Chemical bonding technology [[electronic resource] ] : direct investigation of interfacial bonds / / J.L. Koenig ... [and others]
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| Titolo: |
Chemical bonding technology [[electronic resource] ] : direct investigation of interfacial bonds / / J.L. Koenig ... [and others]
|
| Pubblicazione: | Pasadena, Calif. : , : National Aeronautics and Space Administration, Jet Propulsion Laboratory, , [1986] |
| Descrizione fisica: | 1 online resource (x, 44 pages) : illustrations |
| Soggetto topico: | Chemical bonds |
| Delaminating | |
| Electronic modules | |
| Encapsulating | |
| Flat plates | |
| Interfaces | |
| Silicones | |
| Solar arrays | |
| Altri autori: |
KoenigJean-Louis
|
| Note generali: | Title from title screen (viewed on Dec. 22, 2011). |
| "January 1986." | |
| "Prepared for U.S. Department of Energy through an agreement with National Aeronautics and Space Administration by Jet Propulsion Laboratory, California Institute of Technology, Pasadena, California." | |
| "DOE/JPL-1012-120." | |
| JPL Publication 86-6." | |
| Nota di bibliografia: | Includes bibliographical references (pages 43-44). |
| Altri titoli varianti: | Chemical bonding technology |
| Titolo autorizzato: | Chemical bonding technology |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910701202203321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |