signal Detection -- 4.1.2.1 Detector -- 4.1.3 Probe Size and Current -- 4.2 Contrast Formation -- 4.2.1 Electron-Specimen Interactions -- 4.2.2 Topographic Contrast -- 4.2.3 Compositional Contrast -- 4.3 Operational Variables -- 4.3.1 Working Distance and Aperture Size -- 4.3.2 Acceleration Voltage and Probe Current -- 4.3.3 Astigmatism -- 4.4 Specimen Preparation -- 4.4.1 Preparation for Topographic Examination -- 4.4.1.1 Charging and Its Prevention -- 4.4.2 Preparation for Microcomposition Examination -- 4.4.3 Dehydration -- 4.5 Electron Backscatter Diffraction -- 4.5.1 EBSD Pattern Formation -- 4.5.2 EBSD Indexing and Its Automation -- 4.5.3 Applications of EBSD -- 4.6 Environmental SEM -- 4.6.1 ESEM Working Principle -- 4.6.2 Applications -- References -- Further Reading -- 5 Scanning Probe Microscopy -- 5.1 Instrumentation.
5.1.1 Probe and Scanner -- 5.1.2 Control and Vibration Isolation -- 5.2 Scanning Tunneling Microscopy -- 5.2.1 Tunneling Current -- 5.2.2 Probe Tips and Working Environments -- 5.2.3 Operational Modes -- 5.2.4 Typical Applications -- 5.3 Atomic Force Microscopy -- 5.3.1 Near-Field Forces -- 5.3.1.1 Short-Range Forces -- 5.3.1.2 van der Waals Forces -- 5.3.1.3 Electrostatic Forces -- 5.3.1.4 Capillary Forces -- 5.3.2 Force Sensors -- 5.3.3 Operational Modes -- 5.3.3.1 Static Contact Modes -- 5.3.3.2 Lateral Force Microscopy -- 5.3.3.3 Dynamic Operational Modes -- 5.3.4 Typical Applications -- 5.3.4.1 Static Mode -- 5.3.4.2 Dynamic Noncontact Mode -- 5.3.4.3 Tapping Mode -- 5.3.4.4 Force Modulation -- 5.4 Image Artifacts -- 5.4.1 Tip -- 5.4.2 Scanner -- 5.4.3 Vibration and Operation -- References -- Further Reading -- 6 X-Ray Spectroscopy for Elemental Analysis -- 6.1 Features of Characteristic X-Rays -- 6.1.1 Types of Characteristic X-Rays -- 6.1.1.1 Selection Rules -- 6.1.2 Comparison of K, L, and M Series -- 6.2 X-Ray Fluorescence Spectrometry -- 6.2.1 Wavelength Dispersive Spectroscopy -- 6.2.1.1 Analyzing Crystal -- 6.2.1.2 Wavelength Dispersive Spectra -- 6.2.2 Energy Dispersive Spectroscopy -- 6.2.2.1 Detector -- 6.2.2.2 Energy Dispersive Spectra -- 6.2.2.3 Advances in Energy Dispersive Spectroscopy -- 6.2.3 XRF Working Atmosphere and Sample Preparation -- 6.3 Energy Dispersive Spectroscopy in Electron Microscopes -- 6.3.1 Special Features -- 6.3.2 Scanning Modes -- 6.4 Qualitative and Quantitative Analysis -- 6.4.1 Qualitative Analysis -- 6.4.2 Quantitative Analysis -- 6.4.2.1 Quantitative Analysis by X-Ray Fluorescence -- 6.4.2.2 Fundamental Parameter Method -- 6.4.2.3 Quantitative Analysis in Electron Microscopy -- References -- Further Reading -- 7 Electron Spectroscopy for Surface Analysis -- 7.1 Basic Principles.
7.1.1 X-Ray Photoelectron Spectroscopy -- 7.1.2 Auger Electron Spectroscopy -- 7.2 Instrumentation -- 7.2.1 Ultrahigh Vacuum System -- 7.2.2 Source Guns -- 7.2.2.1 X-Ray Gun -- 7.2.2.2 Electron Gun -- 7.2.2.3 Ion Gun -- 7.2.3 Electron Energy Analyzers -- 7.3 Characteristics of Electron Spectra -- 7.3.1 Photoelectron Spectra -- 7.3.2 Auger Electron Spectra -- 7.4 Qualitative and Quantitative Analysis -- 7.4.1 Qualitative Analysis -- 7.4.1.1 Peak Identification -- 7.4.1.2 Chemical Shifts -- 7.4.1.3 Problems with Insulating Materials -- 7.4.2 Quantitative Analysis -- 7.4.2.1 Peaks and Sensitivity Factors -- 7.4.3 Composition Depth Profiling -- References -- Further Reading -- 8 Secondary Ion Mass Spectrometry for Surface Analysis -- 8.1 Basic Principles -- 8.1.1 Secondary Ion Generation -- 8.1.2 Dynamic and Static SIMS -- 8.2 Instrumentation -- 8.2.1 Primary Ion System -- 8.2.1.1 Ion Sources -- 8.2.1.2 Wien Filter -- 8.2.2 Mass Analysis System -- 8.2.2.1 Magnetic Sector Analyzer -- 8.2.2.2 Quadrupole Mass Analyzer -- 8.2.2.3 Time-of-Flight Analyzer -- 8.3 Surface Structure Analysis -- 8.3.1 Experimental Aspects -- 8.3.1.1 Primary Ions -- 8.3.1.2 Flood Gun -- 8.3.1.3 Sample Handling -- 8.3.2 Spectrum Interpretation -- 8.3.2.1 Element Identification -- 8.4 SIMS Imaging -- 8.4.1 Generation of SIMS Images -- 8.4.2 Image Quality -- 8.5 SIMS Depth Profiling -- 8.5.1 Generation of Depth Profiles -- 8.5.2 Optimization of Depth Profiling -- 8.5.2.1 Primary Beam Energy -- 8.5.2.2 Incident Angle of Primary Beam -- 8.5.2.3 Analysis Area -- References -- 9 Vibrational Spectroscopy for Molecular Analysis -- 9.1 Theoretical Background -- 9.1.1 Electromagnetic Radiation -- 9.1.2 Origin of Molecular Vibrations -- 9.1.3 Principles of Vibrational Spectroscopy -- 9.1.3.1 Infrared Absorption -- 9.1.3.2 Raman Scattering -- 9.1.4 Normal Mode of Molecular Vibrations.
9.1.4.1 Number of Normal Vibration Modes -- 9.1.4.2 Classification of Normal Vibration Modes -- 9.1.5 Infrared and Raman Activity -- 9.1.5.1 Infrared Activity -- 9.1.5.2 Raman Activity -- 9.2 Fourier Transform Infrared Spectroscopy -- 9.2.1 Working Principles -- 9.2.2 Instrumentation -- 9.2.2.1 Infrared Light Source -- 9.2.2.2 Beamsplitter -- 9.2.2.3 Infrared Detector -- 9.2.2.4 Fourier Transform Infrared Spectra -- 9.2.3 Examination Techniques -- 9.2.3.1 Transmittance -- 9.2.3.2 Solid Sample Preparation -- 9.2.3.3 Liquid and Gas Sample Preparation -- 9.2.3.4 Reflectance -- 9.2.4 Fourier Transform Infrared Microspectroscopy -- 9.2.4.1 Instrumentation -- 9.2.4.2 Applications -- 9.3 Raman Microscopy -- 9.3.1 Instrumentation -- 9.3.1.1 Laser Source -- 9.3.1.2 Microscope System -- 9.3.1.3 Prefilters -- 9.3.1.4 Diffraction Grating -- 9.3.1.5 Detector -- 9.3.2 Fluorescence Problem -- 9.3.3 Raman Imaging -- 9.3.4 Applications -- 9.3.4.1 Phase Identification -- 9.3.4.2 Polymer Identification -- 9.3.4.3 Composition Determination -- 9.3.4.4 Determination of Residual Strain -- 9.3.4.5 Determination of Crystallographic Orientation -- 9.4 Interpretation of Vibrational Spectra -- 9.4.1 Qualitative Methods -- 9.4.1.1 Spectrum Comparison -- 9.4.1.2 Identifying Characteristic Bands -- 9.4.1.3 Band Intensities -- 9.4.2 Quantitative Methods -- 9.4.2.1 Quantitative Analysis of Infrared Spectra -- 9.4.2.2 Quantitative Analysis of Raman Spectra -- References -- Further Reading -- 10 Thermal Analysis -- 10.1 Common Characteristics -- 10.1.1 Thermal Events -- 10.1.1.1 Enthalpy Change -- 10.1.2 Instrumentation -- 10.1.3 Experimental Parameters -- 10.2 Differential Thermal Analysis and Differential Scanning Calorimetry -- 10.2.1 Working Principles -- 10.2.1.1 Differential Thermal Analysis -- 10.2.1.2 Differential Scanning Calorimetry.
10.2.1.3 Temperature-Modulated Differential Scanning Calorimetry.
Record Nr. UNINA-9910822761803321
Leng Y (Yang)  
Weinheim, : J. Wiley, c2013
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Autore Leng Y (Yang)
Pubbl/distr/stampa Singapore ; ; Hoboken, NJ, : J. Wiley, c2008
Descrizione fisica 1 online resource (351 p.)
Disciplina 620.1/1
620.11
620.1127
Soggetto topico Materials
Materials - Analysis
ISBN 9786612031403
0-470-82299-6
0-470-82300-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto MATERIALS CHARACTERIZATION Introduction to Microscopic and Spectroscopic Methods; Contents; Preface; 1 Light Microscopy; 1.1 Optical Principles; 1.1.1 Image Formation; 1.1.2 Resolution; 1.1.3 Depth of Field; 1.1.4 Aberrations; 1.2 Instrumentation; 1.2.1 Illumination System; 1.2.2 Objective Lens and Eyepiece; 1.3 Specimen Preparation; 1.3.1 Sectioning; 1.3.2 Mounting; 1.3.3 Grinding and Polishing; 1.3.4 Etching; 1.4 Imaging Modes; 1.4.1 Bright-Field and Dark-Field Imaging; 1.4.2 Phase Contrast Microscopy; 1.4.3 Polarized Light Microscopy; 1.4.4 Nomarski Microscopy
1.4.5 Fluorescence Microscopy1.5 Confocal Microscopy; 1.5.1 Working Principles; 1.5.2 Three-Dimensional Images; References; Questions; 2 X-ray Diffraction Methods; 2.1 X-ray Radiation; 2.1.1 Generation of X-rays; 2.1.2 X-ray Absorption; 2.2 Theoretical Background of Diffraction; 2.2.1 Diffraction Geometry; 2.2.2 Diffraction Intensity; 2.3 X-ray Diffractometry; 2.3.1 Instrumentation; 2.3.2 Samples and Data Acquisition; 2.3.3 Distortions of Diffraction Spectra; 2.3.4 Applications; 2.4 Wide Angle X-ray Diffraction and Scattering; 2.4.1 Wide Angle Diffraction; 2.4.2 Wide Angle Scattering
ReferencesQuestions; 3 Transmission Electron Microscopy; 3.1 Instrumentation; 3.1.1 Electron Sources; 3.1.2 Electromagnetic Lenses; 3.1.3 Specimen Stage; 3.2 Specimen Preparation; 3.2.1 Pre-Thinning; 3.2.2 Final Thinning; 3.3 Image Modes; 3.3.1 Mass-Density Contrast; 3.3.2 Diffraction Contrast; 3.3.3 Phase Contrast; 3.4 Selected Area Diffraction; 3.4.1 Selected Area Diffraction Characteristics; 3.4.2 Single-Crystal Diffraction; 3.4.3 Multi-Crystal Diffraction; 3.4.4 Kikuchi Lines; 3.5 Images of Crystal Defects; 3.5.1 Wedge Fringe; 3.5.2 Bending Contours; 3.5.3 Dislocations; References
Questions4 Scanning Electron Microscopy; 4.1 Instrumentation; 4.1.1 Optical Arrangement; 4.1.2 Signal Detection; 4.1.3 Probe Size and Current; 4.2 Contrast Formation; 4.2.1 ElectronSpecimen Interactions; 4.2.2 Topographic Contrast; 4.2.3 Compositional Contrast; 4.3 Operational Variables; 4.3.1 Working Distance and Aperture Size; 4.3.2 Acceleration Voltage and Probe Current; 4.3.3 Astigmatism; 4.4 Specimen Preparation; 4.4.1 Preparation for Topographic Examination; 4.4.2 Preparation for Micro-Composition Examination; 4.4.3 Dehydration; References; Questions; 5 Scanning Probe Microscopy
5.1 Instrumentation5.1.1 Probe and Scanner; 5.1.2 Control and Vibration Isolation; 5.2 Scanning Tunneling Microscopy; 5.2.1 Tunneling Current; 5.2.2 Probe Tips and Working Environments; 5.2.3 Operational Modes; 5.2.4 Typical Applications; 5.3 Atomic Force Microscopy; 5.3.1 Near-Field Forces; 5.3.2 Force Sensors; 5.3.3 Operational Modes; 5.3.4 Typical Applications; 5.4 Image Artifacts; 5.4.1 Tip; 5.4.2 Scanner; 5.4.3 Vibration and Operation; References; Questions; 6 X-ray Spectroscopy for Elemental Analysis; 6.1 Features of Characteristic X-rays; 6.1.1 Types of Characteristic X-rays
6.1.2 Comparison ofK,L andM Series
Record Nr. UNINA-9910139934303321
Leng Y (Yang)  
Singapore ; ; Hoboken, NJ, : J. Wiley, c2008
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Autore Leng Y (Yang)
Pubbl/distr/stampa Singapore ; ; Hoboken, NJ, : J. Wiley, c2008
Descrizione fisica 1 online resource (351 p.)
Disciplina 620.1/1
620.11
620.1127
Soggetto topico Materials
Materials - Analysis
ISBN 9786612031403
0-470-82299-6
0-470-82300-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto MATERIALS CHARACTERIZATION Introduction to Microscopic and Spectroscopic Methods; Contents; Preface; 1 Light Microscopy; 1.1 Optical Principles; 1.1.1 Image Formation; 1.1.2 Resolution; 1.1.3 Depth of Field; 1.1.4 Aberrations; 1.2 Instrumentation; 1.2.1 Illumination System; 1.2.2 Objective Lens and Eyepiece; 1.3 Specimen Preparation; 1.3.1 Sectioning; 1.3.2 Mounting; 1.3.3 Grinding and Polishing; 1.3.4 Etching; 1.4 Imaging Modes; 1.4.1 Bright-Field and Dark-Field Imaging; 1.4.2 Phase Contrast Microscopy; 1.4.3 Polarized Light Microscopy; 1.4.4 Nomarski Microscopy
1.4.5 Fluorescence Microscopy1.5 Confocal Microscopy; 1.5.1 Working Principles; 1.5.2 Three-Dimensional Images; References; Questions; 2 X-ray Diffraction Methods; 2.1 X-ray Radiation; 2.1.1 Generation of X-rays; 2.1.2 X-ray Absorption; 2.2 Theoretical Background of Diffraction; 2.2.1 Diffraction Geometry; 2.2.2 Diffraction Intensity; 2.3 X-ray Diffractometry; 2.3.1 Instrumentation; 2.3.2 Samples and Data Acquisition; 2.3.3 Distortions of Diffraction Spectra; 2.3.4 Applications; 2.4 Wide Angle X-ray Diffraction and Scattering; 2.4.1 Wide Angle Diffraction; 2.4.2 Wide Angle Scattering
ReferencesQuestions; 3 Transmission Electron Microscopy; 3.1 Instrumentation; 3.1.1 Electron Sources; 3.1.2 Electromagnetic Lenses; 3.1.3 Specimen Stage; 3.2 Specimen Preparation; 3.2.1 Pre-Thinning; 3.2.2 Final Thinning; 3.3 Image Modes; 3.3.1 Mass-Density Contrast; 3.3.2 Diffraction Contrast; 3.3.3 Phase Contrast; 3.4 Selected Area Diffraction; 3.4.1 Selected Area Diffraction Characteristics; 3.4.2 Single-Crystal Diffraction; 3.4.3 Multi-Crystal Diffraction; 3.4.4 Kikuchi Lines; 3.5 Images of Crystal Defects; 3.5.1 Wedge Fringe; 3.5.2 Bending Contours; 3.5.3 Dislocations; References
Questions4 Scanning Electron Microscopy; 4.1 Instrumentation; 4.1.1 Optical Arrangement; 4.1.2 Signal Detection; 4.1.3 Probe Size and Current; 4.2 Contrast Formation; 4.2.1 ElectronSpecimen Interactions; 4.2.2 Topographic Contrast; 4.2.3 Compositional Contrast; 4.3 Operational Variables; 4.3.1 Working Distance and Aperture Size; 4.3.2 Acceleration Voltage and Probe Current; 4.3.3 Astigmatism; 4.4 Specimen Preparation; 4.4.1 Preparation for Topographic Examination; 4.4.2 Preparation for Micro-Composition Examination; 4.4.3 Dehydration; References; Questions; 5 Scanning Probe Microscopy
5.1 Instrumentation5.1.1 Probe and Scanner; 5.1.2 Control and Vibration Isolation; 5.2 Scanning Tunneling Microscopy; 5.2.1 Tunneling Current; 5.2.2 Probe Tips and Working Environments; 5.2.3 Operational Modes; 5.2.4 Typical Applications; 5.3 Atomic Force Microscopy; 5.3.1 Near-Field Forces; 5.3.2 Force Sensors; 5.3.3 Operational Modes; 5.3.4 Typical Applications; 5.4 Image Artifacts; 5.4.1 Tip; 5.4.2 Scanner; 5.4.3 Vibration and Operation; References; Questions; 6 X-ray Spectroscopy for Elemental Analysis; 6.1 Features of Characteristic X-rays; 6.1.1 Types of Characteristic X-rays
6.1.2 Comparison ofK,L andM Series
Record Nr. UNINA-9910830184903321
Leng Y (Yang)  
Singapore ; ; Hoboken, NJ, : J. Wiley, c2008
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
Autore Leng Y (Yang)
Pubbl/distr/stampa Singapore ; ; Hoboken, NJ, : J. Wiley, c2008
Descrizione fisica 1 online resource (351 p.)
Disciplina 620.1/1
620.11
620.1127
Soggetto topico Materials
Materials - Analysis
ISBN 9786612031403
0-470-82299-6
0-470-82300-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto MATERIALS CHARACTERIZATION Introduction to Microscopic and Spectroscopic Methods; Contents; Preface; 1 Light Microscopy; 1.1 Optical Principles; 1.1.1 Image Formation; 1.1.2 Resolution; 1.1.3 Depth of Field; 1.1.4 Aberrations; 1.2 Instrumentation; 1.2.1 Illumination System; 1.2.2 Objective Lens and Eyepiece; 1.3 Specimen Preparation; 1.3.1 Sectioning; 1.3.2 Mounting; 1.3.3 Grinding and Polishing; 1.3.4 Etching; 1.4 Imaging Modes; 1.4.1 Bright-Field and Dark-Field Imaging; 1.4.2 Phase Contrast Microscopy; 1.4.3 Polarized Light Microscopy; 1.4.4 Nomarski Microscopy
1.4.5 Fluorescence Microscopy1.5 Confocal Microscopy; 1.5.1 Working Principles; 1.5.2 Three-Dimensional Images; References; Questions; 2 X-ray Diffraction Methods; 2.1 X-ray Radiation; 2.1.1 Generation of X-rays; 2.1.2 X-ray Absorption; 2.2 Theoretical Background of Diffraction; 2.2.1 Diffraction Geometry; 2.2.2 Diffraction Intensity; 2.3 X-ray Diffractometry; 2.3.1 Instrumentation; 2.3.2 Samples and Data Acquisition; 2.3.3 Distortions of Diffraction Spectra; 2.3.4 Applications; 2.4 Wide Angle X-ray Diffraction and Scattering; 2.4.1 Wide Angle Diffraction; 2.4.2 Wide Angle Scattering
ReferencesQuestions; 3 Transmission Electron Microscopy; 3.1 Instrumentation; 3.1.1 Electron Sources; 3.1.2 Electromagnetic Lenses; 3.1.3 Specimen Stage; 3.2 Specimen Preparation; 3.2.1 Pre-Thinning; 3.2.2 Final Thinning; 3.3 Image Modes; 3.3.1 Mass-Density Contrast; 3.3.2 Diffraction Contrast; 3.3.3 Phase Contrast; 3.4 Selected Area Diffraction; 3.4.1 Selected Area Diffraction Characteristics; 3.4.2 Single-Crystal Diffraction; 3.4.3 Multi-Crystal Diffraction; 3.4.4 Kikuchi Lines; 3.5 Images of Crystal Defects; 3.5.1 Wedge Fringe; 3.5.2 Bending Contours; 3.5.3 Dislocations; References
Questions4 Scanning Electron Microscopy; 4.1 Instrumentation; 4.1.1 Optical Arrangement; 4.1.2 Signal Detection; 4.1.3 Probe Size and Current; 4.2 Contrast Formation; 4.2.1 ElectronSpecimen Interactions; 4.2.2 Topographic Contrast; 4.2.3 Compositional Contrast; 4.3 Operational Variables; 4.3.1 Working Distance and Aperture Size; 4.3.2 Acceleration Voltage and Probe Current; 4.3.3 Astigmatism; 4.4 Specimen Preparation; 4.4.1 Preparation for Topographic Examination; 4.4.2 Preparation for Micro-Composition Examination; 4.4.3 Dehydration; References; Questions; 5 Scanning Probe Microscopy
5.1 Instrumentation5.1.1 Probe and Scanner; 5.1.2 Control and Vibration Isolation; 5.2 Scanning Tunneling Microscopy; 5.2.1 Tunneling Current; 5.2.2 Probe Tips and Working Environments; 5.2.3 Operational Modes; 5.2.4 Typical Applications; 5.3 Atomic Force Microscopy; 5.3.1 Near-Field Forces; 5.3.2 Force Sensors; 5.3.3 Operational Modes; 5.3.4 Typical Applications; 5.4 Image Artifacts; 5.4.1 Tip; 5.4.2 Scanner; 5.4.3 Vibration and Operation; References; Questions; 6 X-ray Spectroscopy for Elemental Analysis; 6.1 Features of Characteristic X-rays; 6.1.1 Types of Characteristic X-rays
6.1.2 Comparison ofK,L andM Series
Record Nr. UNINA-9910841618903321
Leng Y (Yang)  
Singapore ; ; Hoboken, NJ, : J. Wiley, c2008
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials in a new era [[electronic resource] ] : proceedings of the 1999 Solid State Sciences Committee Forum / / Solid State Sciences Committee, Board on Physics and Astronomy, Commission on Physical Sciences, Mathematics, and Applications, National Research Council
Materials in a new era [[electronic resource] ] : proceedings of the 1999 Solid State Sciences Committee Forum / / Solid State Sciences Committee, Board on Physics and Astronomy, Commission on Physical Sciences, Mathematics, and Applications, National Research Council
Pubbl/distr/stampa Washington, D.C., : National Academy Press, c1999
Descrizione fisica 1 online resource (63 p.)
Disciplina 620.1/1
Collana Compass series (Washington, D.C.)
Soggetto topico Materials science
Materials - Research
Solid state physics
Soggetto genere / forma Electronic books.
ISBN 0-309-51584-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910456158003321
Washington, D.C., : National Academy Press, c1999
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Materials in a new era [[electronic resource] ] : proceedings of the 1999 Solid State Sciences Committee Forum / / Solid State Sciences Committee, Board on Physics and Astronomy, Commission on Physical Sciences, Mathematics, and Applications, National Research Council
Materials in a new era [[electronic resource] ] : proceedings of the 1999 Solid State Sciences Committee Forum / / Solid State Sciences Committee, Board on Physics and Astronomy, Commission on Physical Sciences, Mathematics, and Applications, National Research Council
Pubbl/distr/stampa Washington, D.C., : National Academy Press, c1999
Descrizione fisica 1 online resource (63 p.)
Disciplina 620.1/1
Collana Compass series (Washington, D.C.)
Soggetto topico Materials science
Materials - Research
Solid state physics
ISBN 0-309-17240-3
0-309-51584-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910778749803321
Washington, D.C., : National Academy Press, c1999
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui